Abstract: Disclosed is the invention to conduct immuno-adsorption of free 25(OH) vitamin D from blood or blood components, notably serum or plasma, after which the absorbed material is measured. A fluoro-alkyl surfactant is used to enhance the solubility of Vitamin D and allow the measurement of free Vitamin D. The invention thus employs a binding protein to absorb the free 25(OH) vitamin D. Thereafter the binding protein comprising the 25-OH vitamin D is subjected to a competitive binding assay with a labeled vitamin D compound, preferably radiolabeled, fluorescent labeled, luminescent labeled, biotin labeled, gold labeled or enzyme labeled. Alternatively the immunocaptured 25-OH vitamin D can be quantitated by mass spectrometry.

Abstract: The invention concerns structural integrity assessment apparatus for determining stress concentration zones in a structure, such as a pipeline. The apparatus allows particularly to detect defects in buried pipelines using magnetometric surveying where anomalies in the magnetic field around the pipelines are detected. The appar-atus has a plurality of triaxial magnetic field sensors, each sensor being arranged to measure magnetic field components in a plurality of directions. A support is provided to maintain said sensors in a predetermined relative spacing and orientation. The support is moveable relative to a structure under assessment in use and may be portable. Three or more magnetic field sensors are provided which may be arranged in a linear, two-dimensional or three-dimensional array. The ap-paratus may include position determining means, such as a global positioning system (GPS), so that stress concentration zones can be located on the structure.

Abstract: A head-mounted display that is modular and configured for securement to an item of headwear is provided. The head-mounted display may comprise a selection of components that are desired for a particular application, such as a display boom, camera, microphone, position-tracking component, etc., and may include an attachment mechanism for securing the selection of components to the item of headwear. The head-mounted display may include a display module having a corresponding display characteristic that provides a visual display and/or display functionality that is appropriate for a particular application. The display module may include a micro display that is non-transparent and/or a waveguide optic that is at least partially transparent, and may be configured to provide an augmented reality display for a user.

Abstract: A head-mounted display that is modular and configured for securement to an item of headwear is provided. The head-mounted display may comprise a selection of components that are desired for a particular application, such as a display boom, camera, microphone, position-tracking component, etc., and may include an attachment mechanism for securing the selection of components to the item of headwear. The head-mounted display may include a display module having a corresponding display characteristic that provides a visual display and/or display functionality that is appropriate for a particular application. The display module may include a micro display that is non-transparent and/or a waveguide optic that is at least partially transparent, and may be configured to provide an augmented reality display for a user.

Abstract: A device wearable upon a head of a user with an adjustable assembly is provided. The device may comprise a first assembly including a wearable portion, an arm having a first end portion and a second end portion positioned at an end of the arm opposite to the first end portion, and a first connector connected between the first assembly and the first end portion of the arm, the first connector including a detent assembly configured to releasably hold the arm in an in-use position at a first distance from the head of the user and in a stand-by position at a second distance greater than the first distance. The device may further include a second connector connected to the second end portion of the arm, and an output display connected to the second connector.

Abstract: Examples herein involve retrieving a color transformation from a highlighter color transform, and processing an image using the color transformation to enhance highlighter colors in the image, the image scanned by a scanner using strobed illumination.

Abstract: The invention concerns structural integrity assessment apparatus for determining stress concentration zones in a structure, such as a pipeline. The apparatus allows particularly to detect defects in buried pipelines using magnetometric surveying where anomalies in the magnetic field around the pipelines are detected. The apparatus has a plurality of triaxial magnetic field sensors, each sensor being arranged to measure magnetic field components in a plurality of directions. A support is provided to maintain said sensors in a predetermined relative spacing and orientation. The support is moveable relative to a structure under assessment in use and may be portable. Three or more magnetic field sensors are provided which may be arranged in a linear, two-dimensional or three-dimensional array. The apparatus may include position determining means, such as a global positioning system (GPS), so that stress concentration zones can be located on the structure.

Abstract: Disclosed is the invention to conduct immuno-adsorption of free 25(OH) vitamin D from blood or blood components, notably serum or plasma, after which the absorbed material is measured. A fluoro-alkyl surfactant is used to enhance the solubility of Vitamin D and allow the measurement of free Vitamin D. The invention thus employs a binding protein to absorb the free 25(OH) vitamin D. Thereafter the binding protein comprising the 25-OH vitamin D is subjected to a competitive binding assay with a labeled vitamin D compound, preferably radiolabeled, fluorescent labeled, luminescent labeled, biotin labeled, gold labeled or enzyme labeled. Alternatively the immunocaptured 25-OH vitamin D can be quantitated by mass spectrometry.

Abstract: A transistor device is provided that comprises a base structure, and a superlattice structure overlying the base structure and comprising a multichannel ridge having sloping sidewalls. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge, wherein a parameter of at least one of the heterostructures is varied relative to other heterostructures of the plurality of heterostructures. The transistor device further comprises a three-sided gate contact that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth.

Abstract: A transistor device is provided that includes a base structure and a superlattice structure that overlies the base structure. The superlattice structure comprises a multichannel ridge having sides that extend to the base structure. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge. A three-sided gate configuration is provided that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth. The three-sided gate configuration is configured to re-distribute peak electric fields along the three-sided gate configuration to facilitate the increase in breakdown voltage of the transistor device.

