Patents by Inventor Han Peng

Han Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11955245
    Abstract: A method and a system for mental index prediction are provided. The method includes the following steps. A plurality of images of a subject person are obtained. A plurality of emotion tags of the subject person in the images are analyzed. A plurality of integrated emotion tags in a plurality of predetermined time periods are calculated according to the emotion tags respectively corresponding to the images. A plurality of preferred features are determined according to the integrated emotion tags. A mental index prediction model is established according to the preferred features to predict a mental index according to the emotional index prediction model.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: April 9, 2024
    Assignees: Acer Incorporated, National Yang Ming Chiao Tung University
    Inventors: Chun-Hsien Li, Szu-Chieh Wang, Andy Ho, Liang-Kung Chen, Jun-Hong Chen, Li-Ning Peng, Tsung-Han Yang, Yun-Hsuan Chan, Tsung-Hsien Tsai
  • Publication number: 20240114702
    Abstract: A semiconductor device includes a first substrate, a transistor, an interconnection structure, a first bonding pad, a magnetic tunnel junction (MTJ) structure, a conductive line and a second substrate. The transistor is formed on the first substrate. The interconnection structure is formed on the first substrate and electrically connected to the transistor. The first bonding pad is formed on and electrically connected to the interconnection structure. The MTJ structure is disposed on and electrically connected to the first bonding pad, wherein the MTJ structure comprises a free layer, a tunnel barrier layer, a synthetic antiferromagnet layer sequentially stacked up over the first bonding pad. The conductive line is disposed on the MTJ structure. The second substrate is disposed on the conductive line.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Han-Jong Chia, Shih-Peng Tai
  • Patent number: 11946079
    Abstract: The present invention relates to a method for producing a protein hydrolysate using a polypeptide having endopeptidase activity and a polypeptide having carboxypeptidase activity and the use of these enzymes for hydrolysing a protein substrate. In addition, the present invention relates to polypeptides having carboxypeptidase activity and polynucleotides encoding the polypeptides. The invention also relates to nucleic acid constructs, vectors, and host cells comprising the polynucleotides as well as methods of producing and using the polypeptides.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: April 2, 2024
    Assignee: Novozymes A/S
    Inventors: Hanne Vang Hendriksen, Gitte Budolfsen Lynglev, Henrik Frisner, Ciu Liu, Ye Liu, Eduardo Antonio Della Pia, Hans Peter Heldt-Hansen, Kenneth Jensen, Wei Peng, Ming Li
  • Patent number: 11942358
    Abstract: The present disclosure describes a method of forming low thermal budget dielectrics in semiconductor devices. The method includes forming, on a substrate, first and second fin structures with an opening in between, filling the opening with a flowable isolation material, treating the flowable isolation material with a plasma, and removing a portion of the plasma-treated flowable isolation material between the first and second fin structures.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mrunal Abhijith Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin
  • Patent number: 11906571
    Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: February 20, 2024
    Assignee: MPI CORPORATION
    Inventors: Chien-Yu Chen, Po-Han Peng
  • Publication number: 20230251303
    Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.
    Type: Application
    Filed: February 2, 2023
    Publication date: August 10, 2023
    Applicant: MPI CORPORATION
    Inventors: YI-HSUAN CHENG, HUNG-I LIN, PO-HAN PENG
  • Patent number: 11656271
    Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: May 23, 2023
    Assignee: MPI CORPORATION
    Inventors: Yi-Hsuan Cheng, Hung-I Lin, Po-Han Peng
  • Patent number: 11623475
    Abstract: A socket structure includes a socket body, an O-ring, and a carbon-fiber tube. The socket body includes a driving section and an acting section coaxially connected to the driving section. The driving section has an outside diameter greater than an outside diameter of the acting section and a stepped portion is formed in outer circumference between the driving section and the acting section. The driving section and the acting section have end faces that are recessed inwardly to form a driving hole and an acting hole, respectively. The outer circumferential surface of the acting section is formed with a circumferential groove in which the O-ring is received. The carbon-fiber tube is fit over the outer circumferential surface of the acting section of the socket body and has an end in abutting engagement with the stepped portion and an internal circumferential surface in contact with the O-ring.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: April 11, 2023
    Inventors: Chia-Hui Peng, Hsiao-Fen Peng, Hsiao-Ting Peng, Wen-Han Peng, Chun-Hsiang Peng
  • Patent number: 11490602
    Abstract: A breeding method for improving reproductive performance of a chicken specialized dam line includes the steps of forming an F1 generation group, forming a breeding group, screening a breeding group, forming an F2 generation group, and continuously breeding to an Fn generation group. The method includes raising in small-scale groups and natural mating for systematic selection and breeding, which effectively reduces the generation interval and has the features of easy operation and fast genetic progress, not only ensuring animal welfare, but also effectively improving production performance.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: November 8, 2022
    Assignee: Sichuan Animal Science Academy
    Inventors: Xiaosong Jiang, Chaowu Yang, Mohan Qiu, Zengrong Zhang, Chunlin Yu, Huarui Du, Qingyun Li, Bo Xia, Xiaoyan Song, Chenming Hu, Xia Xiong, Li Yang, Han Peng, Jialei Chen
  • Patent number: 11457094
    Abstract: A network system crossing different transmission protocols includes a user device, a first conversion apparatus, a server device and a second conversion apparatus. Data transmission between the first conversion apparatus and the second conversion apparatus is performed in accordance with network addresses of the first conversion apparatus and the second conversion apparatus, and one of transmission control protocol (TCP) and multipath transmission control protocol (MPTCP) is selected for performing the data transmission. A user packet is transmitted between the first conversion apparatus and the user device in accordance with network addresses of the user device and the server device. A server packet is transmitted between the second conversion apparatus and the server device in accordance with the network addresses of the user device and server devices.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: September 27, 2022
    Assignee: QNAP SYSTEMS, INC.
