Patents by Inventor Fu Lin

Fu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9397189
    Abstract: A method of forming a semiconductor structure having a metal gate. Firstly, a semiconductor substrate is provided. Subsequently, at least a gate structure is formed on the semiconductor substrate. Afterwards, a spacer structure is formed to surround the gate structure. Then, an interlayer dielectric is formed. Afterwards, a planarization process is performed for the interlayer dielectric. Then, a portion of the sacrificial layer is removed to form an initial etching depth, such that an opening is formed to expose a portion of the spacer structure. The portion of the spacer structure exposed to the opening is removed so as to broaden the opening. Afterwards, remove the sacrificial layer completely via the opening. Finally, a gate conductive layer is formed to fill the opening.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: July 19, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Wei Chen, Nien-Ting Ho, Chien-Chung Huang, Chin-Fu Lin
  • Patent number: 9382753
    Abstract: A window covering includes a liner positioned adjacent to the rear side of window covering material. The liner is attached to at least one of the window covering material and a first rail to define at least one cavity between the window covering material and the liner. At least one ladder is attached to the liner and positioned in the at least one cavity. The at least one ladder has vertically spaced rungs. At least one lift cord extends from the first rail to a position adjacent to the bottom edge of the window covering material. The at least one cord passes adjacent to the at least one ladder such that the at least one lift cord passes over the rungs of the at least one ladder such that the at least one lift cord alternates from passing behind and in front of successive rungs.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: July 5, 2016
    Assignee: Whole Space Industries LTD
    Inventor: Tzong-Fu Lin
  • Publication number: 20160178134
    Abstract: A plastic lamp base includes an insulated body defining therein an enabling channel which extends from a bottom end thereof. Also, the insulated body defines therein an auxiliary channel which extends from a mounting end thereof to communicate with the enabling channel. The enabling channel and the auxiliary channel are filled with a conductive plastic to form a zigzag electrical conductor, which has one end exposed at the bottom end of the insulated body and has an opposite end exposed at the mounting end of the insulated body and electrically connected to one contact of an LED component. A ground electrical conductor, being electrically insulated from the zigzag electrical conductor, has one end exposed at the outer surface of the insulated body and has an opposite end exposed at the mounting end of the insulated body and electrically connected to the other contact of the LED component.
    Type: Application
    Filed: December 3, 2015
    Publication date: June 23, 2016
    Inventors: Jung-Ya Hsieh, Yung-Fu Lin, Yuan-Hsin Chang
  • Patent number: 9368467
    Abstract: A substrate structure is provided, including a substrate body and a plurality of circuits formed on the substrate body. At least one of the circuits has an electrical contact for connecting to an external element and the electrical contact is narrower in width than the circuit, thereby meeting the requirements of fine line/fine pitch and miniaturization, improving the product yield and reducing the fabrication cost.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: June 14, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chang-Fu Lin, Ho-Yi Tsai, Chin-Tsai Yao
  • Patent number: 9365942
    Abstract: An electrolytic copper foil is provided. The electrolytic copper foil has a shiny side and a matte side opposing to the shiny side, wherein the difference in roughness between the shiny side and the matte side is 0.5 ?m or less. The electrolytic copper foil has a tensile strength of 45 kg/mm2 or above, and is particularly suitable for applications in a lithium ion secondary battery.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: June 14, 2016
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Chen-Ping Tsai, Kuei-Sen Cheng, Chyen-Fu Lin
  • Patent number: 9351542
    Abstract: A buckle assembly includes female and male buckle plates. The female buckle plate is formed with an insertion slot defined by a slot-defining wall having first and second wall faces, and has first and second corners. The first and second corners oppose each other, and are different in height with respect to a reference plane. The male buckle plate has a bent end portion that has upper and lower segments and a middle segment cooperating with the upper and lower segments to define upper and lower corners. The bent end portion is pivotable to the first corner by abutting the upper corner against the first corner, such that the bent end portion is rotatable relative to the first corner.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: May 31, 2016
    Assignee: PLUS MEDITECH CO., LTD.
