Abstract: The present invention relates generally to a new apparatus and method for simultaneously laminating a plurality of substrates having at least one cavity. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic). A membrane with or without an opening is placed on the top surface of the unlaminated green sheet having at least one cavity and then standard pressure is applied to laminate the green sheets, while simultaneously a counter pressure is applied in the cavity to prevent the cavity from deforming or collapsing. This is done to simultaneously form a plurality of cavity substrates.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

Abstract: The present invention relates generally to a new apparatus for forming cavities without using an insert. More particularly, the invention encompasses apparatus for fabricating cavities in MLC (multi-layer ceramic) without using inserts.

Abstract: A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.

Abstract: A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.

Abstract: A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.

Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

Abstract: The present invention relates generally to a new method for forming cavities without using an insert. More particularly, the invention encompasses method for fabricating cavities in MLC (multi-layer ceramic) without using inserts.

Abstract: A sealed composite ceramic structure is formed by first forming a plurality of composite green sheets. Each of the green sheets is a composite structure comprising a central portion of partially densifiable material and an outer portion of fully densifiable material. Next, top and bottom green sheets of fully densifiable material are formed. The greensheets are then stacked to form a laminated structure in the following order: the bottom green sheet, the plurality of composite green sheets, and the top green sheet. The substrate laminate is sintered to form the sealed structure having a porous central portion. The composite structure has particular application to ceramic substrates for mounting semiconductor devices requiring low dielectric constant substrates, but the structure also has applications in fluid processing using porous laminated structures. In both applications, the creation of a porous ceramic body with solid, sealed edges and/or external surfaces hold significant advantages.

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricating a large ceramic greensheet article as well as a large ceramic substrate article.

Abstract: A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Abstract: There is disclosed a sintering arrangement for enhancing the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

Abstract: A method for forming a co-fired glass ceramic structure including the steps of:forming at least one green sheet of a first crystallizable glass in a thermally decomposable binder;metallizing the green sheet with a pattern of conductive paste including conductive metal, a second crystallizable glass and a thermally decomposable binder, the pattern including at least one via;firing the green sheet according to the following firing cycle steps:a. preheating the green sheet to a first temperature in a furnace with a neutral or reducing ambient so as to effect pyrolysis of the thermally decomposable binders, wherein the first temperature is insufficient to coalesce the first crystallizable glass or the conductive paste;b. introducing a steam ambient into the furnace and then heating the green sheet in the furnace at the first temperature to burn off the pyrolyzed binders;c.

Abstract: There is disclosed a partially sintered setter tile for use in the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in a partially sintered setter tile in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate and partially sintered setter tile are sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.

Abstract: There is disclosed the enhancement of the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.