Abstract: A non-volatile memory apparatus includes a first hydrogen reservoir, which is electrically conductive; a charge of hydrogen, which is captured in the first hydrogen reservoir; a dielectric layer that has a first side that is adjacent to the first hydrogen reservoir and a second side that is opposite from the first hydrogen reservoir; a second hydrogen reservoir that is adjacent to the second side of the dielectric layer, is electrically conductive, and has a side that is opposite from the dielectric layer; and a piezoelectric layer that is adjacent to the side of the second hydrogen reservoir and that has a side that is opposite from the second hydrogen reservoir.

Abstract: A device structure for a phase-change memory device is disclosed. The device structure includes a top electrode, a phase-change material that is recessed between two layers of resistive liner material, and a conductive material. The conductive material contacts the sidewall of the top electrode, the sidewall of the phase-change material, and a portion of a top surface and a bottom surface of each of the two layers of the resistive liner material. The device structure includes a heater contacting a bottom electrode and the bottom layer of the resistive liner material. The heater is in a first bilayer dielectric. A second bilayer dielectric is under the top electrode.

Abstract: An interconnect structure including conducting layers of topological semi-metals and/or topological insulators. To increase charge carrier density in the conducting layers, a charge carrier doping layer present on at least one surface of the one or more conductive layers of topological semi-metals. The charge carrying doping layers have a charge carrier density greater than the topological semi-metals and/or topological insulators of the one or more conductive layers.

Abstract: A non-volatile memory (NVM) structure is provided including a proximity heater or a localized heater that is configured to generate Joule heating to increase temperature of a ferroelectric material layer of a ferroelectric memory device higher than a Currie temperature of the ferroelectric material layer. The Joule heating is trigged when tampering in the NVM structure is detected and as a result of the Joule heating memory erasure can occur.

Abstract: An approach for representing both positive and negative weights in neuromorphic computing is disclosed. The approach leverages a double gate FeFET (ferroelectric field effect transistor) device. The device leverages a double-gate FeFET with four terminals (two separate gates and source and drain) and ferroelectric gate dielectric. The device may have a junction-less channel. A synaptic weight is programmed by biasing one of the two gates. The store weight is sensed via a current flow from source to drain. A pre-defined bias is applied to the other gate during the sensing, such that a reference current is subtracted from the drain current. The net current for sensing is current from the synaptic devices subtracted by the pre-defined reference current.

Abstract: A semiconductor device includes a ferroelectric random-access memory (FeRAM) cell. The FeRAM includes a ferroelectric dielectric that is annealed to attain its ferroelectric phase by an induced current flow and heating process. The current flow may be induced though a temporary wire that causes heating of the FeRAM cell. The resulting heating or anneal of the ferroelectric dielectric may crystalize the ferroelectric dielectric to embody or result in having ferroelectric properties. The induced current flow and heating process is substantially local to the FeRAM cell, and to ferroelectric dielectric therein, as opposed to a global heating or annealing process in which the entire semiconductor device, or a relatively larger region of semiconductor device, is heated to the requisite annealing temperature of ferroelectric dielectric.

Abstract: A method for forming a nonvolatile PCM logic device may include providing a PCM film component having a first end contact distally opposed from a second end contact, positing a first proximity adjacent to a first surface of the PCM film component, positing a second proximity heater adjacent to a second surface of the PCM film component, wherein the first proximity heater and the second proximity heater are electrically isolated from the PCM film component. The method may further include applying a combination of pulses to one or more of the first proximity heater and the second proximity heater to change a resistance value of the PCM film component corresponding to a logic truth table. Further, the method may include simultaneously applying a first combination of reset pulses to program, or set pulses to initialize, the PCM film component, to the first proximity heater and the second proximity heater.

Abstract: A semiconductor device is provided. The semiconductor device includes a resistive memory device, and at least a first photodetector and a second photodetector positioned adjacent to the resistive memory device to allow for measurement of the intensity of photon emission from a filament of the resistive memory device.

Abstract: A random number generator comprising resistive random-access memory (RRAM) devices including: a first electrode; a second electrode; a third electrode located between the first and second electrode; at least one electrically insulating layer separating the first electrode and the second electrode from the third electrode, wherein the at least one electrically insulating layer has a substantially uniform thickness; a first filament that is current conducting and extends through the at least one electrically insulating layer; a second filament is located in the at least one electrically insulating layer and does not extend through the at least one electrically insulating layer; a voltage source configured to apply voltage to at least one of the first electrode and the second electrode; and a voltage sensor configured to sense voltage of the third electrode in order to determine which one of the first filament or the second filament is more resistive.

