Patents by Inventor Georg Braun

Georg Braun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240336770
    Abstract: It is provided a polyolefin composition including a) 20-30 wt % of at least one polypropylene homopolymer, b) 10-45 wt % of a blend of recycled plastic material including polypropylene and polyethylene in a ratio between 3:7 and 49.5:1, which is recovered from a waste plastic material derived from post-consumer and/or post-industrial waste; c) 7-15 wt % of at least one heterophasic propylene copolymer; d) 1-4 wt % of at least one elastomer; e) 15-25 wt % of glass fibers; and f) 0.5-2.5 wt % of at least one coupling agent, and optionally further additives. The sum of all ingredients add always up to 100 wt %. The polyolefin composition has a fogging value of 0.5-2.00 (measured gravimetrically according to ISO 75201, method B).
    Type: Application
    Filed: July 6, 2022
    Publication date: October 10, 2024
    Inventors: Susanne Margarete Kahlen, Daniela Mileva, Angelica Maëlle Delphine Legras, Hermann Braun, Jingbo Wang, Georg Grestenberger, Christophe Salles, Emmanuel Boissard
  • Patent number: 8161219
    Abstract: Distributed command and address bus architecture for memory modules and circuit boards is described. In one embodiment, a memory module includes a plurality of connector pins disposed on an edge of a circuit board, the plurality of connector pins comprising first pins coupled to a plurality of data bus lines, second pins coupled to a plurality of command and address bus lines, wherein the second pins are disposed in a first and a second region, wherein a portion of the first pins is disposed between the first and the second regions.
    Type: Grant
    Filed: December 4, 2008
    Date of Patent: April 17, 2012
    Assignee: Qimonda AG
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gärtner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Patent number: 8041865
    Abstract: A memory system includes a number of integrated circuit chips coupled to a bus. Each of the integrated circuit chips has an input/output node coupled to the bus, the input/output node having a programmable on-die termination resistor. The input/output node of one of the integrated circuit chips is accessed via the bus. The programmable on-die termination resistor of each of the integrated circuit chips is independently set to a termination resistance. The termination resistance is determined by a transaction type and which of the plurality memory devices is being accessed, which information can be transmitted over a separate transmission control bus.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: October 18, 2011
    Assignee: Qimonda AG
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gaertner, Hermann Ruckerbauer, George Alexander, Johannes Stecker
  • Patent number: 7936201
    Abstract: An apparatus for providing a signal for transmission via a signal line includes a controller circuit having an output for a signal indicating whether the signal line is or will be in an inactive state and a switching circuit coupled to the controller circuit and having an output coupled to the signal line. The output is switched between different signal levels, if the signal indicates that the signal line is in an inactive state.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: May 3, 2011
    Assignee: Qimonda AG
    Inventors: Edoardo Prete, Hans-Peter Trost, Anthony Sanders, Dirk Scheideler, Georg Braun, Steve Wood, Richard Johannes Luyken
  • Patent number: 7848153
    Abstract: Memory devices and memory modules are disclosed. In one embodiment, a memory device includes a semiconductor substrate having a first edge and a second edge opposed to the first edge. A plurality of memory banks is disposed at a central portion of the semiconductor substrate, each memory bank including a plurality of memory cells. A plurality of input/output contacts is disposed between the first edge and the memory banks. Delay locked loop circuitry is disposed adjacent the first edge. A plurality of address and command contacts is disposed between the second edge and the memory banks.