    Inventors: Yueh-Hua Chiang, Fu-Lin Chuang
  • Patent number: 9344106
    Abstract: An analog-to-digital converter (ADC) includes a plurality of comparators connected to the ADC. The ADC further includes a plurality of switches, wherein switches connected to a corresponding comparator of the plurality of comparators are configured to alternate the corresponding comparator between normal operation and a calibration configuration. The ADC further includes at least one comparator of the plurality of comparators other than the corresponding comparator is configured for normal operation if the corresponding comparator is configured for calibration.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: May 17, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fang-Shi Jordan Lai, Kuo-Ming Wang, Hsu-Feng Hsueh, Cheng Yen Weng, Yung-Fu Lin
  • Publication number: 20160111527
    Abstract: A method for fabricating semiconductor device with fin-shaped structure is disclosed. The method includes the steps of: forming a fin-shaped structure on a substrate; forming a first dielectric layer on the substrate and the fin-shaped structure; depositing a second dielectric layer on the first dielectric layer; etching back a portion of the second dielectric layer; removing part of the first dielectric layer to expose a top surface and part of the sidewall of the fin-shaped structure; forming an epitaxial layer to cover the exposed top surface and part of the sidewall of the fin-shaped structure; and removing a portion of the second dielectric layer.
    Type: Application
    Filed: December 28, 2015
    Publication date: April 21, 2016
    Inventors: Chin-Cheng Chien, Hsin-Kuo Hsu, Chih-Chien Liu, Chin-Fu Lin, Chun-Yuan Wu
  • Patent number: 9318567
    Abstract: A method of fabricating a semiconductor device includes the following steps. First, a semiconductor substrate is provided, which includes at least a fin structure and at least a gate semiconductor layer disposed thereon. The gate semiconductor layer covers a portion of the fin structure. Then a sacrificial layer is deposited to cover the fin structure entirely. Subsequently, a top surface of the fin structure is exposed from the sacrificial layer through an etching process. A material layer is then deposited, which covers the gate semiconductor layer, the fin structure and the sacrificial layer conformally. Finally, the material layer is etched until the top surface of the fin structure is exposed and a first spacer is concurrently formed on side surfaces of the gate semiconductor layer.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: April 19, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chin-Cheng Chien, Chun-Yuan Wu, Chin-Fu Lin, Chih-Chien Liu, Chia-Lin Hsu
  • Publication number: 20160103609
    Abstract: A user input device for use with a controlled device. The user input device includes a substrate; a plurality of sensing electrodes disposed separately on or in the substrate for sensing an object; and a controller electrically coupled to the sensing electrodes and stored therein at least one virtual key allocation table, wherein the controller executes a converting operation to generate a sensed object information according to a capacitance data realized from the sensing electrodes, and generates an input command associated with a specified key in the virtual key allocation table, which corresponds to the sensed object information, for controlling the controlled device. The same sensed object information can be designed to correspond to keys of different definition under different virtual key allocation tables, and/or derive different input commands in different operational.
    Type: Application
    Filed: October 9, 2015
    Publication date: April 14, 2016
    Inventors: Shih-Hsien HU, Yi-Feng Wei, Yao-Chih Chuang, Chao-Fu Lin
  • Patent number: 9312604
    Abstract: The invention provides a boundary radiation prevention structure, comprising: a metal portion, and a guide portion. The metal portion has an incident plane adapted to block an incident electromagnetic wave, wherein the incident electromagnetic wave induces an induced current on the incident plane. The guide portion is located on one border of the incident plane and has a curved surface electrically connected to the metal portion for the induced current to pass through, wherein the curved surface is covered by an absorption layer for absorbing the incident electromagnetic wave and a boundary radiation generated from the induced current radiation.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: April 12, 2016
    Assignee: CLARIDY SOLUTIONS, INC.
    Inventors: Horng Ji Chen, Yu Ting Hsiao, Che Fu Lin, Lin Chi Choo
  • Publication number: 20160099204
    Abstract: A package structure is provided, including: a board having a plurality of conductive traces; a plurality of conductive pads formed on the board and each having a height greater than a height of each of the conductive traces; and an electronic component disposed on and electrically connected to the conductive pads via a plurality of conductive elements, wherein at least one of the conductive traces is positioned in proximity of at least one of the conductive pads. Therefore, the conductive elements are prevented from being in contact with the conductive traces, and the problem that the conductive pads and the conductive traces are shorted is solved. The present invention further provides a method for fabricating the packaging substrate.
    Type: Application
    Filed: May 12, 2015
    Publication date: April 7, 2016
    Inventors: Chang-Fu Lin, Chin-Tsai Yao, Chia-Cheng Chen, Chih-Jen Yang, Fu-Tang Huang
  • Publication number: 20160083874
    Abstract: A woven fabric for a mop cloth contains: at least one wrap yarn broadwise woven by a plurality of fibers, plural first fiber yarns, and plural second fiber yarns. Each second fiber yarn is a textured yarn, and each first fiber yarn is a grey yarn. A length of each first fiber yarn is equal to or is more than that of each second fiber yarn, such that two thread ends of each first fiber yarn extends out two sides of each at least one wrap yarn. Thereby, the woven fabric contains a single material or plural materials (such as the grey yarn with a predetermined hardness and the textured yarn with a predetermined flexibility) to absorb fluids and to scrape objects on the floor, thus enhancing cleaning capacity.
