Patents by Inventor Gang Wei
Gang Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250247628Abstract: A de-flicker system includes a compensation gain estimation circuit and a flicker removal circuit. The compensation gain estimation circuit receives a plurality of flicker-dependent frames with sliding bandings, and estimates a compensation gain for each of the plurality of flicker-dependent frames according to the flicker-dependent frames. The flicker removal circuit applies flicker compensation to each of the flicker-dependent frames according to the compensation gain.Type: ApplicationFiled: January 20, 2025Publication date: July 31, 2025Applicant: Mediatek Inc.Inventors: Chia-Yun Chuang, Shih-Wei Hu, Chieh-Kai Kao, Gang-Wei Fan, Shao-Hsiang Chang
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Patent number: 12316980Abstract: A method for de-flickering frames captured by a camera including capturing a first frame with short exposure to generate a first short exposure frame, capturing the first frame with long exposure to generate a first long exposure frame, generating brightness energy information of the first frame according to the first short exposure frame and the first long exposure frame, generating a first set of parameters according to the brightness energy information of the first frame, generating brightness energy information of N next frames after the first frame according to the first set of parameters and the brightness energy information of the first frame, and generating de-flicker scalars of the N next frames after the first frame according to the brightness energy information of the N next frames after the first frame.Type: GrantFiled: May 17, 2023Date of Patent: May 27, 2025Assignee: MEDIATEK INC.Inventors: Shih-Wei Hu, Chieh-Kai Kao, Gang-Wei Fan, Shao-Hsiang Chang
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Patent number: 12300460Abstract: The present disclosure provides a power adjustment method of an upper electrode power supply of a semiconductor process apparatus. The method includes obtaining a processing load of an upper electrode power supply of a reference process chamber and a processing load of an upper electrode power supply of a current process chamber corresponding to semiconductor process step, when starting to perform a semiconductor process step, determining a power compensation coefficient for the current process chamber relative to the reference process chamber based on the processing load of the current process chamber and the processing load the reference process chamber, and controlling the upper electrode power supply to output compensation power. The compensation power is a product of the set power of the upper electrode power supply of the current process chamber corresponding to the semiconductor process step and the corresponding power compensation coefficient.Type: GrantFiled: March 16, 2022Date of Patent: May 13, 2025Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.Inventors: Jing Wei, Yu Zhang, Gang Wei, Jing Yang, Guibin Wang, Xin Yue
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Patent number: 12266507Abstract: The present disclosure provides an impedance-matching method applied to a semiconductor process apparatus, an impedance-matching device, and the semiconductor process apparatus. The impedance-matching method includes adjusting a parameter value of an adjustable element of an impedance-matching device to a preset initial value at beginning of a process, when a radio frequency (RF) power supply is powered on, adjusting the parameter value of the adjustable element according to a pre-stored optimal matching path corresponding to the process, and adjusting the parameter value of the adjustable element using an automatic matching algorithm after reaching end time of the preset matching period until impedance-matching is achieved. The optimal matching path includes parameter values of the adjustable element corresponding to different moments in a preset matching period.Type: GrantFiled: October 12, 2021Date of Patent: April 1, 2025Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.Inventors: Jing Wei, Gang Wei, Yueping Hua
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Patent number: 12261022Abstract: The present disclosure provides a semiconductor process apparatus and a plasma ignition method. The semiconductor process apparatus includes a reaction chamber, an air inlet assembly configured to introduce the reaction gas into the reaction chamber, an upper electrode assembly configured to excite the reaction gas into the plasma, a monitor configured to monitor the electromagnetic radiation intensity of the plasma in the reaction chamber when the plasma is ignited, a controller configured to determine whether the electromagnetic radiation intensity monitored by the monitor reaches the preset intensity, if yes, determine that the plasma ignition is successful, and after the plasma ignition is successful, control the upper electrode assembly to perform the impedance matching of the first preset duration. In the present disclosure, the consistency of the process results may be improved to improve the uniformity of the products.Type: GrantFiled: November 23, 2021Date of Patent: March 25, 2025Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.Inventors: Jing Yang, Chenyu Zhong, Gang Wei
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Patent number: 12191114Abstract: The present disclosure provides a semiconductor reaction chamber and an atomic layer plasma etching apparatus. The semiconductor reaction chamber includes a dielectric window and a reaction chamber body. The spray head is arranged between the dielectric window and the top wall of the reaction chamber body, and divides the plasma generation area into an upper strong plasma area and a lower weak plasma area. Moreover, a plurality of through-holes are distributed in the central area of the spray head and configured to allow the plasma in the strong plasma area to pass through. A first gas channel is arranged in an edge area of the spray head. The process reaction gas inlet member is located on a side where the gas inlet end of the first gas channel of the spray head is located. A second gas channel is arranged in the process reaction gas inlet member.Type: GrantFiled: May 7, 2021Date of Patent: January 7, 2025Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.Inventors: Xingfei Mao, Masaya Odagiri, Gang Wei, Guodong Chen
