Patents by Inventor Fu Wu

Fu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7651231
    Abstract: A lighting module adapted for use in a keypad device includes a circuit substrate board, a transparent light guide plate stacked on the circuit substrate board, and at least one light emitting diode embedded in the light guide plate and connected electrically to the circuit substrate board. By having the light emitting diode embedded in the light guide plate, the overall thickness of the lighting module can be reduced to permit miniaturization.
    Type: Grant
    Filed: November 23, 2007
    Date of Patent: January 26, 2010
    Assignee: Lite-On Technology Corp.
    Inventors: Li-Kun Chou, Pai-Chen Chieh, Yung-Fu Wu, Yu-Nan Liu
  • Patent number: 7648598
    Abstract: A manufacturing method for an isothermal evaporation casting process is disclosed and to design the manufacturing method for the simple atmospheric casting. The present invention can melt the Mg—Ni alloy with the aspect of totally different melting points thereof, and the other elements can be added during melting simultaneously. Through the Mg—Ni alloy with a suitable weight ratio, the eutectic alloy of Mg/Mg2Ni and high purified ?-phase Mg2Ni can be made. Then adding other elements are to produce the composition of Mg/Ni/M. By way of the manufacturing method of the present invention, the melting equipment is simplified; and, through different manufacturing steps, the purposes of time-saving and low cost are reached; further that, a large amount of the eutectic alloy of Mg/Mg2Ni with different kinds of ratios of Mg, high purified ?-phase Mg2Ni, or the composition of Mg/Ni/M can be obtained.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: January 19, 2010
    Assignee: National Central University
    Inventors: Sheng-Long Lee, Ten-Fu Wu, Jing-Chie Lin, Che-Wei Hsu, Fu-Kai Hsu, Cheng-En Jiang
  • Publication number: 20090298305
    Abstract: A card edge connector for connecting a daughter board to a mother board, includes an insulative housing defining a front mating face, a top portion, a bottom portion opposite to the top portion, and a central slot recessed from the mating face between the top portion and the bottom portion to receive the daughter board, a plurality of terminals retained in the insulative housing, and a spacer disposed under the insulative housing. The spacer having a preselected height and a mounting surface toward the mother board. The spacer and the bottom portion of the insulative housing are assembled by snap-fastening.
    Type: Application
    Filed: May 27, 2009
    Publication date: December 3, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: REN-FU WU, WEN-JUN TANG, XUE-WU BU
  • Publication number: 20090259754
    Abstract: The present invention relates to a method for IP Cameras connection, which comprises the following steps: registering a presetting identification code of a IP Camera and an IP address onto a global service system server; transferring one identification code to the global service system server by one user device; making the global service system server check the identification code with the presetting identification code; based on the checking result, transferring the IP address to the user device by the global service system server; if the IP Camera is connected to one IP Sharing device, then the user device is able to communicate information with the IP Camera through the global service system server, to get the actual IP address and port number of the user device for connecting with the IP Camera.
    Type: Application
    Filed: December 9, 2008
    Publication date: October 15, 2009
    Inventor: Jen-Fu Wu
  • Publication number: 20090226801
    Abstract: A leakproof electrode assembly is mounted in a plastic cover of a storage battery and has a body, a main flange and at least one enhanced flange. The main flange is formed around the body. The at least one enhanced flange is formed around the body and has a top surface, a bottom surface, an outer edge, an upper rib, a lower rib and a groove. The upper and lower ribs are respectively formed on and protrude from the top and bottom surface of the enhanced flange near the outer edge. The groove is formed around the outer edge of the enhanced flange. During combining the plastic cover with the electrode assembly, the upper and lower ribs and the groove provide more contacting surfaces to keep the plastic cover from fully departing from the enhanced flange and to keep liquid inside the battery from leaking out.