Abstract: A physical unclonable function device includes alternating regions of programable material and electrically conductive regions. The regions of programable material are configured to switch resistance upon receiving an electric pulse. An electric pulse applied between two outer electrically conductive regions of the alternating regions will switch the resistance of at least one region of programmable material. The alternating regions may include a plurality of the electrically conducting regions and a region of the programable material disposed between each of the plurality of electrically conductive regions. The resistance of each of the regions of programable material is selectively variable in at least a portion thereof as a result of the electric pulse flowing therethrough. The resistance value of the programable material region may be a readable value as a state of the device. The regions of programmable material may be formed of a phase change material or an oxide.

Abstract: A structure for culturing cells includes growth medium regions on a surface of the structure. Each of the growth medium regions includes a growth medium surface configured to receive and promote growth in a cell that is being cultured. The structure includes a non-growth medium. The non-growth medium includes a non-growth medium surface configured to receive the cell that is being cultured.

Abstract: Resistive memory devices are provided which are configured to mitigate resistance drift. A device comprises a phase-change element, a resistive liner, a first electrode, a second electrode, and a third electrode. The resistive liner is disposed in contact with a first surface of the phase-change element. The first electrode is coupled to a first end portion of the resistive liner. The second electrode is coupled to a second end portion of the resistive liner. The third electrode is coupled to the first surface of the phase-change element.

Abstract: Methods and structures for fabricating a semiconductor device that includes a reduced programming current phase change memory (PCM) are provided. The method includes forming a bottom electrode. The method further includes forming a PCM and forming a conductive bridge filament in a dielectric to serve as a heater for the PCM. The method also includes forming a top electrode.

Abstract: A tunable metasurface is provided. The tunable metasurface includes a mirror, a dielectric layer disposed on the mirror, a metallic antenna and a phase change material (PCM) layer. The PCM layer is interposed between the dielectric layer and the metallic antenna. The PCM layer is configured to be amorphous or crystalline. The mirror, the dielectric layer, the metallic antenna and the PCM layer cooperatively form a Fabry Perot cavity in which light incident on the metallic antenna from free space is reflected between the mirror and the metallic antenna. The PCM layer has blanket dimensions relative to those of the metallic antenna such that the Fabry Perot cavity is critically coupled with the free space when the PCM layer is only one of amorphous and crystalline.

Abstract: A unit structure of non-volatile memory is provided. The unit structure includes a substrate, an n-type ferroelectric field effect transistor (FeFET) and a p-type FeFET disposed on the substrate, first circuitry by which sources of the n-type FeFET and the p-type FeFET are electrically coupled in parallel downstream from a common terminal and second circuitry by which top electrodes of the n-type FeFET and the p-type FeFET are electrically coupled in parallel upstream of a common terminal.

Abstract: A structure for culturing cells includes growth medium regions on a surface of the structure. Each of the growth medium regions includes a growth medium surface configured to receive and promote growth in a cell that is being cultured. The structure includes a non-growth medium. The non-growth medium includes a non-growth medium surface configured to receive the cell that is being cultured.

Abstract: A solid-state switch structure including a first solid-state material having a programable electrical resistance comprising a high electrical resistance obtained following a first type programming pulse and a low electrical resistance obtained following a second type programming pulse, a second solid-state material having a programable electrical resistance comprising a high electrical resistance obtained following said second type programming pulse and a low electrical resistance obtained following said first type programming pulse, a first contact made to a first end of said first solid-state material, a second contact made to a first end of said second solid-state material, a third contact made to a second end of said first solid-state material and to a second end of said second solid-state material.

Abstract: Variable resistance devices and neural network processing systems include a first phase change memory device that has a first material that increases resistance when a set pulse is applied. A second phase change memory device has a second material that decreases resistance when a set pulse is applied.

Abstract: A semiconductor device is provided. The semiconductor device includes a resistive memory device, and at least a first photodetector and a second photodetector positioned adjacent to the resistive memory device to allow for measurement of the intensity of photon emission from a filament of the resistive memory device.

Abstract: A random number generator comprising resistive random-access memory (RRAM) devices including: a first electrode; a second electrode; a third electrode located between the first and second electrode; at least one electrically insulating layer separating the first electrode and the second electrode from the third electrode, wherein the at least one electrically insulating layer has a substantially uniform thickness; a first filament that is current conducting and extends through the at least one electrically insulating layer; a second filament is located in the at least one electrically insulating layer and does not extend through the at least one electrically insulating layer; a voltage source configured to apply voltage to at least one of the first electrode and the second electrode; and a voltage sensor configured to sense voltage of the third electrode in order to determine which one of the first filament or the second filament is more resistive.