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Publication number: 20240388808Abstract: A method for de-flickering frames captured by a camera including capturing a first frame with short exposure to generate a first short exposure frame, capturing the first frame with long exposure to generate a first long exposure frame, generating brightness energy information of the first frame according to the first short exposure frame and the first long exposure frame, generating a first set of parameters according to the brightness energy information of the first frame, generating brightness energy information of N next frames after the first frame according to the first set of parameters and the brightness energy information of the first frame, and generating de-flicker scalars of the N next frames after the first frame according to the brightness energy information of the N next frames after the first frame.Type: ApplicationFiled: May 17, 2023Publication date: November 21, 2024Applicant: MEDIATEK INC.Inventors: Shih-Wei Hu, Chieh-Kai Kao, Gang-Wei Fan, Shao-Hsiang Chang
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Publication number: 20240339296Abstract: The present disclosure provides a coil structure for generating plasma and semiconductor processing equipment. The coil structure includes at least one coil set. The coil set includes a first sub-coil set and a second sub-coil set that are coaxially arranged. The first sub-coil set includes at least one first planar coil located in a first plane. The second sub-coil set includes at least one second planar coil located in a second plane parallel to the first plane. The first planar coil and the second planar coil are connected in series. An orthogonal projection of the second planar coil on the first plane is mirror-symmetric or mirror-asymmetric to the first planar coil.Type: ApplicationFiled: July 6, 2022Publication date: October 10, 2024Inventors: Jinrong ZHAO, Song WANG, Gang WEI, Jinji XU
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Patent number: 12068808Abstract: Embodiments of this application provide a data sending method, an apparatus, a device, and a readable storage medium. A server determines a first transmission point from a coordinated set, and determines a first downlink sending weight of the first transmission point. Then, the server determines a second downlink sending weight of a second transmission point based on the first downlink sending weight, and sends the second downlink sending weight to the second transmission point. When sending a data stream to an electronic device, the second transmission point determines a downlink sending weight corresponding to the data stream from a matrix, weights the data stream, and sends the weighted data stream to the electronic device.Type: GrantFiled: January 19, 2023Date of Patent: August 20, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Yunfeng Sun, Qingtian Xue, Wei Yu, Min Wen, Gang Wei, Qunfang Lou
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Publication number: 20240249917Abstract: An impedance-matching method applied to semiconductor processing equipment includes a processing preparation step and a processing ignition step. The processing preparation step includes obtaining currently stored impedance-matching data corresponding to a processing ignition step. The impedance-matching data includes a parameter adjustment position corresponding to a parameter adjustable device in an impedance-matching device of the semiconductor processing equipment. The processing preparation step further includes adjusting a parameter value of the parameter adjustable device based on the parameter adjustment position.Type: ApplicationFiled: March 29, 2024Publication date: July 25, 2024Inventors: Wenqing LI, Gang WEI, Jing YANG, Shuqi JIANG, Di ZHANG
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Publication number: 20240234088Abstract: A power control method of a lower RF power supply of semiconductor processing equipment includes, when a processing chamber starts semiconductor processing, with a predetermined power compensation equation and according to a pre-obtained first RF circuit parameter set of a reference chamber and a second RF circuit parameter set of a present processing chamber performing the semiconductor processing, obtaining a power compensation coefficient of the present processing chamber relative to the reference chamber, according to the power compensation coefficient and a power setting value of the lower RF power supply of the present processing chamber, calculating a power compensation value of the present processing chamber relative to the reference chamber, and controlling the lower RF power supply to output the power compensation value.Type: ApplicationFiled: March 26, 2024Publication date: July 11, 2024Inventors: Jing WEI, Yu ZHANG, Gang WEI, Guodao SHAN, Chenyu ZHONG, Yanyan YOU, Jing YANG
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Publication number: 20240194441Abstract: The present disclosure provides a power adjustment method of an upper electrode power supply of a semiconductor process apparatus. The method includes obtaining a processing load of an upper electrode power supply of a reference process chamber and a processing load of an upper electrode power supply of a current process chamber corresponding to semiconductor process step, when starting to perform a semiconductor process step, determining a power compensation coefficient for the current process chamber relative to the reference process chamber based on the processing load of the current process chamber and the processing load the reference process chamber, and controlling the upper electrode power supply to output compensation power. The compensation power is a product of the set power of the upper electrode power supply of the current process chamber corresponding to the semiconductor process step and the corresponding power compensation coefficient.Type: ApplicationFiled: March 16, 2022Publication date: June 13, 2024Inventors: Jing WEI, Yu ZHANG, Gang WEI, Jing YANG, Guibin WANG, Xin YUE