    Type: Application
    Filed: March 7, 2008
    Publication date: September 10, 2009
    Applicant: Kuang-Yu CHEN
    Inventor: Shen-Fu Wu
  • Patent number: 7579672
    Abstract: A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate (101), a plurality of semiconductor dies (102), a plurality of shielding metal elements (103), a plurality of grounding metal elements (104) and a plurality of conductive metal elements (110). The semiconductor dies are disposed on an upper surface (105) of the substrate along a horizontal direction. The shielding metal elements are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: August 25, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Chia-fu Wu
  • Patent number: 7566598
    Abstract: The present invention discloses a method of mask reduction for producing a low-temperature polysilicon thin film transistor array by use of a photo-sensitive low-K dielectric, which comprises the steps of: defining a polysilicon-island on a preprocessed glass substrate; forming a gate oxide layer and a first metal layer in sequence; patterning the first metal layer to define a gate; forming a photosensitive dielectric layer; patterning the photosensitive dielectric layer and the gate oxide layer to form a plurality of contact holes, wherein said photo-sensitive low-K dielectric masks said gate oxide layer during said patterning of said gate oxide layer; forming a transmissive pixel layer and patterning the same; and forming a reflective pixel electrode layer and patterning the same.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: July 28, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Yung Fu Wu, Chin Chiang Chen, Chen Ming Chen
  • Patent number: 7561649
    Abstract: A method and apparatus are disclosed for detecting a synchronization mark in a received signal. The received signal is processed to compensate for a DC bias in the received signal, such as subtracting an average of a block of received samples from each sample in the block. A distance metric, such as a sum of square differences, is computed between the DC compensated received signal and an ideal version of the received signal expected when reading the synchronization mark. The synchronization mark is detected if the distance metric satisfies predefined criteria. The ideal version of the received signal can optionally be processed to compensate for a DC bias in the synchronization mark. A search for the synchronization mark search can be limited to time cycles that match a known phase.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: July 14, 2009
    Assignee: Agere Systems Inc.
    Inventors: Jonathan James Ashley, Ching-Fu Wu, Kaichi Zhang
  • Publication number: 20090177389
    Abstract: A touch-control navigation device and method is characterized in that when an operation interface of the navigation device is touched to select an obstacle location on a certain section of a road, a plurality of menus is shown on the operation interface. Each of the menus corresponds to at least one obstacle item. A user may configure the setting of the obstacle items according to actual need, so that a navigation module of the device plans out a route based on a beginning position, a destination, information about a plurality of maps, information about a plurality of roads, and the setting configured for every obstacle item. In this manner, it is able to avoid the problem of planning out a non-passable route. A touch-control navigation method implemented based on the touch-control navigation device is also disclosed.
    Type: Application
    Filed: December 29, 2008
    Publication date: July 9, 2009
    Applicant: MITAC INTERNATIONAL Corp.
    Inventor: Chiao-Fu WU
  • Publication number: 20090141516
    Abstract: An optoelectronic semiconductor component includes a light-emitting chip for emitting light, and a reflective substrate. A plurality of linear indent structures is formed on the reflective substrate. The light-emitting chip is installed on the reflective substrate and located on a side of the plurality of linear indent structures. The plurality of linear indent structures is capable of reflecting the light emitted from the light-emitting chip.
    Type: Application
    Filed: May 8, 2008
    Publication date: June 4, 2009
    Inventors: Yung-Fu Wu, He-Feng Zhang
  • Publication number: 20090104818
    Abstract: A card edge connector includes an elongated insulative housing and a plurality of contacts retained in the insulative housing. The insulative housing includes a mounting surface and a mating surface defining an elongated slot for receiving a daughter PCB. Each contact has a contacting portion extending into the elongated slot and a clip portion for clipping a mother PCB. The insulative housing further includes two pairs of elastic arms integrally extending from lateral sides thereof. Each elastic arm includes a protrusion for stably abutting against the mother PCB.
    Type: Application
    Filed: October 20, 2008
    Publication date: April 23, 2009
    Inventors: Ren-Fu Wu, Wen-Jun Tang, Xue-Wu Bu
  • Patent number: 7510991
    Abstract: The present invention is directed to a noise suppressor for electronic signals. The noise suppressor at least includes Aluminum Oxide (Al2O3) that is sintered under high temperature, resulting in ceramic Aluminum Oxide (Al2O3) for effectively absorbing or suppressing noise, and reshaping the waveform or filtering waveform glitch of the electronic signals.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: March 31, 2009
    Assignee: Y&L Technology Inc.
