Abstract: The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.

Abstract: Disclosed is a method of making a multilayer ceramic product with thin layers, the method including the steps of: (a) providing a thick ceramic greensheet and a plurality of thin ceramic greensheets; (b) aligning and stacking the thin ceramic greensheet on the thick ceramic greensheet; (c) bonding the thin ceramic greensheet to the thick ceramic greensheet; (d) aligning and stacking one thin ceramic greensheet on the previous thin ceramic greensheet; (e) bonding the thin ceramic greensheet in step (d) to the previous thin ceramic greensheet; and (f) simultaneously forming at least one unfilled via in the stack of thick and thin ceramic greensheets.

Abstract: The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the present invention enables the screened features to be buried partially or fully with flat surface being available for high yielding post-sinter operations.

Abstract: The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the present invention enables the screened features to be buried partially or fully with flat surface being available for high yielding post-sinter operations.

Abstract: A process and apparatus are provided for preparing a release layer suitable for facilitating release of green ceramic laminates from a lamination fixture. The process comprises applying an electrostatic charge to at least one variably electrostatically chargeable portion of at least one lamination fixture and dispensing a layer of ceramic particulates, glass particulates or glass-ceramic particulates onto the charged portion of the lamination fixture to form a release layer on the lamination fixture. The apparatus provides a particulate dispenser for dispensing a layer of particulates of ceramic, glass, or ceramic-glass mixture, at least one lamination fixture having at least one variably electrostatically chargeable portion disposed in particulate receiving communication with the particulate dispenser; and a variable voltage electrostatic generator in electrical communication with the at least one chargeable portion of the lamination fixture.

Abstract: The present invention relates generally to a new apparatus and method for forming non-planar surfaces in substrates. More particularly, the invention encompasses an apparatus and a method for fabricating non-planar surfaces in semiconductor substrates wherein at least one zero compression set pad, such as a closed cell porous pad in combination with at least one elastic pad is placed over the non-planar surface prior to lamination and is caused to conform to the contour of the non-planar surface, thus preventing collapse of, or damage to, the non-planar features, such as, shelves or corners during the lamination process. After the lamination process, the zero compression set pad are conveniently removed from the non-planar surface area without causing any damage to the non-planar surface features, such as, shelves or corners or having any paste pull-outs. These zero compression set pads can be reused multiple number of times to form these MLC cavity substrates or similar other structures or features.

Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Abstract: The present invention relates generally to a new multi-density ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of thicker green sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin punched green sheets were tacked/bonded to thicker punched and screened green sheets to form a sub-structure which had excellent stability in screening and enabled further processing.

Abstract: A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Abstract: The apparatus of the present invention enables the lamination of a plurality of planar and non-planar objects in a lamination apparatus where multiple frames per platen and multiple platens per cycle are used. With the preferred embodiment, lamination of multiple products of various thicknesses is achieved, while simultaneously maintaining the pressure uniformity across all stacks. The result is achieved by using a height equalizing lamination punch head, control logic and verification devices.

Abstract: Disclosed is an apparatus for laminating a plurality of ceramic greensheets which includes a frame, a bottom plate at one end of the frame, a punch at a second end of the frame, and a non-metallic pad within the frame and between the bottom plate and punch. In operation, a plurality of ceramic greensheets are placed within the frame, the non-metallic pad is placed underneath of, or on top of, the plurality of ceramic greensheets, and pressure is applied to the non-metallic pad and the plurality of ceramic greensheets wherein the non-metallic pad causes the lamination pressure to be uniformly distributed across the plurality of ceramic greensheets. Also disclosed is a method for laminating a plurality of ceramic greensheets using the non-metallic pad.

Abstract: A method and apparatus for processing sheets, includes placing a sheet on a carrier to form a sheet/carrier structure, sizing the sheet/carrier structure, stacking the sheet/carrier structure in a stacking apparatus having a second sheet stacked in advance therein, so that the sheet contacts the second sheet, aligning the sheets with pins, tacking the sheet to the second sheet and removing the carrier.

Abstract: The apparatus of the present invention enables the lamination of a plurality of planar and non-planar objects in a lamination apparatus where multiple frames per platen and multiple platens per cycle are used. With the preferred embodiment, lamination of multiple products of various thicknesses is achieved, while simultaneously maintaining the pressure uniformity across all stacks. The result is achieved by using a height equalizing lamination punch head, control logic and verification devices.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

Abstract: A method and apparatus for processing sheets, includes placing a sheet on a carrier to form a sheet/carrier structure, sizing the sheet/carrier structure, stacking the sheet/carrier structure in a stacking apparatus having a second sheet stacked in advance therein, so that the sheet contacts the second sheet, aligning the sheets with pins, tacking the sheet to the second sheet and removing the carrier.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities without using an insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a cured thick compressible elastic pad is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves or corners during the lamination process. After the lamination process, the cured thick compressible elastic pad is conveniently removed from the cavity area without causing any damage to the cavity shelves or corners or having any paste pull-outs. This pad can be reused multiple number of times to form these MLC cavity substrates.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates using at least one flexible preform insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) substrates using at least one flexible preform insert that is inserted into the cavity of the MLC substrate prior to lamination and this insert helps in preventing the collapse of the shelves of the cavity during this lamination process. After the lamination process the inventive temporary preform insert is then removed.

Abstract: The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.