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Patent number: 11988093Abstract: An inflatable folding tunnel reinforcement structure and a construction method thereof are provided. The inflatable folding tunnel reinforcement structure includes an inflation port, an airbag, a water blocking net, a steel plate, a scissor folding mechanism, a vertical support plate, an arc-shaped support plate, drainage channels, an upper support rod, a lower support rod, a locking pin, a threaded steel rod, a rolling connection pin, and an induction motor, where the upper support rod and the lower support rod are unfolded in opposite directions to a preset position through the steel rod; and the drainage channels are configured to perform water guidance and resistance for a leakage-proofing purpose. The construction method includes: preparation before construction, device fixation, on-site construction, structural inspection, and site cleaning.Type: GrantFiled: January 4, 2023Date of Patent: May 21, 2024Assignee: Hangzhou City UniversityInventors: Gang Wei, Tianbao Xu, Xin Li, Tianyu Zhu, Shuangyan Lin, Luju Liang, Chengbao Hu, Xiao Wang
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Publication number: 20240123925Abstract: A system includes a graphical user interface display, a cockpit domain controller, and a wireless device. The graphical user interface display is operational to receive a plurality of input commands from an end user. The cockpit domain controller is in communication with the graphical user interface display, and is operational to transmit a plurality of wireless signals in response to the plurality of input commands received from the graphical user interface display. The wireless device is connectable to a controlled device, is in wireless communication with the cockpit domain controller, is operational to translate the plurality of wireless signals received from the cockpit domain controller into at least one of a motor control command and a switch control command, and is operational to present the at least one of the motor control command and the switch control command to the controlled device while connected.Type: ApplicationFiled: October 12, 2023Publication date: April 18, 2024Applicant: VISTEON GLOBAL TECHNOLOGIES, INC.Inventors: Gang Wei, Yogesh B. Patel, Antonio O. Odejerte
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Patent number: 11955313Abstract: A control circuit for outputting a pulsed signal includes a switch circuit having a first terminal, a second terminal, a third terminal, a fourth terminal, a first control terminal, and a second control terminal, where the first terminal and the second terminal input the DC signal, the third terminal and the fourth terminal output the pulsed signal, the third terminal and the fourth terminal output the pulsed signal in response to the first control terminal and the second control terminal receiving the first signal, and stop outputting the pulsed signal in response to the first control terminal and the second control terminal receiving the second signal; and an energy storage circuit having two terminals connected to the first terminal and the second terminal of the switch circuit to store residual electric energy of the switch circuit when the switch circuit does not output the pulsed signal.Type: GrantFiled: December 17, 2020Date of Patent: April 9, 2024Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.Inventor: Gang Wei
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Patent number: 11952728Abstract: A road structure reconstructed from large-scale independent underground garage and a construction method, which solves the problem of a newly constructed urban expressway passing through large underground space. The technical point is a construction method for the road structure reconstructed from large-scale independent underground garage, including the following steps: S100: segmentation for the garage, S200: preparation before construction: the materials and equipment required for construction are transported to the site, and the construction site is cleaned, S300: reconstruction for the front section, S400: reconstruction for the middle section, S500: reconstruction for the rear section. The inventiveness of the present disclosure is the application of segmentation construction, the front section is completely obsoleted, a transition section is provided at the middle, and the design of the rear section adopts a double-deck road, thus the original underground garage structure is fully utilized.Type: GrantFiled: July 12, 2023Date of Patent: April 9, 2024Assignee: HANGZHOU CITY UNIVERSITYInventors: Gang Wei, Tianbao Xu, Jiaxuan Zhu, Yunliang Cui, Bing Li, Ke Wang, Pengfei Xiang, Shuangyan Lin, Xinquan Wang, Hongguo Diao
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Publication number: 20240076984Abstract: An inflatable folding tunnel reinforcement structure and a construction method thereof are provided. The inflatable folding tunnel reinforcement structure includes an inflation port, an airbag, a water blocking net, a steel plate, a scissor folding mechanism, a vertical support plate, an arc-shaped support plate, drainage channels, an upper support rod, a lower support rod, a locking pin, a threaded steel rod, a rolling connection pin, and an induction motor, where the upper support rod and the lower support rod are unfolded in opposite directions to a preset position through the steel rod; and the drainage channels are configured to perform water guidance and resistance for a leakage-proofing purpose. The construction method includes: preparation before construction, device fixation, on-site construction, structural inspection, and site cleaning. The present disclosure can treat various tunnel defects efficiently and conveniently and achieve a desired leakage-proofing effect.Type: ApplicationFiled: January 4, 2023Publication date: March 7, 2024Applicant: Hangzhou City UniversityInventors: Gang WEI, Tianbao XU, Xin LI, Tianyu ZHU, Shuangyan LIN, Luju LIANG, Chengbao HU, Xiao WANG
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Patent number: D1051637Type: GrantFiled: June 5, 2023Date of Patent: November 19, 2024Assignee: NINGBO SUNFREE MOTOR TECHNOLOGY COMPANY LIMITEDInventors: Chun Jiang, Gang Wei
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Patent number: D1052644Type: GrantFiled: April 28, 2020Date of Patent: November 26, 2024Inventor: Gang Wei
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Patent number: D1079943Type: GrantFiled: March 22, 2024Date of Patent: June 17, 2025Assignee: Shaanxi MicroPre Medical Biotechnology Co., Ltd.Inventors: Gang Wei, Jintong Jia, Shiming He, Zhiyu He