    Inventors: Sin-Yao Huang, Po-Han Peng
  • Publication number: 20220299560
    Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 22, 2022
    Inventors: CHIEN-YU CHEN, PO-HAN PENG
  • Publication number: 20220299564
    Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 22, 2022
    Applicant: MPI CORPORATION
    Inventors: YI-HSUAN CHENG, HUNG-I LIN, PO-HAN PENG
  • Publication number: 20220211633
    Abstract: Disclosed herein are nanostructures, compositions, and methods for treating ocular disorders, injuries, and infections using RNA complexed nanoparticles (e.g., RNA-templated lipoprotein particles, miRNA-high density lipoprotein particles). These nanostructures are contemplated in topical therapies.
    Type: Application
    Filed: April 24, 2020
    Publication date: July 7, 2022
    Applicant: Northwestern University
    Inventors: C. Shad Thaxton, Robert M. Lavker, Kaylin M. McMahon, Han Peng, Andrea E. Calvert, Nihal Kaplan
  • Patent number: 11369651
    Abstract: A method for protecting muscles, comprising administering to a subject in need an effective amount of a FU-LING (Poria cocos) extract, tumulosic acid and/or a pharmaceutical acceptable salt of tumulosic acid. In particular, the method of the present invention is for protecting muscle cells against injury, promoting regeneration and repair of muscle, regulating, treating and/or delaying muscle atrophy (especially caused by aging, diseases, and cachexia), or helping normal muscle contraction, maintaining normal muscle physiology, maintaining normal neuromuscular function, maintaining normal energy metabolism, or enhancing energy level.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 28, 2022
    Assignee: SINPHAR PHARMACEUTICAL CO., LTD. (DONGSHAN, TAIWAN)
    Inventors: Chao-Jih Wang, Han-Peng Kuo, Ai-Ling Yeh
  • Patent number: 11348221
    Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: May 31, 2022
    Assignee: MPI CORPORATION
    Inventors: Chien-Yu Chen, Han-Yu Chuang, Po-Han Peng
  • Publication number: 20220161399
    Abstract: A detachment-preventive adaptor socket includes a drive portion having an end face that is formed with an axially inward recessed drive hole having multiple axially-extending sidewalls, of which at least two opposite sidewalls are each formed with a radially-recessed detachment-prevention groove, the end face of the drive portion being also formed with a first guide slope that is axially inward recessed and extended as an inclination arranged in an annular form that is connected to the end face of the drive portion and has an outside diameter greater than a diameter of the drive hole, a second guide slop being arranged between each sidewall of the drive hole and the first guide slope and directly adjacent to the first guide slope; and an operation portion, which is axially connected with the drive portion and has an end face that is axially recessed to form an operation hole.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 26, 2022
    Inventor: WEN-HAN PENG
  • Publication number: 20210323349
    Abstract: A socket structure includes a socket body, an O-ring, and a carbon-fiber tube. The socket body includes a driving section and an acting section coaxially connected to the driving section. The driving section has an outside diameter greater than an outside diameter of the acting section and a stepped portion is formed in outer circumference between the driving section and the acting section. The driving section and the acting section have end faces that are recessed inwardly to form a driving hole and an acting hole, respectively. The outer circumferential surface of the acting section is formed with a circumferential groove in which the O-ring is received. The carbon-fiber tube is fit over the outer circumferential surface of the acting section of the socket body and has an end in abutting engagement with the stepped portion and an internal circumferential surface in contact with the O-ring.
    Type: Application
    Filed: April 16, 2020
    Publication date: October 21, 2021
    Inventors: CHIA-HUI PENG, HSIAO-FEN PENG, HSIAO-TING PENG, WEN-HAN PENG, CHUN-HSIANG PENG
  • Patent number: 11137971
    Abstract: A data packing circuit and a data packing method operated in a high definition multimedia interface (HDMI) transmitter that adopts a fixed rate link mode are provided. The data packing circuit can output a plurality of FRL super blocks at a plurality of unit times. In the data packing method, multiple valid data inputted to the data packing circuit at the (i)th unit time are mapped to a plurality of FRL characters, and the FRL characters are stored to the first or the second buffer. At the same time, an amount of tri-byte of the multiple valid data is counted for determining number and positions for inserting gap characters to form the (i)th FRL super block, which is outputted at the (i+1)th unit time. The numeral ā€˜iā€™ is a positive integer.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: October 5, 2021
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Ying-Ying Song, Chien-Hsun Lu, Yi-Han Peng, Chun-Chieh Chan
  • Patent number: 11125842
    Abstract: This disclosure regards a magnetic resonance imaging system including a scanner, and gradient drivers. The scanner is to be implemented within a scan room that is shielded from electromagnetic interference. Gradient coils are designed to create a linear gradient in the magnetic field generated in the scanner by a primary magnet. These coils are energized by gradient drivers. The gradient drivers use transformers and other electrical devices in a switching stage configured to generate pulse-width-modulated power. The transformers may have non-magnetic cores to facilitate implementing the gradient drivers within the scan room. The gradient drivers also use a filtering stage which uses inductors and other electrical devices to smooth the pulse-width-modulated power. The inductors within the filters may have non-magnetic cores to facilitate implementing the gradient driver within the scan room. Additionally, an inductor with a hollow wire may be used to circulate fluid to facilitate cooling the gradient driver.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: September 21, 2021
    Assignee: GE PRECISION HEALTHCARE LLC
    Inventors: Ruxi Wang, Xiaohu Liu, Han Peng, Fengfeng Tao, Juan Antonio Sabate