Abstract: A compensator is described with higher bandwidth than a traditional differential compensator, lower area than traditional differential compensator (e.g., 40% lower area), and lower power than traditional differential compensator. The compensator includes a differential to single-ended circuitry that reduces the number of passive devices used to compensate an input signal. The high bandwidth compensator allows for faster power state and/or voltage transitions. For example, a pre-charge technique is applied to handle faster power state transitions that enables aggressive dynamic voltage and frequency scaling (DVFS) and voltage transitions. The compensator is configurable in that it can operate in voltage mode or current mode.

Abstract: An electronic system includes a circuit board including a power plane. An integrated circuit (e.g., processor) is attached to a first side of the circuit board and is arranged to receive power from the power plane. A plurality of DC-to-DC converters are attached to a second side of the circuit board and are arranged to transfer power to the power plane. Each DC-to-DC converter includes a respective voltage sense input that is electrically connected to a separate location on the power plane. A telemetry circuit is coupled to each of the plurality of DC-to-DC converters and is configured to detect a quantity of power transferred to the common power plane from each of the plurality of power conversion devices.

Abstract: Apparatuses and methods of current balancing, current sensing and phase balancing, offset cancellation, digital to analog current converter with monotonic output using binary coded input (without binary to thermometer decoder), compensator for a voltage regulator (VR), etc.

Abstract: A compensator is described with higher bandwidth than a traditional differential compensator, lower area than traditional differential compensator (e.g., 40% lower area), and lower power than traditional differential compensator. The compensator includes a differential to single-ended circuitry that reduces the number of passive devices used to compensate an input signal. The high bandwidth compensator allows for faster power state and/or voltage transitions. For example, a pre-charge technique is applied to handle faster power state transitions that enables aggressive dynamic voltage and frequency scaling (DVFS) and voltage transitions. The compensator is configurable in that it can operate in voltage mode or current mode.

Abstract: Some embodiments include apparatuses and methods of operating such apparatuses. One of the embodiments includes an input node to receive an input voltage, a circuit portion to generate first, second, and third voltages based on the input voltage, a comparator circuit to compare the first voltage with the second voltage to generate a first signal and to compare the first voltage with the third voltage to generate a second signal, and an output circuit to generate an output signal based on the first and second signals.

Abstract: A compensator is described with higher bandwidth than a traditional differential compensator, lower area than traditional differential compensator (e.g., 40% lower area), and lower power than traditional differential compensator. The compensator includes a differential to single-ended circuitry that reduces the number of passive devices used to compensate an input signal. The high bandwidth compensator allows for faster power state and/or voltage transitions. For example, a pre-charge technique is applied to handle faster power state transitions that enables aggressive dynamic voltage and frequency scaling (DVFS) and voltage transitions. The compensator is configurable in that it can operate in voltage mode or current mode.

Abstract: A compensator is described with higher bandwidth than a traditional differential compensator, lower area than traditional differential compensator (e.g., 40% lower area), and lower power than traditional differential compensator. The compensator includes a differential to single-ended circuitry that reduces the number of passive devices used to compensate an input signal. The high bandwidth compensator allows for faster power state and/or voltage transitions. For example, a pre-charge technique is applied to handle faster power state transitions that enables aggressive dynamic voltage and frequency scaling (DVFS) and voltage transitions. The compensator is configurable in that it can operate in voltage mode or current mode.

Abstract: Described are apparatuses and methods of current balancing, current sensing and phase balancing, offset cancellation, digital to analog current converter with monotonic output using binary coded input (without binary to thermometer decoder), compensator for a voltage regulator (VR), etc. In one example, apparatus comprises: a plurality of inductors coupled to a capacitor and a load; a plurality of bridges, each of which is coupled to a corresponding inductor from the plurality of inductors; and a plurality of current sensors, each of which is coupled to a bridge to sense current through a transistor of the bridge.

Abstract: Described is an apparatus which comprises: a low-side switch coupled to an output node for providing regulated voltage supply; and a first driver operable to cause the low-side switch to turn off when the output node rises above a first transistor threshold voltage. Described is also a voltage regulator which comprises: a signal generator to generate a pulse-width modulated (PWM) signal; a bridge having a low-side switch coupled to an output node for providing regulated voltage supply according to the PWM signal; a first driver operable to cause the low-side switch to turn off when the output node rises above a first transistor threshold voltage; and a bridge controller to provide control signals to the first driver. The voltage regulator may operate without diode clamps and its operation is self-timed. The voltage regulator also provides tolerance against process variation.