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: December 7, 2010
    Assignee: Qimonda AG
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gaertner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Patent number: 7844798
    Abstract: A method of operating an integrated circuit involves supplying an instruction portion of a command to the integrated circuit to specify an operation to be performed by the integrated circuit. At least some types of commands also include an attributes portion that provides additional information about the operation to be performed. The attributes portion of the command is supplied to the integrated circuit with a delay relative to the instruction portion of the command. The integrated circuit selectively enables circuitry for processing the attributes portion if the integrated circuit determines from the received instruction portion that the command also includes an attributes portion. The delay between the two portions of the command provides sufficient time for the integrated circuit to enable the attributes processing circuitry, which, in a default state, can be disabled during an active mode of the integrated circuit to save power.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: November 30, 2010
    Assignee: Qimonda AG
    Inventors: Andreas Gärtner, Georg Braun, Maurizio Skerlj, Johannes Stecker
  • Patent number: 7796446
    Abstract: A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: September 14, 2010
    Assignee: Qimonda AG
    Inventors: Hermann Ruckerbauer, Michael Bruennert, Ullrich Menczigar, Christian Mueller, Sitt Tontisirin, Georg Braun, Dominique Savignac
  • Patent number: 7771206
    Abstract: Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: August 10, 2010
    Assignee: Qimonda AG
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gärtner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Patent number: 7721130
    Abstract: An apparatus being connectable as a latch stage into a asynchronous latch chain comprises a reception interface, wherein upon receipt of the first signal at the reception interface, the apparatus switches to one of the first power saving mode and a second power saving mode, depending on the second signal at the reception interface and wherein the apparatus offers a first power consumption and a first wake-up time in the first power saving mode, and a second power consumption and a second wake-up time in the second power saving mode.
    Type: Grant
    Filed: November 27, 2006
    Date of Patent: May 18, 2010
    Assignee: Qimonda AG
    Inventors: Edoardo Prete, Hans-Peter Trost, Anthony Sanders, Dirk Scheideler, Georg Braun, Steve Wood, Richard Johannes Luyken
  • Publication number: 20100082871
    Abstract: Distributed command and address bus architecture for memory modules and circuit boards is described. In one embodiment, a memory module includes a plurality of connector pins disposed on an edge of a circuit board, the plurality of connector pins comprising first pins coupled to a plurality of data bus lines, second pins coupled to a plurality of command and address bus lines, wherein the second pins are disposed in a first and a second region, wherein a portion of the first pins is disposed between the first and the second regions.
    Type: Application
    Filed: December 4, 2008
    Publication date: April 1, 2010
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gartner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Publication number: 20100074038
    Abstract: A memory die, including a memory array, a memory array data terminal and a data bus that includes a first sub bus and a second sub bus is disclosed. A first bi-directional buffer arranged between the memory array data terminal and the first sub bus and a second bi-directional buffer arranged between the memory array data terminal and the second sub bus is also disclosed. The first and second bi-directional buffers are adapted to couple the first sub bus or the second sub bus to the memory array data terminal at a time.
    Type: Application
    Filed: September 19, 2008
    Publication date: March 25, 2010
    Inventors: Hermann Ruckerbauer, Michael Bruennert, Ullrich Menczigar, Christian Mueller, Sitt Tontisirin, Georg Braun, Dominique Savignac
  • Publication number: 20100062621
    Abstract: Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 11, 2010
    Inventors: MICHAEL BRUENNERT, Peter Gregorius, Georg Braun, Andreas Gartner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Publication number: 20100046266
    Abstract: Memory devices and memory modules are disclosed. In one embodiment, a memory device includes a semiconductor substrate having a first edge and a second edge opposed to the first edge. A plurality of memory banks is disposed at a central portion of the semiconductor substrate, each memory bank including a plurality of memory cells. A plurality of input/output contacts is disposed between the first edge and the memory banks. Delay locked loop circuitry is disposed adjacent the first edge. A plurality of address and command contacts is disposed between the second edge and the memory banks.
    Type: Application
    Filed: August 19, 2008
    Publication date: February 25, 2010
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gaertner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Publication number: 20100032820
    Abstract: Memory modules, computing systems, and methods of manufacturing memory modules are disclosed. In one embodiment, a memory module includes a substrate having a first side and a second side opposed to the first side. A plurality of pins is disposed on the first side of the substrate. A first plurality of memory chips are arranged in a first chip layer, the first chip layer overlying the second side of the substrate. Electrical contacts of the first plurality of memory chips are electrically coupled to the pins. A second plurality of memory chips is arranged in a second chip layer, the second chip layer overlying the first chip layer. Electrical contacts of the second plurality of memory chips are electrically coupled to the pins.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 11, 2010
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gaertner, Hermann Ruckerbauer, George William Alexander, Johannes Stecker
  • Publication number: 20100030934
    Abstract: A memory system includes a number of integrated circuit chips coupled to a bus. Each of the integrated circuit chips has an input/output node coupled to the bus, the input/output node having a programmable on-die termination resistor. The input/output node of one of the integrated circuit chips is accessed via the bus. The programmable on-die termination resistor of each of the integrated circuit chips is independently set to a termination resistance. The termination resistance is determined by a transaction type and which of the plurality memory devices is being accessed, which information can be transmitted over a separate transmission control bus.