    Type: Application
    Filed: September 8, 2015
    Publication date: March 24, 2016
    Inventors: Yuan-Hou HUANG, Ta-Fu LIN
  • Publication number: 20160079067
    Abstract: A semiconductor device including a substrate, a spacer and a high-k dielectric layer having a U-shape profile is provided. The spacer located on the substrate surrounds and defines a trench. The high-k dielectric layer having a U-shape profile is located in the trench, and the high-k dielectric layer having a U-shape profile exposes an upper portion of the sidewalls of the trench.
    Type: Application
    Filed: November 24, 2015
    Publication date: March 17, 2016
    Inventors: Chin-Cheng Chien, Chun-Yuan Wu, Chih-Chien Liu, Chin-Fu Lin, Teng-Chun Tsai
  • Publication number: 20160070330
    Abstract: An electronic system (300) comprising: a battery (303); at least one electronic device; and a power managing unit (301), arranged for detecting a battery voltage of the battery (303), and arranged for limiting at least one performance of the at least one electronic device if the battery voltage is not higher than a first low threshold voltage.
    Type: Application
    Filed: April 14, 2015
    Publication date: March 10, 2016
    Inventors: Jen-Chieh Yang, Yong-Sheng Lo, Kai-Hsun Chou, Kuan-Fu Lin
  • Patent number: 9278461
    Abstract: A corner trimmer includes a base, a bottom blade, an L-shaped operation member, a top blade and a spring. The base has a platform and a pivotal portion. The bottom blade having a round edge is fixed to the base and parallel to the platform. The two ends of the L-shaped operation member and two ends of the pivot of the pivotal portion are connected to the base. The L-shaped operation member has an opening. The top blade is located at the inside of the L-shaped operation member and has a curved edge which is located corresponding to the round edge of the bottom blade and shaped to be complementary to the round edge. The spring is biased between the base and the top blade. The corner of an object is inserted into the opening and trimmed by the alternative top and bottom blades.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: March 8, 2016
    Assignee: Aidox Technology Corporation
    Inventor: Chien-Fu Lin
  • Publication number: 20160058596
    Abstract: A joint orthosis includes upper and lower members, and a joint mechanism. The joint mechanism includes a shielding cover and at least one of modular front and rear inserts. Each of the modular front and rear inserts is disposed to limit movement of a joint of a human body in a flexion/extension direction. The shielding cover is removably attached to a mounting frame of the joint mechanism and is configured to conceal and prevent access to the at least one or the modular front and rear inserts.
    Type: Application
    Filed: March 31, 2015
    Publication date: March 3, 2016
    Inventors: Yueh-Hua CHIANG, Fu-Lin CHUANG, Chien-Min FANG
  • Publication number: 20160064300
    Abstract: A fan-out wafer level package is provided. The fan-out wafer level package includes a semiconductor element, a molding compound, a first fan-out structure, a conductive heat spreader, and a plurality of solder balls. The semiconductor element includes a plurality of bonding pads. The molding compound covers the semiconductor element. The first fan-out structure is formed on the semiconductor element, wherein the first fan-out structure has a plurality of fan-out contacts electrically connected to the bonding pads. The conductive heat spreader is formed on the first fan-out structure, wherein the conductive heat spreader has a plurality of through holes filled with a conductive material. The solder balls are formed on the conductive heat spreader, wherein the solder balls are electrically connected to the first fan-out structure via the through holes filled with the conductive material.
    Type: Application
    Filed: October 23, 2014
    Publication date: March 3, 2016
    Inventors: Chu-Fu Lin, Chien-Li Kuo, Kuo-Ming Chen
  • Patent number: D754600
    Type: Grant
    Filed: November 24, 2014
    Date of Patent: April 26, 2016
    Assignee: Hon Turing Technology Co., Ltd.
    Inventor: Po Fu Lin
  • Patent number: D755123
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: May 3, 2016
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chun-Lung Ho, Yi-Hsun Lee, Ming-Wei Ou, Yuan-Fu Lin, Wei-Min Tsao, Hung-Chih Wang