Abstract: The present invention relates to an antibody against a protein specifically expressed in methicillin-resistant strains of Staphylococcus aureus (MRSA), and a method and a kit for detecting MRSA. The present invention enables a fast and accurate detection of MRSA by using both a PBP2a-specific antibody for the detection of PBP2a and a Protein A-specific antibody for the detection of Protein A.

Abstract: A method of controlling a flying height of a magnetic head of a hard disk drive includes calculating a corrected flying on demand (FOD) voltage to correct a difference between a measured flying height measured by applying a burn-in FOD voltage corresponding to a target flying height and a burn-in flying height in a reference FOD voltage profile corresponding to the burn-in FOD voltage, using the reference FOD voltage profile, in the reference FOD voltage profile that is a profile of a second signal for calculating the flying height of the magnetic head with respect to a first signal for calculating an FOD voltage that allows an end of the magnetic head to thermally expand and protrude when applied to a heater included in the magnetic head, and applying an applied FOD voltage obtained by applying the corrected FOD voltage, to the burn-in FOD voltage, to control the flying height of the magnetic head.

Abstract: A conventional capacitive accelerometer has a limitation in reducing a distance between a sensing electrode and a reference electrode, and requires a complex process and a separate method of correcting a clearance difference caused by a process error. However, the capacitive accelerometer of the present invention has high sensitivity, can be simply manufactured by maintaining a very narrow distance between a reference electrode and a sensing electrode, and can make it unnecessary to individually correct each manufactured accelerometer by removing or drastically reducing a functional difference due to a process error.

Abstract: An information storage medium has user data areas and additional data areas, and sync patterns to distinguish the additional data areas from the user data areas. The information storage medium includes a user data area in which user data is recorded and an additional data area located in at least one of areas before and after the user data area. Second sync patterns used in the additional data area are different from first sync patterns used in the user data area.

Abstract: In a semiconductor device and related method of fabricating the same, a hard mask layer is formed over a substrate, portions of the hard mask layer and the substrate are etched to form trenches having protruding portions at sidewalls, and an insulation layer buried in the trenches is formed to form device isolation regions having protruding portions at sidewalls, wherein the device isolation regions decrease a portion of a width of active regions.

Abstract: In a semiconductor device and related method of fabricating the same, a hard mask layer is formed over a substrate, portions of the hard mask layer and the substrate are etched to form trenches having protruding portions at sidewalls, and an insulation layer buried in the trenches is formed to form device isolation regions having protruding portions at sidewalls, wherein the device isolation regions decrease a portion of a width of active regions.

Abstract: Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.

Abstract: A hard disk drive includes a magnetic head to write data to a disk by magnetizing the disk using a leakage magnetic flux that leaks in a disk direction through a write gap provided between a write pole to apply a magnetic field to the disk and a shield provided separately from the write pole, and an actuator arm allowing the magnetic head to pivot over the disk. In the hard disk drive, the write gap is asymmetrically formed to a left and a right with respect to a center axis line of the write pole according to a movement direction of the magnetic head when the magnetic head pivots over the disk.

Abstract: A method for fabricating a semiconductor device includes forming an inter-layer insulation layer on a substrate; forming openings in the inter-layer insulation layer; forming a metal barrier layer in the openings and on the inter-layer insulation layer; forming a first conductive layer on the metal barrier layer and filled in the openings; etching the first conductive layer to form interconnection layers in the openings and to expose portions of the metal barrier layer, the interconnection layers being inside the openings and at a depth from a top of the openings; etching the exposed portions of the metal barrier layer to obtain a sloped profile of the metal barrier layer at top lateral portions of the openings; forming a second conductive layer over the inter-layer insulation layer, the interconnection layers and the metal barrier layer with the sloped profile; and patterning the second conductive layer to form metal lines.