    Inventors: Cheng-Cheng Wu, Chien-Lung Chen, Cheng-Fu Wu
  • Publication number: 20090079044
    Abstract: A semiconductor package includes a lead frame, at least one chip, and an encapsulation. The lead frame has a plurality of leads, and each of the leads includes at least one first conductive part, at least one second conductive part, and at least one third conductive part. The first conductive part is not electrically connected to the second conductive part, and the second conductive part is electrically connected to the third conductive part. The chip is electrically connected to the first conductive part. The encapsulation encapsulates the chip and at least a portion of the lead frame, and forms a first surface and a second surface opposite to the first surface. The first conductive part and the third conductive part are exposed from the first surface, and the second conductive part is exposed from the second surface.
    Type: Application
    Filed: September 3, 2008
    Publication date: March 26, 2009
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Fu Wu, Cheng-Yin Lee
  • Publication number: 20090065911
    Abstract: A semiconductor package includes a carrier, at least one chip, an encapsulation, and a patterned conductive film. The carrier has a first surface and a second surface opposite to the first surface. The chip is disposed on the first surface of the carrier and electrically connected to the carrier. The encapsulation encapsulates the chip and at least a portion of the first surface of the carrier. The patterned conductive film is disposed on the encapsulation to electrically connect to the carrier. A manufacturing method of the semiconductor package is also disclosed.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 12, 2009
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Fu Wu, Cheng-Yin Lee
  • Publication number: 20090047321
    Abstract: Antimicrobial compounds, such as silanol or alcohol, include a protecting or leaving group that can protect the compound from degradation during the process of preparing a medical device containing the compound or reduce the volatility of the compound relative to its counterpart without the leaving group. Nearly any hydrolysable leaving group may be employed. The leaving group may be an agent that may serve a therapeutic function in addition to protecting or retaining the antimicrobial agents.
    Type: Application
    Filed: August 15, 2008
    Publication date: February 19, 2009
    Applicant: MEDTRONIC, INC.
    Inventors: Paul Hsien-Fu Wu, Catherine E. Taylor, Linnus Cheruiyot, Jianwei Li, Terese A. Bartlett, Matt Bergan
  • Patent number: 7481337
    Abstract: Microfluidic pumps, methods of fabrication thereof, and methods of use thereof, as well as method of pumping a fluid, are disclosed.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: January 27, 2009
    Assignee: Georgia Tech Research Corporation
    Inventors: Rajesh Luharuka, Chi-Fu Wu, Peter Hesketh
  • Publication number: 20080318760
    Abstract: The present invention is directed to a noise suppressor for electronic signals. The noise suppressor at least includes Aluminum Oxide (Al2O3) that is sintered under high temperature, resulting in ceramic Aluminum Oxide (Al2O3) for effectively absorbing or suppressing noise, and reshaping the waveform or filtering waveform glitch of the electronic signals.
    Type: Application
    Filed: September 4, 2008
    Publication date: December 25, 2008
    Inventors: Cheng-Cheng Wu, Chien-Lung Chen, Cheng-Fu Wu
  • Publication number: 20080284714
    Abstract: A control circuit of a driving circuit for controlling a light emitting diode (LED) light source having a plurality of areas is provided. The control circuit includes the error amplifiers receiving a feed back current signal and a external reference voltage, and generating an error signal; a buffer register receiving a serial digital signal and generating the parallel digital signals; a work register receiving the parallel digital signals and a trigger signal, and outputting the parallel digital signals when the trigger signal is at a relatively high level; and a switch module having the power switches, each of which receives the error signal and the parallel digital signal for generating a driving signal to control a driving current of a specific area of the light source, in order to control the brightness in each area of the LED light source.
    Type: Application
    Filed: September 6, 2007
    Publication date: November 20, 2008
    Inventors: Tsai-Fu Wu, Chang-Yu Wu, Chin-Feng Kang, Che-Yi Su
  • Publication number: 20080190244
    Abstract: The present invention provides a method for mass producing any metal alloy. After melting a metal mixture, a mixture of heating, soaking and/or cooling is processed to obtain the alloy even with a trace element added. The metal alloy made by the present invention thus has a high purity and a low cost.
    Type: Application
    Filed: April 27, 2007
    Publication date: August 14, 2008
    Applicant: National Central University
    Inventors: Sheng-Long Lee, Jing-Chie Lin, Tien-Fu Wu, Che-Wei Hsu, Cheng-En Jiang, Jen-Hao Liu, Chun-Yu Lin, Yu-Chin Kao
  • Patent number: D602870
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: October 27, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventors: Ren-Fu Wu, Wen-Jun Tang, Xue-Wu Bu