Abstract: An integrated circuit is disclosed that includes a single channel device having a first portion of a single shared heterostructure overlying a substrate structure in a single channel device area, and a gate contact that is in contact with the first portion of the single shared heterostructure. The integrated circuit also includes a multichannel device comprising a second portion of the single shared heterostructure overlying the substrate structure in a multichannel device area, a barrier layer overlying the second portion of the single shared heterorstructure, and a superlattice structure overlying the barrier layer, the superlattice structure comprising a plurality of heterostructures. An isolation region in the single shared heterostructure electrical isolates the single channel device from the multichannel device.

Abstract: The present invention relates to a method for manufacturing an optical semiconductor device, particularly an LED device, and to a silicone resin composition suitable for using in the method.

Abstract: A transistor device is provided that comprises a base structure, and a superlattice structure overlying the base structure and comprising a multichannel ridge having sloping sidewalls. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge, wherein a parameter of at least one of the heterostructures is varied relative to other heterostructures of the plurality of heterostructures. The transistor device further comprises a three-sided gate contact that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth.

Abstract: An elongate element (300) for a flexible pipe body (100) and method of producing the same are disclosed. The method includes inserting a first fiber element (304) in a crush resistant elongate tube element (302), wherein the first fiber element is suitable for monitoring at least one of strain, temperature and acoustic properties; inserting a further fiber element (306) in the tube element, wherein the further fiber element is suitable for curing a matrix material (308); and inserting a matrix material into the tube element to fill at least a length of the tube element such that the first and further fibers elements within that length are surrounded by matrix material.

Abstract: A trim panel having a main body, a plurality of attachment structures and a dummy electric connector. The main body has a trim surface and an attachment surface opposite the trim surface. The plurality of attachment structures are formed on the attachment surface and are configured to contact and engage a separate panel securing the main body to the separate panel and covering an aperture formed in the separate panel. The dummy electric connector is formed on the attachment surface. The dummy electric connector is configured to receive and retain an electric connector in the absence of any electrical contacts within or on the dummy electric connector. The dummy electrical connector enables retention of a wiring harness having a connector that is not currently used, the unused connector to be connected to and retained by the dummy connector.

Abstract: The invention concerns a structural integrity assessment system and method for determining stress concentration zones in a structure, such as a pipeline. The invention comprises a magnetic field sensor array arranged to be moved relative to the structure in a known direction. A controller is provided for recording one or more magnetic field readings taken by the magnetic field sensor array at different locations in the direction of movement thereof. A processor is arranged to identify one or more feature within said values, said feature being indicative of a region of reduced structural integrity in the structure. The processor also receives a data input for a further parameter corresponding to the location of the sensor array and compares the feature with the further parameter in order to verify that said feature corresponds to a region of reduced structural integrity for the structure.

Abstract: A transistor device is provided that comprises a base structure, and a superlattice structure overlying the base structure and comprising a multichannel ridge having sloping sidewalls. The multichannel ridge comprises a plurality of heterostructures that each form a channel of the multichannel ridge, wherein a parameter of at least one of the heterostructures is varied relative to other heterostructures of the plurality of heterostructures. The transistor device further comprises a three-sided gate contact that wraps around and substantially surrounds the top and sides of the multichannel ridge along at least a portion of its depth.

Abstract: An integrated circuit is disclosed that includes a single channel device having a first portion of a single shared heterostructure overlying a substrate structure in a single channel device area, and a gate contact that is in contact with the first portion of the single shared heterostructure. The integrated circuit also includes a multichannel device comprising a second portion of the single shared heterostructure overlying the substrate structure in a multichannel device area, a barrier layer overlying the second portion of the single shared heterorstructure, and a superlattice structure overlying the barrier layer, the superlattice structure comprising a plurality of heterostructures. An isolation region in the single shared heterostructure electrical isolates the single channel device from the multichannel device.

Abstract: A device is provided that comprises a first pillar disposed in a first region and overlying a base structure, and a second pillar disposed in a second region and overlying the base structure and being spaced apart from the first pillar by a device region. A bridge is disposed in the device region with a first end connected to the first pillar and a second end connected to the second pillar. The bridge includes a top, sides, and a bottom. The bridge is formed from one or more heterostructures with an undercut opening extending from the bottom to an underlying structure. A four-sided conductive contact wraps around and substantially surrounds the bridge around its top, its sides, and its bottom along at least a portion of its length between the first and second end.

Abstract: A device is provided that comprises a first pillar disposed in a first region and overlying a base structure, and a second pillar disposed in a second region and overlying the base structure and being spaced apart from the first pillar by a device region. A bridge is disposed in the device region with a first end connected to the first pillar and a second end connected to the second pillar. The bridge includes a top, sides, and a bottom. The bridge is formed from one or more heterostructures with an undercut opening extending from the bottom to an underlying structure. A four-sided conductive contact wraps around and substantially surrounds the bridge around its top, its sides, and its bottom along at least a portion of its length between the first and second end.