Patents by Inventor Govindarajan Natarajan

Govindarajan Natarajan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6562169
    Abstract: A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet having a width, length, thickness, a first side and a second side; b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: May 13, 2003
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Raschid J. Bezama, Jon A. Casey, Amy C. Flack, Robert W. Pasco, Arnold W. Terpening, Renee L. Weisman
  • Patent number: 6533888
    Abstract: The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the present invention enables the screened features to be buried partially or fully with flat surface being available for high yielding post-sinter operations.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: March 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Edward James Pega
  • Publication number: 20030041947
    Abstract: A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the discrete non-densifying structure will locally control the dimensions of the free sintered multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the discrete non-densifying structure in the active area or in the kerf area between the individual product ups prior to sintering.
    Type: Application
    Filed: August 31, 2001
    Publication date: March 6, 2003
    Applicant: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Raschid Jose Bezama
  • Patent number: 6509687
    Abstract: The present invention relates generally to a new electrode forming metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
    Type: Grant
    Filed: November 30, 1999
    Date of Patent: January 21, 2003
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Raschid J. Bezama, John U. Knickerbocker, Robert W. Pasco
  • Patent number: 6494758
    Abstract: The present invention relates generally to a new metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: December 17, 2002
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, John U. Knickerbocker, Srinivasa S. N. Reddy, Rao V. Vallabhaneni
  • Patent number: 6459039
    Abstract: An electronic package assembly for electrical interconnection between two electronic modules having differing conductive array parameters is disclosed. The electronic package assembly includes two electronic modules, providing between the two electronic modules an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: October 1, 2002
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Govindarajan Natarajan, Robert W. Pasco
  • Patent number: 6423174
    Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.
    Type: Grant
    Filed: June 21, 1996
    Date of Patent: July 23, 2002
    Assignee: International Business Machines Corporation
    Inventors: Jon A. Casey, Govindarajan Natarajan, Robert W. Pasco, Vincent P. Peterson
  • Publication number: 20020092600
    Abstract: A method of processing greensheets, wherein the following steps are performed:
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Applicant: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Raschid J. Bezama, Jon A. Casey, Amy C. Flack, Robert W. Pasco, Arnold W. Terpening, Renee L. Weisman
  • Patent number: 6416849
    Abstract: The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: July 9, 2002
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Govindarajan Natarajan
  • Patent number: 6413339
    Abstract: The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: July 2, 2002
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Jon A. Casey, Martin E. Klepeis, John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita, Subhash L. Shinde
  • Patent number: 6406778
    Abstract: The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.
    Type: Grant
    Filed: July 21, 2000
    Date of Patent: June 18, 2002
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Krishna G. Sachdev, Abubaker S. Shagan
  • Patent number: 6395337
    Abstract: A multilayer ceramic substrate contains a ceramic coating which is different in composition than the main body of the multilayer ceramic substrate to control camber of the multilayer ceramic substrate during sintering. The primary component of the ceramic coating is a secondary component of the main body of the multilayer ceramic substrate.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: May 28, 2002
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Govindarajan Natarajan, Robert W. Pasco
  • Patent number: 6358439
    Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: March 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: Farid Youssif Aoude, Lawrence Daniel David, Renuka Shastri Divakaruni, Shaji Farooq, Lester Wynn Herron, Hal Mitchell Lasky, Anthony Mastreani, Govindarajan Natarajan, Srinivasa S. N. Reddy, Vivek Madan Sura, Rao Venkateswara Vallabhaneni, Donald Rene Wall
  • Patent number: 6332782
    Abstract: An interconnect substrate structure for electrical interconnection between two electronic modules having differing conductive array parameters. The interconnect structure comprises an interposer having a top surface and a bottom surface; a first set of conductive arrays having a first conductive array parameter on the top surface, and a second set of conductive arrays having a second conductive array parameter on the bottom surface, the second conductive array and the first conductive array having differing parameters. A plurality of conductors traverses a thickness of the interposer, with the conductors comprising a conductive material optionally coated with a dielectric material, the conductors having a first end at the first conductive arrays and a second end at the second conductive arrays, whereby the conductors connecting the first and second conductive arrays therein are adapted to spatially transform the differing parameters to provide an electrical interconnection.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: December 25, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Govindarajan Natarajan, Robert W. Pasco
  • Patent number: 6319554
    Abstract: The present invention relates generally to a CVD (Chemical Vapor Deposition) process where at least one source metal, such as, nickel (Ni) or alloys thereof, for example, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving the source metal, such as, refractory metal, for example, molybdenum, tungsten or alloys thereof, using at least one gaseous Iodide source, such as, an iodic fluid, for example, hydriodic acid gas. The source metal is securely held in place by at least one high strength inert material.
    Type: Grant
    Filed: June 10, 1999
    Date of Patent: November 20, 2001
    Assignee: International Business Machine Corporation
    Inventors: Govindarajan Natarajan, Robert W. Pasco
  • Publication number: 20010030013
    Abstract: The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.
    Type: Application
    Filed: May 31, 2001
    Publication date: October 18, 2001
    Applicant: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Govindarajan Natarajan
  • Patent number: 6284079
    Abstract: The surface metallurgy of a green sheet may be controlled during processing to provide an increased resistance to low strength structural failure of the metal-ceramic interface under an input-output pad structure and increased pin-pull strength of input-output pads on alumina multilayer ceramic substrates. The surface area on a green sheet in the region where an input-output pad is to be screened is roughened in order to increase the contact surface area between the green sheet and the input-output pad. The mechanical interlock between the metal-ceramic interface is strengthened by the increased number of bonding points between the green sheet and the input-output metallurgy and the use of different screening materials.
    Type: Grant
    Filed: March 3, 1999
    Date of Patent: September 4, 2001
    Assignee: International Business Machines Corporation
    Inventors: Raschid J. Bezama, Govindarajan Natarajan
  • Patent number: 6261927
    Abstract: This invention relates generally to a new method of forming semiconductor substrates with defect-free surface metallurgical features. In particular, the invention related to a method for providing surface protected ceramic green sheet laminates using at least one thermally depolymerizable surface layer. More particularly, the invention encompasses a method for fabricating semiconductor substrates wherein a thermally depolymerizable/decomposable surface film is placed over a ceramic green sheet stack or assembly prior to lamination and caused to conform to the surface topography of the green sheet during lamination. The invention also encompasses a method for fabricating surface protected green sheet laminates which can be sized or diced without causing process related defects on the ceramic surface.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: July 17, 2001
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, Richard F. Indyk, Vincent P. Peterson, Krishna G. Sachdev
  • Patent number: 6258192
    Abstract: The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. At least one organic adhesion barrier is used to build the multi-layer ceramic laminates. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns secured to at least one thicker green sheet using at least one organic adhesion barrier.
    Type: Grant
    Filed: February 10, 1999
    Date of Patent: July 10, 2001
    Assignee: International Business Machines Corporation
    Inventor: Govindarajan Natarajan
  • Patent number: 6254925
    Abstract: The present invention discloses at least one source metal that is embedded in at least one inert material to form a stand-alone structure and process thereof. It is preferred that the source metal is nickel or alloy thereof, and the inert material is at least one ceramic.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: July 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Govindarajan Natarajan, John U. Knickerbocker, Robert A. Rita