Abstract: In a semiconductor device and related method of fabricating the same, a hard mask layer is formed over a substrate, portions of the hard mask layer and the substrate are etched to form trenches having protruding portions at sidewalls, and an insulation layer buried in the trenches is formed to form device isolation regions having protruding portions at sidewalls, wherein the device isolation regions decrease a portion of a width of active regions.

Abstract: There is provided a bidirectional readout circuit for detecting direction and amplitude of an oscillation sensed at a capacitive microelectromechanical system (MEMS) accelerometer, the bidirectional readout circuit converting capacitance changes of the capacitive MEMS accelerometer into a time change amount by using high resolution capacitance-to-time conversion technology and outputting the time change amount as the direction and the amplitude of the oscillation by using time-to-digital conversion (TDC) technology, thereby detecting not only the amplitude of the oscillation but also the direction thereof, which is capable of being applied to various MEMS sensors.

Abstract: A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

Abstract: An apparatus for preventing stiction of a three-dimensional MEMS (microelectromechanical system) microstructure, the apparatus including: a substrate; and a plurality of micro projections formed on a top surface of the substrate with a predetermined height in such a way that a cleaning solution flowing out from the microstructure disposed thereabove is discharged.

Abstract: There is provided a micromachined sensor for measuring a vibration, based on silicone micromachining technology, in which a conductor having elasticity is connected to masses moving due to a force generated by the vibration and the vibration is measured by using induced electromotive force generated due to the conductor moving in a magnetic field.

Abstract: A method for fabricating a semiconductor device includes forming a plurality of plugs over a die region and an edge bead removal (EBR) region of a wafer, forming metal lines coupled to the plugs, removing the metal lines in the EBR region, forming an inter-layer dielectric layer over the wafer, and forming a plurality of contact holes that expose the metal lines by selectively etching the inter-layer dielectric layer through a dry etch process using a plasma etch device.

Abstract: A chemical sensor using metal nano-particles and a method for manufacturing a chemical sensor using metal nano-particles are provided. The chemical sensor includes: metal nano-particles; single-ligand organic molecules (or a single molecule) that binds to the metal nano-particles by using a metal bonding functional group; a substrate bonding functional group formed at the metal nano-particles and the single-ligand organic molecules as bound to each other; a substrate; electrodes formed on the substrate and having an interdigitate (IDT) structure; and a substrate functional group formed on the substrate and positioned between the electrodes, wherein the substrate bonding functional group and the substrate functional group are covalently bonded.

Abstract: A method of controlling a flying height of a magnetic head of a hard disk drive apparatus includes producing a reference FOD (flying on demand) voltage profile defining a relationship between the flying height of the magnetic head and an FOD voltage at a measured temperature, wherein an end of the magnetic head thermally expands and protrudes when the FOD voltage is applied to a heater included in the magnetic head and setting the reference FOD voltage profile that is corrected using a reference maximum flying height of the magnetic head that is preset at room temperature, as an applied FOD voltage profile to control the flying height of the magnetic head.

Abstract: A method of fabricating an electronic device having stacked chips is provided. The method includes forming a plurality of chips arranged in a row direction and at least one chip arranged in a column direction. A molding layer is formed between the chips. Grooves are formed in the molding layer between the chips arranged in the row direction. Conductive interconnections are formed on the substrate having the grooves. The substrate is sawn along an odd- or even-numbered one of the grooves to be separated into a plurality of unit substrates. At least one of the separated unit substrates is folded along an unsawn groove of the grooves.

Abstract: A data storage device determines a zone layout based on a quality evaluation factor. The zone layout is designed such that a measurement value of the quality evaluation factor for each track in each zone is within a range between a predetermined upper limit and a predetermined lower limit and a maximum amount of variation of the measurement value within each zone is substantially equal to a difference between the upper limit and the lower limit.

Abstract: A storage device having an automatic backup function, which is connected to a host apparatus to store user data, is provided. The storage device includes a storage medium which stores the user data, and a controller which controls data writing and reading of the storage medium. The controller backs up at least a portion of the user data stored in the storage medium in an available region of the storage medium when the storage device is in an idle mode.