Abstract: A non-volatile memory device includes a data storage structure coupled between first and second conductive lines of the memory device. The data storage structure includes a conductive lower heater element, a data storage pattern, and a conductive upper heater element sequentially stacked. At least one sidewall surface of the data storage pattern is coplanar with a sidewall surface of the upper heater element thereabove and a sidewall surface of the lower heater element therebelow. Related fabrication methods are also discussed.

Abstract: In a method of forming a pattern, a first mask layer and a first sacrificial layer may be sequentially formed on an object layer. The first sacrificial layer may be partially etched to form a first sacrificial layer pattern. A second sacrificial layer pattern may be formed on the first mask layer. The second sacrificial layer pattern may enclose a sidewall of the first sacrificial layer pattern. The first sacrificial layer pattern may then be removed. The first mask layer may be partially etched using the second sacrificial layer pattern as an etching mask to form a first mask layer pattern. The object layer may be partially etched using the first mask layer pattern as an etching mask.

Abstract: A diode may be foamed within a molding layer on a substrate. A conductive buffer pattern having a greater planar area than the diode may be on the diode and molding layer. An electrode structure may be on the conductive buffer pattern. A data storage pattern may be on the electrode structure. One lateral surface of the conductive buffer pattern may be vertically aligned with one lateral surface of the electrode structure.

Abstract: A sacrificial pattern is formed to partially cover the pipe-shaped electrode. A sacrificial spacer is formed on a lateral surface of the sacrificial pattern. The sacrificial spacer extends across the pipe-shaped electrode. The sacrificial spacer has a first side and a second side opposite the first side. The sacrificial pattern is removed to expose the pipe-shaped electrode proximal to the first and second sides of the sacrificial spacer. The pipe-shaped electrode exposed on both sides of the sacrificial spacer may be primarily trimmed. The pipe-shaped electrode is retained under the sacrificial spacer to form a first portion, and a second portion facing the first portion. The second portion of the pipe-shaped electrode is secondarily trimmed. The sacrificial spacer is removed to expose the first portion of the pipe-shaped electrode. A data storage plug is formed on the first portion of the pipe-shaped electrode.

Abstract: A phase change memory device includes an impurity region on a substrate, the impurity region being in an active region, a metal silicide pattern at least partially buried in the impurity region, a diode on the impurity region, a lower electrode on the diode, a phase change layer pattern on the lower electrode, and an upper electrode on the phase change layer pattern.

Abstract: A phase-change memory device includes a word line on a substrate and a phase-change memory cell on the word line and comprising a phase-change material pattern. The device also includes a non-uniform conductivity layer pattern comprising a conductive region on the phase-change material pattern and a non-conductive region contiguous therewith. The device further includes a bit line on the conductive region of the non-uniform conductivity layer pattern. In some embodiments, the phase-change memory cell may further include a diode on the word line, a heating electrode on the diode and wherein the phase-change material layer is disposed on the heating electrode. An ohmic contact layer and a contact plug may be disposed between the diode and the heating electrode.

Abstract: Memory devices and methods of forming memory devices including forming a plurality of preliminary electrodes, each of the plurality of preliminary electrodes including a protruding region, protruding from a first mold insulating layer, forming a second mold insulating layer on the first mold insulating layer, removing at least a portion of the plurality of preliminary electrodes to form a plurality of openings in the second mold insulating layer and a plurality of lower electrodes, and forming a plurality of memory elements in the plurality of openings. Memory devices and methods of forming memory devices including forming one or more insulating layers on sidewalls of all or part of a plurality of lower electrodes and/or a plurality of memory elements.

Abstract: A method of fabricating an integrated circuit device includes forming first and second patterns extending in first and second directions, respectively, on a target layer. The first patterns comprise a metal oxide and/or metal silicate material having an etch selectivity with respect to that of the target layer. The second patterns comprise a material having an etch selectivity with respect to those of the first patterns and the target layer. The target layer is selectively etched using the first patterns and the second patterns as an etch mask to define holes respectively extending through the target layer to expose a layer therebelow. At least one of the first and second patterns is formed using respective mask patterns formed by a photolithographic process, and the at least one of the first and second patterns have a finer pitch than that of the respective mask patterns.

Abstract: A method of manufacturing the semiconductor device includes sequentially forming first to third mold layer patterns on a substrate and spaced apart from each other , forming a first semiconductor pattern between the first mold layer pattern and the second mold layer pattern, and a second semiconductor pattern between the second mold layer pattern and the third mold layer pattern, forming a first trench between the first mold layer pattern and the third mold layer pattern by removing a portion of the second mold layer pattern and portions of the first and second semiconductor patterns, depositing a material for a lower electrode conformally along side and bottom surfaces of the first trench, and forming first and second lower electrodes separated from each other on the first and second semiconductor patterns, respectively, by removing a portion of the material for a lower electrode positioned on the second mold layer pattern.

Abstract: A phase change material layer includes a Ge-M-Te (GMT) ternary phase change material, where Ge is germanium, M is a heavy metal, and Te is tellurium. The GMT ternary phase change material may also include a dopant.

Abstract: Provided is a non-volatile memory device including a bottom electrode disposed on a substrate and having a lower part and an upper part. A conductive spacer is disposed on a sidewall of the lower part of the bottom electrode. A nitride spacer is disposed on a top surface of the conductive spacer and a sidewall of the upper part of the bottom electrode. A resistance changeable element is disposed on the upper part of the bottom electrode and the nitride spacer. The upper part of the bottom electrode contains nitrogen (N).