Abstract: Apparatuses and methods of current balancing, current sensing and phase balancing, offset cancellation, digital to analog current converter with monotonic output using binary coded input (without binary to thermometer decoder), and compensator for a voltage regulator (VR), are provided. In one example, an apparatus includes: a plurality of inductors coupled to a capacitor and a load; a plurality of bridges, each of which is coupled to a corresponding inductor from the plurality of inductors; and a plurality of current sensors, each of which is coupled to a bridge to sense current through a transistor of the bridge.

Abstract: Some embodiments include apparatuses and methods of operating such apparatuses. One of the embodiments includes an input node to receive an input voltage, a circuit portion to generate first, second, and third voltages based on the input voltage, a comparator circuit to compare the first voltage with the second voltage to generate a first signal and to compare the first voltage with the third voltage to generate a second signal, and an output circuit to generate an output signal based on the first and second signals.

Abstract: Embodiments are generally directed to integrated passive devices on chip. An embodiment of a device includes a semiconductor die; a semiconductor die package, a first side of the package being coupled with the semiconductor die; and one or more separate dies to provide passive components for operation of the semiconductor die, wherein the passive components for operation of the semiconductor die includes inductors.

Abstract: Some embodiments include apparatuses and methods of operating such apparatuses. One of the embodiments includes an input node to receive an input voltage, a circuit portion to generate first, second, and third voltages based on the input voltage, a comparator circuit to compare the first voltage with the second voltage to generate a first signal and to compare the first voltage with the third voltage to generate a second signal, and an output circuit to generate an output signal based on the first and second signals.

Abstract: Some embodiments include apparatuses and methods using the apparatuses. Some of the apparatuses include a phase frequency detector to generate output information having a value based on a relationship between a first clock signal and a second clock signal, a memory element to store the values of the output information, a digital control oscillator to generate the second clock signal having a phase and frequency based on a digital code, the digital code having a value based on control information, and circuitry to generate the control information based on conditions determined at least from the values stored in the memory element.

Abstract: Described herein is an apparatus and system for generating a signal with phase angle configuration. The apparatus comprises an array of switch-resistors, each switch resistor to receive a control signal, wherein the array of switch-resistors to generate an output signal; and a circuit to configure phase angle of the output signal. The apparatus can be used for different package and inductor configurations. The apparatus provides flexibility to mitigate switching noise by adjusting phase angles, and provides the ability to enable and disable switch-resistors on the fly without ripples. The apparatus also saves power consumption by selectively turning off switch-resistors when phases are disabled. The output signal of the apparatus has smooth triangular waveforms for improving the quality of power supply generated using the output signal. Overall, the apparatus exhibits reduced sensitivity to process variations compared to traditional signal generators.

Abstract: Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

Abstract: Some embodiments include apparatuses and methods using the apparatuses. Some of the apparatuses include a phase frequency detector to generate output information having a value based on a relationship between a first clock signal and a second clock signal, a memory element to store the values of the output information, a digital control oscillator to generate the second clock signal having a phase and frequency based on a digital code, the digital code having a value based on control information, and circuitry to generate the control information based on conditions determined at least from the values stored in the memory element.

Abstract: Described are apparatuses and methods of current balancing, current sensing and phase balancing, offset cancellation, digital to analog current converter with monotonic output using binary coded input (without binary to thermometer decoder), compensator for a voltage regulator (VR), etc. In one example, apparatus comprises: a plurality of inductors coupled to a capacitor and a load; a plurality of bridges, each of which is coupled to a corresponding inductor from the plurality of inductors; and a plurality of current sensors, each of which is coupled to a bridge to sense current through a transistor of the bridge.

Abstract: Described are apparatuses and methods of current balancing, current sensing and phase balancing, offset cancellation, digital to analog current converter with monotonic output using binary coded input (without binary to thermometer decoder), compensator for a voltage regulator (VR), etc. In one example, apparatus comprises: a plurality of inductors coupled to a capacitor and a load; a plurality of bridges, each of which is coupled to a corresponding inductor from the plurality of inductors; and a plurality of current sensors, each of which is coupled to a bridge to sense current through a transistor of the bridge.

Abstract: Embodiments are generally directed to integrated passive devices on chip. An embodiment of a device includes a semiconductor die; a semiconductor die package, a first side of the package being coupled with the semiconductor die; and one or more separate dies to provide passive components for operation of the semiconductor die, wherein the passive components for operation of the semiconductor die includes inductors.