Abstract: Some embodiments of the present disclosure provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wall. The bottom side includes gas passages for plasma particles to pass through the liner.

Abstract: The present invention relates to a system and method for inspecting and validating a flight procedure used in the field of civil aviation. The system comprises an image capturing apparatus, a storage device, a playing device, a recorder such as QAR, a data processing module and a synchronization module; the method for inspecting and validating a flight procedure applied in the system includes the following steps: collecting actual visual videos and flight parameters, generating simulation visual videos, generating over-limit alarms, processing data, generating complex simulation visual videos, generating flight trajectory and flight procedure protection area pictures, and synchronizing and playing the videos.

Abstract: Some embodiments of the present disclosure provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wait. The bottom side includes gas passages for plasma particles to pass through the liner.

Abstract: Some embodiments of the present disclosure, provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wait. The bottom side includes gas passages for plasma particles to pass through the liner.

Abstract: The present invention provides aqueous formulations containing an anti-infection agent, a biocompatible polysaccharide, an osmotic pressure regulator, a pH regulator, and water, wherein a gel containing the therapeutic agent is formed in situ upon instillation of the formulations onto the skin and a body cavity of a subject. The formulations of this invention are useful for treating infectious diseases of skin or a body cavity (e.g., eye, nose, or vagina) of a subject.

Abstract: Embodiments of the invention relate to a reaction chamber and a plasma processing apparatus, which include a chamber body, a dielectric window and a power supply unit, the dielectric window is provided above and hermetically connected with the chamber body, and provided with plural sets of coils arranged at intervals in a vertical direction and wound around the dielectric window at an outer side thereof, and the power supply unit supplies power to the plural sets of coils. In the reaction chamber and the plasma processing apparatus, plasma can be distributed evenly and have an increased density in the reaction chamber, thereby improving uniformity and efficiency of the process; meanwhile, effective power for exciting plasma can be improved, and temperature rise and temperature gradient of the dielectric window during the process can be lowered, so as to prevent the dielectric window from cracking, and prolong service life of the dielectric window.

Abstract: The disclosure disclosed a connection device for connecting first means of the airplane to second means of the airplane. The first means and the second means are provided with connection regions, which lengthwise extend in a first direction and are connected with each other, respectively. A plurality of finger-like grooves, which are parallel with each other and extend respectively in a second direction inclined relative to the first direction in which the connection region extends, are provided respectively on a connection face of the connection region of the first means and a connection face of the connection region of the second means.

Abstract: The present invention relates to a system and method for inspecting and validating a flight procedure used in the field of civil aviation. The system comprises an image capturing apparatus, a storage device, a playing device, a recorder such as QAR, a data processing module and a synchronization module; the method for inspecting and validating a flight procedure applied in the system includes the following steps: collecting actual visual videos and flight parameters, generating simulation visual videos, generating over-limit alarms, processing data, generating complex simulation visual videos, generating flight trajectory and flight procedure protection area pictures, and synchronizing and playing the videos.

Abstract: The present invention is directed to an ophthalmic composition, method for preparing the same, and use of the same. The ophthalmic composition includes a mixture of lipid nano-dispersion and gel substrate, wherein the lipid nano-dispersion includes a first lipid, a second lipid, and emulsifier; in which the first lipid exists in form of solid lipid as staring material, and the second lipid exists in form of liquid lipid as staring material. The ophthalmic composition can better reduce the symptoms of dry eye, and is safe, convenient and economical to use, and can be used during daytime without blocking of vision.

Abstract: A substrate etching method and a substrate processing device, the substrate etching method includes: S1: placing a substrate to be processed into a reaction chamber; S2: supplying etching gas into the reaction chamber; S3: turning on an excitation power supply to generate plasma in the reaction chamber; S4: turning on a bias power supply to apply bias power to the substrate; S5: turning off the bias power supply, and meanwhile, starting to supply deposition gas into the reaction chamber; S6: stopping supply of the deposition gas into the reaction chamber, and meanwhile, turning on the bias power supply; S7: repeating steps S5-S6, until the etching process is completed. In the whole etching process, the etching operation is always performed, and the deposition operation is performed sometimes.

Abstract: A chamfered narrow side copper plate for a mold with a funnel-shaped curved surface has a working face contacting molten steel that includes a middle area and two chamfered areas, which are arranged at two sides. The working face has a funnel-shaped curved surface, which is larger at a top and smaller at a bottom. The chamfered narrow side copper plate for mold with funnel-shaped curved surface can ensure the uniformity of the cooling effect of the chamfered surface and enhance the service life of the narrow side copper plate.

Abstract: The disclosure disclosed a connection device for connecting first means of the airplane to second means of the airplane. The first means and the second means are provided with connection regions, which lengthwise extend in a first direction and are connected with each other, respectively. A plurality of finger-like grooves, which are parallel with each other and extend respectively in a second direction inclined relative to the first direction in which the connection region extends, are provided respectively on a connection face of the connection region of the first means and a connection face of the connection region of the second means.

