Abstract: A method (and system) includes retrieving a dataset from a database creating a report including a graphical representation of the dataset, the graphical representation of the dataset including a freely positionable and scalable data container and displaying the report on a graphical user interface. The report has a free-form layout in which each container is freely positionable and is freely scalable such that a change in size and/or location of one container does not affect a size and/or location of any other container in the report.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for providing dynamic in-context information is disclosed.

Abstract: A method includes identifying a cell in the layout diagram as a violated cell that fails to pass one or more design rules related to IR drops, and classifying a root cause of the violated cell with a root cause class. The method also includes determining a searching area for searching safe region candidates, and finding a selected cell for moving based upon the root cause class of the root cause. The method further includes finding a safe region in the searching area for moving the selected cell, and moving the selected cell to the safe region if the safe region is found within the searching area.

Abstract: A packaged LED device comprising: a pad-extended LED chip comprising: at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer; a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer; and a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad.

Abstract: Disclosed are methods, systems, and computer-readable medium for dynamically displaying database containers. A container including content and a minimum display size for the document may be received. The display size of the document may be monitored. A determination that the display size of the document is less than the minimum display size may be made. A visible section and a hidden section of the document may be determined based on the display size. The visible section of the document may be displayed. A scroll feature may be activated based on a hidden section size. An indication to scroll the document in a scroll direction may be received. The visible section may be updated to an updated visible section that includes at least a portion of the hidden section. The updated visible section of the document may be displayed via the display.

Abstract: The present invention relates to a fiber-containing structure comprising an interwoven and welded base material and a welded elastomer layer, and at least one part of the base material and the welded elastomer layer are welded to each other. The invention also relates to a method for manufacturing the fiber-containing structure and a shoe structure containing the fiber-containing structure.

Abstract: Disclosed is a color emissive LED array having a substantially flat backplane which has circuitry. The color emissive LED array includes a plurality of multi thickness color emissive LED units disposed in an array on the substantially flat backplane; The plurality of multi thickness color emissive LED units have a thickness of the first color emissive LED unit is less than a thickness of the second color emissive LED unit and less than a thickness of the third color emissive LED unit. Meanwhile, the substantially flat backplane having circuitry has one or more anode and one or more cathode. Further, the array is attached to the substantially flat backplane having circuitry by using a jointing layer.

Abstract: Disclosed are methods, systems, and computer-readable medium for dynamically displaying database containers. A container including content and a minimum display size for the document may be received. The display size of the document may be monitored. A determination that the display size of the document is less than the minimum display size may be made. A visible section and a hidden section of the document may be determined based on the display size. The visible section of the document may be displayed. A scroll feature may be activated based on a hidden section size. An indication to scroll the document in a scroll direction may be received. The visible section may be updated to an updated visible section that includes at least a portion of the hidden section. The updated visible section of the document may be displayed via the display.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30]. The method also includes the steps of providing a receiving plate [42] having an elastomeric polymer layer [44], placing the substrate [30] and the receiving plate [42] in close proximity with a gap [101] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [30] to the semiconductor layer [50] at an interface with the substrate [30] to lift off the semiconductor structures [32] through the gap [101] onto the elastomeric polymer layer [44]. During the laser lift-off (LLO) process the elastomeric polymer layer [44] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [32] in place on the receiving plate [42].

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate. The method also includes forming an etchable covering channel layer on the isolation layer, forming a patterning protection layer on the covering channel layer, forming etching channels in the covering channel layer using a first etching process, and removing the corners of the isolation layer by etching the isolation layer using a second etching process. Following the second etching process the isolation layer covers the sidewall P-N junctions. The method can also include bonding the growth substrate to a carrier and separating the growth substrate from the light emitting diode (LED) structures using a laser lift off (LLO) process.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A computer-implemented method and system for determining a path arrangement of an infrastructure link. The method includes receiving one or more inputs each indicative of a constraint; and processing the one or more inputs and a set of data based on a path arrangement determination model. The set of data includes data representing one or more factors affecting the path arrangement. The method also includes determining, based on the processing, the path arrangement of the infrastructure link.

Abstract: Disclosed are methods, systems, and computer-readable medium for dynamically displaying database containers. A display packet including a first container and a second container may be received for display via a document. A display indication including a first display requirement for the first container and a second display requirement for the second container may be received. A display size of the document may be determined. A display status may be determined based on the display size, the display status corresponding to one of being greater than a breakpoint or being less than or equal to the breakpoint. The first container and the second container may be provided to the document. A determination may be made, based on the display status and the display indication, to hide the first container and display the second container. The second container may be displayed via the document while hiding the first container.

Abstract: A computer-implemented method and system for determining a path arrangement of an infrastructure link. The method includes receiving one or more inputs each indicative of a constraint; and processing the one or more inputs and a set of data based on a path arrangement determination model. The set of data includes data representing one or more factors affecting the path arrangement. The method also includes determining, based on the processing, the path arrangement of the infrastructure link.