Abstract: The present invention provides methods of forming a phase-change material layer including providing a substrate and a chalcogenide target including germanium (Ge), antimony (Sb) and tellurium (Te) at a temperature wherein tellurium is volatilized and antimony is not volatilized, and performing a sputtering process to form the phase-change material layer including a chalcogenide material on the substrate. Methods of manufacturing a phase-change memory device using the same are also provided.

Abstract: Provided is a method of forming a semiconductor memory cell in which in order to store two bits or more data in a memory cell, three or more bottom electrode contacts (BECs) and phase-change materials (GST) have a parallel structure on a single contact plug (CP) and set resistances are changed depending on thicknesses (S), lengths (L) or resistivities (?) of the three or more bottom electrode contacts, so that a reset resistance and three different set resistances enable data other than in set and reset states to be stored. Also, a method of forming a memory cell in which three or more phase-change materials (GST) have a parallel structure on a single bottom electrode contact, and the phase-change materials have different set resistances depending on composition ratio or type, so that four or more different resistances can be implemented is provided.

Abstract: A semiconductor device includes a switching device disposed on a substrate. A buffer electrode pattern is disposed on the switching device. The buffer electrode pattern includes a first region having a first vertical thickness, and a second region having a second vertical thickness smaller than the first vertical thickness. A lower electrode pattern is disposed on the first region of the buffer electrode pattern. A trim insulating pattern is disposed on the second region of the buffer electrode pattern. A variable resistive pattern is disposed on the lower electrode pattern.

Abstract: The present invention relates to a photovoltaic module characterized by comprising a heat radiating sheet overlaid with a ceramic coating layer, which is attached to a conventional photovoltaic module. In a method of increasing heat radiation with the aid of the ceramic coating layer provided on both sides or one side of the heat radiating sheet, heat generated by a solar cell due to the differences in thermal emissivity, thermal shear rate and surface area of a material is transferred to a solar EVA and then a heat radiating sheet thin plate that serves as a carrier, and returns back to the ceramic coating layer for emission. A high thermal emissivity is obtained by having a so-called heat transfer phenomenon in one direction, which resultantly improves a heat radiation performance and increases the refrigeration efficiency of the photovoltaic module and its peripheral devices to thus lower the internal temperature.

Abstract: Methods of fabricating integrated circuit memory cells and integrated circuit memory cells are disclosed. An integrated circuit memory cell can be fabricated by forming an ohmic layer on an upper surface of a conductive structure and extending away from the structure along at least a portion of a sidewall of an opening in an insulation layer. An electrode layer is formed on the ohmic layer. A variable resistivity material is formed on the insulation layer and electrically connected to the electrode layer.

Abstract: Provided is a method of fabricating a phase-change memory device. The phase-change memory device includes a memory cell having a switching device and a phase change pattern. The method includes; forming a TiC layer on a contact electrically connecting the switching device using a plasma enhanced cyclic chemical vapor deposition (PE-cyclic CVD) process, patterning the TiC layer to form a lower electrode on the contact, and forming the phase-change pattern on the lower electrode.

Abstract: A conductive pattern on a substrate is formed. An insulating layer having an opening exposing the conductive pattern is formed. A bottom electrode is formed on the conductive pattern and a first sidewall of the opening. A spacer is formed on the bottom electrode and a second sidewall of the opening. The spacer and the bottom electrode are formed to be lower than a top surface of the insulating layer. A data storage plug is formed on the bottom electrode and the spacer. The data storage plug has a first sidewall aligned with a sidewall of the bottom electrode and a second sidewall aligned with a sidewall of the spacer. A bit line is formed on the data storage plug.

Abstract: The present invention relates to a method for treating or reducing the development of a hyperproliferative disorder, which comprises administering to a subject a composition, which comprises as an active ingredient the compound represented by the Formula 1: wherein R1, R2, R3, R4, R5, R6 and R7 independently represent hydrogen, halo, hydroxyl, cyano, amino, nitro, nitroso, carboxyl, C1-C12 alkyl, C2-C6 alkenyl, C3-C8 cycloalkyl, C5-C7 cycloalkenyl, C1-C6 alkylamino, C1-C6 alkoxy, aryl, heteroaryl, arylalkyl, arylalkenyl or alkylaryl; X and Y independently represent hydrogen, oxygen, or sulfur, bound to a carbon atom via a single or double bond; Z represents hydrogen, halo, hydroxyl, cyano, amino, nitro, nitroso, carboxyl, C1-C12 alkyl, C2-C6 alkenyl, C3-C8 cycloalkyl, C5-C7 cycloalkenyl, C1-C6 alkylamino, C1-C6 alkoxy, aryl, heteroaryl, arylalkyl, arylalkenyl, alkylaryl or —NH—R8; R8 represents hydrogen, halo, hydroxyl, cyano, amino, nitro, nitroso, carboxyl, C1-C12 alkyl, C2-C6 alkenyl, C3-C8 cy

Abstract: Provided are methods of forming contact structures and semiconductor devices fabricated using the contact structures. The formation of a contact structure can include forming a first molding pattern on a substrate, forming an insulating layer to cover at least a sidewall of the first molding pattern, forming a second molding pattern to cover a sidewall of the insulating layer and spaced apart from the first molding pattern, removing a portion of the insulating layer between the first and second molding patterns to form a hole, and forming an insulating pattern between the first and second molding patterns, and forming a contact pattern in the hole.