Abstract: A substrate etching method and a substrate processing device, the substrate etching method includes: S1: placing a substrate to be processed into a reaction chamber; S2: supplying etching gas into the reaction chamber; S3: turning on an excitation power supply to generate plasma in the reaction chamber; S4: turning on a bias power supply to apply bias power to the substrate; S5: turning off the bias power supply, and meanwhile, starting to supply deposition gas into the reaction chamber; S6: stopping supply of the deposition gas into the reaction chamber, and meanwhile, turning on the bias power supply; S7: repeating steps S5-S6, until the etching process is completed. In the whole etching process, the etching operation is always performed, and the deposition operation is performed sometimes.

Abstract: A chamfered narrow side copper plate for a mould with a funnel-shaped curved surface has a working face contacting molten steel that includes a middle area and two chamfered areas, which are arranged at two sides. The working face has a funnel-shaped curved surface, which is larger at a top and smaller at a bottom. The chamfered narrow side copper plate for mould with funnel-shaped curved surface can ensure the uniformity of the cooling effect of the chamfered surface and enhance the service life of the narrow side copper plate.

Abstract: A micro-switch provided labor-saving switching comprises a housing, a press member located on the housing, an actuation member located in the housing and a driving assembly located between the press member and actuation member. The press member is depressed to move reciprocally in the housing in a displacement. The driving member includes a force-bearing member hinged swivelably on the housing and at least one transmission member swivelable inversely against the force-bearing member. The force-bearing member includes a force-receiving portion in the displacement and an actuating portion connected to the force-receiving portion. The at least one transmission member includes a driven portion driven by the actuating portion and a force-applying portion connected to the driven portion. The driving assembly drives the actuation member through a lever principle to switch between a first conductive state and a second conductive state.

Abstract: A chamfered narrow side copper plate for a mold with a funnel-shaped curved surface has a working face contacting molten steel that includes a middle area and two chamfered areas, which are arranged at two sides. The working face has a funnel-shaped curved surface, which is larger at a top and smaller at a bottom. The chamfered narrow side copper plate for mold with funnel-shaped curved surface can ensure the uniformity of the cooling effect of the chamfered surface and enhance the service life of the narrow side copper plate.

Abstract: A labor-saving micro-switch comprises a housing, a press member located on the housing, an actuation member located in the housing and a driven member located between the press member and actuation member. The press member is depressible to move reciprocally in a displacement inside the housing. The driven member includes a pivotal portion hinged on the housing in a swivelable manner, a force-receiving portion opposite to the pivotal portion in the displacement and a force-applying portion driven by the force-receiving portion and movable about the pivotal portion serving as a fulcrum to press the actuation member. The driven member drives the actuation member to switch between a first conductive state and a second conductive state through a lever principle. The micro-switch thus formed can achieve higher sensitivity and reduce production cost.

Abstract: A micro-switch provided labor-saving switching comprises a housing, a press member located on the housing, an actuation member located in the housing and a driving assembly located between the press member and actuation member. The press member is depressed to move reciprocally in the housing in a displacement. The driving member includes a force-bearing member hinged swivelably on the housing and at least one transmission member swivelable inversely against the force-bearing member. The force-bearing member includes a force-receiving portion in the displacement and an actuating portion connected to the force-receiving portion. The at least one transmission member includes a driven portion driven by the actuating portion and a force-applying portion connected to the driven portion. The driving assembly drives the actuation member through a lever principle to switch between a first conductive state and a second conductive state.

Abstract: A labor-saving micro-switch comprises a housing, a press member located on the housing, an actuation member located in the housing and a driven member located between the press member and actuation member. The press member is depressible to move reciprocally in a displacement inside the housing. The driven member includes a pivotal portion hinged on the housing in a swivelable manner, a force-receiving portion opposite to the pivotal portion in the displacement and a force-applying portion driven by the force-receiving portion and movable about the pivotal portion serving as a fulcrum to press the actuation member. The driven member drives the actuation member to switch between a first conductive state and a second conductive state through a lever principle. The micro-switch thus formed can achieve higher sensitivity and reduce production cost.

Abstract: A plasma processing apparatus includes a chamber (20) and a target (25) above the chamber (20). The surface of the target (25) contacts the processing area of the chamber (20). The chamber (20) includes an insulating sub-chamber (21) and a first conductive sub-chamber (22), which are superposed. The first conductive sub-chamber (22) is provided under the insulating sub-chamber (21). The insulating sub-chamber (21) is made of insulating material, and the first conductive sub-chamber (22) is made of metal material. A Faraday shield component (10) which is made of metal material or insulating material electroplated with conductive coatings and includes at least one slit is provided in the insulating sub-chamber (21). An inductance coil (13) surrounds the exterior of the insulating sub-chamber (21). The problem about the wafer contamination due to particles formed on the surface of the coil during the sputtering process can be solved by using the plasma processing apparatus.