    Type: Application
    Filed: August 4, 2008
    Publication date: February 4, 2010
    Inventors: Michael Bruennert, Peter Gregorius, Georg Braun, Andreas Gaertner, Hermann Ruckerbauer, George Alexander, Johannes Stecker
  • Patent number: 7646650
    Abstract: A buffer component for a memory module having a plurality of memory components includes item of access information in accordance with a data transmission protocol, the address, clock, control and command signals depending on the access information, a second data interface for driving a clock signal and address and command signals to the plurality of memory components and for driving a control signal to a group of the plurality of memory components in accordance with a signaling protocol, wherein an activation of the memory components and an acceptance of the address and command signals are effected in a manner dependent on the control signals, and a control unit which applies the address and command signals to the plurality of memory components during a first clock period of the clock signal and applies the control signal for activating the group of the plurality of memory components to the group of the plurality of memory components to be activated when address and command signals are present, in a succeedin
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: January 12, 2010
    Assignee: Infineon Technologies AG
    Inventors: Georg Braun, Srdjan Djordjevic, Andreas Jakobs
  • Publication number: 20090158010
    Abstract: A method of operating an integrated circuit involves supplying an instruction portion of a command to the integrated circuit to specify an operation to be performed by the integrated circuit. At least some types of commands also include an attributes portion that provides additional information about the operation to be performed. The attributes portion of the command is supplied to the integrated circuit with a delay relative to the instruction portion of the command. The integrated circuit selectively enables circuitry for processing the attributes portion if the integrated circuit determines from the received instruction portion that the command also includes an attributes portion. The delay between the two portions of the command provides sufficient time for the integrated circuit to enable the attributes processing circuitry, which, in a default state, can be disabled during an active mode of the integrated circuit to save power.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 18, 2009
    Applicant: QIMONDA AG
    Inventors: Andreas Gartner, Georg Braun, Maurizio Skerlj, Johannes Stecker
  • Patent number: 7532523
    Abstract: Methods and apparatus for setting various terminations of a memory chip. The memory chip includes a terminal, a termination circuit that can be connected to the terminal in order to terminate the terminal with a settable resistance value, a control command port for receiving a control command signal, and a control circuit that is connected to the termination circuit in order to set a resistance value as a function of a received control command signal.
    Type: Grant
    Filed: July 31, 2006
    Date of Patent: May 12, 2009
    Assignee: Qimonda AG
    Inventors: Georg Braun, Christian Weis, Eckehard Plaettner
  • Patent number: 7457174
    Abstract: A method is provided for adapting the phase relationship between a clock signal and a strobe signal for accepting write data to be transmitted into a memory circuit, a write command signal being transmitted to the memory circuit in a manner synchronized with the clock signal, a write data signal being transmitted synchronously with the strobe signal, a phase offset between the transmitted clock signal and the transmitted strobe signal being set such that the write data are reliably accepted in the memory circuit.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: November 25, 2008
    Assignee: Infineon Technologies AG
    Inventors: Georg Braun, Eckehard Plaettner, Christian Weis, Andreas Jakobs
  • Patent number: 7447805
    Abstract: A buffer chip having a first data interface for receiving a data item which is to be written and for sending a data item which has been read, having a conversion unit for parallelizing the received data item and for serializing the data item which is to be sent, having a second data interface for writing the parallelized data item to a memory arrangement via a memory data bus and for receiving the data item read from the memory arrangement via the memory data bus; having a write buffer storage for buffer-storing the data item which is to be written, having a control unit in order, after reception of a data item which is to be written via the first data interface in line with a write command, to interrupt the data from being written from the write buffer storage via the second data interface upon a subsequent read command.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: November 4, 2008
    Assignee: Infineon Technologies AG
    Inventors: Georg Braun, Hermann Ruckerbauer