Abstract: An apparatus for aligning a fiber array unit (FAU) connector with a photonic integrated circuit (PIC) includes an aligner having a front section and a bottom section respectively joined with two side sections spaced apart by a first distance. The front section and the bottom section are partially removed to expand a semi-confined open space between the two side sections for receiving a shelf extended out beyond a lens at a side edge of a PIC chip. The shelf has an alignment feature associated with the lens. The front section is configured as a support bar positioned on a surface of the PIC chip. The semi-confined open space between the two side sections allows a body of the FAU connector to be loaded down from top to sit on the shelf in the semi-confined open space and be aligned with the lens through the alignment feature.

Abstract: Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including an optical package or co-packaged optics package comprising a lid. In an embodiment, an optical package can include a first substrate, a first circuit coupled to the first substrate and configured to transmit or receive an electrical signal, a second circuit coupled to the first substrate and configured to transmit or receive an optical signal, and a lid configured to couple to the first substrate and configured to cover at least a portion of the first circuit or the second circuit.

Abstract: An apparatus for supporting two fiber array unit (FAU) connectors in alignment with respective lenses of a photonics integrated circuit (PIC) includes a frame with a pair of arm sections joined with two side sections of a bottom section. The pair of arm sections is configured to parallelly insert in a package structure associated with a PIC chip to make the frame in a floating state. The bottom section provides a first support surface to support two aligners disposed respectively along the two side sections from top. Each aligner provides a semi-confined open space to receive a shelf extended out from a side edge of a PIC chip. The shelf is characterized by an alignment feature associated with a lens of the PIC chip. The semi-confined open space allows a body of a FAU connector to be loaded from top onto the shelf and be aligned with the lens based on the alignment feature.

Abstract: A semiconductor apparatus and a method of manufacturing the same are provided. A semiconductor apparatus includes a first nitride semiconductor layer, a second nitride semiconductor layer, an electrode, a dielectric structure, a field plate, a plurality of height compensators, and a plurality of vias. The second nitride semiconductor layer is on the first nitride semiconductor layer and has a bandgap greater than that of the first nitride semiconductor layer. The electrode contacts the second nitride semiconductor layer. The dielectric structure is disposed on the second nitride semiconductor layer and covers the electrode. The field plate is in the dielectric structure. The height compensators are in the dielectric structure and are disposed on the electrode and the field plate, respectively. The vias extend into the dielectric structure and contact top surfaces of the height compensators, respectively.

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

Abstract: Use of Cistanche tubulosa extract in preparation of a medicament for relieving dry eye symptoms. Said symptoms include ocular burning, itching, stinging, excess watering, foreign body sensation, pain, redness, photophobia and blurred vision.

Abstract: Disclosed herein are compositions comprising synthetic nanoparticles and methods of use thereof for reducing inflammation of the eye and/or skin.

Abstract: An audio restore circuit includes an audio tracking circuit, a clock adjustment circuit, and an audio generator circuit. The audio tracking circuit is configured to generate a first control signal according to a sampling rate of an audio sampled signal and a clock rate of an audio clock signal. The clock adjustment circuit is configured to adjust the clock rate of the audio clock signal according to the first control signal. The audio generator circuit is configured to output a plurality of audio output signals according to the audio sampled signal and the audio clock signal.

Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

Abstract: A socket structure includes a socket body, an O-ring, and a carbon-fiber tube. The socket body includes a driving section and an acting section coaxially connected to the driving section. The driving section has an outside diameter greater than an outside diameter of the acting section and a stepped portion is formed in outer circumference between the driving section and the acting section. The driving section and the acting section have end faces that are recessed inwardly to form a driving hole and an acting hole, respectively. The outer circumferential surface of the acting section is formed with a circumferential groove in which the O-ring is received. The carbon-fiber tube is fit over the outer circumferential surface of the acting section of the socket body and has an end in abutting engagement with the stepped portion and an internal circumferential surface in contact with the O-ring.

Abstract: A breeding method for improving reproductive performance of a chicken specialized dam line includes the steps of forming an F1 generation group, forming a breeding group, screening a breeding group, forming an F2 generation group, and continuously breeding to an Fn generation group. The method includes raising in small-scale groups and natural mating for systematic selection and breeding, which effectively reduces the generation interval and has the features of easy operation and fast genetic progress, not only ensuring animal welfare, but also effectively improving production performance.

Abstract: A network system crossing different transmission protocols includes a user device, a first conversion apparatus, a server device and a second conversion apparatus. Data transmission between the first conversion apparatus and the second conversion apparatus is performed in accordance with network addresses of the first conversion apparatus and the second conversion apparatus, and one of transmission control protocol (TCP) and multipath transmission control protocol (MPTCP) is selected for performing the data transmission. A user packet is transmitted between the first conversion apparatus and the user device in accordance with network addresses of the user device and the server device. A server packet is transmitted between the second conversion apparatus and the server device in accordance with the network addresses of the user device and server devices.

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

Abstract: An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.

Abstract: Disclosed herein are nanostructures, compositions, and methods for treating ocular disorders, injuries, and infections using RNA complexed nanoparticles (e.g., RNA-templated lipoprotein particles, miRNA-high density lipoprotein particles). These nanostructures are contemplated in topical therapies.

Abstract: A method for protecting muscles, comprising administering to a subject in need an effective amount of a FU-LING (Poria cocos) extract, tumulosic acid and/or a pharmaceutical acceptable salt of tumulosic acid. In particular, the method of the present invention is for protecting muscle cells against injury, promoting regeneration and repair of muscle, regulating, treating and/or delaying muscle atrophy (especially caused by aging, diseases, and cachexia), or helping normal muscle contraction, maintaining normal muscle physiology, maintaining normal neuromuscular function, maintaining normal energy metabolism, or enhancing energy level.

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

Abstract: A detachment-preventive adaptor socket includes a drive portion having an end face that is formed with an axially inward recessed drive hole having multiple axially-extending sidewalls, of which at least two opposite sidewalls are each formed with a radially-recessed detachment-prevention groove, the end face of the drive portion being also formed with a first guide slope that is axially inward recessed and extended as an inclination arranged in an annular form that is connected to the end face of the drive portion and has an outside diameter greater than a diameter of the drive hole, a second guide slop being arranged between each sidewall of the drive hole and the first guide slope and directly adjacent to the first guide slope; and an operation portion, which is axially connected with the drive portion and has an end face that is axially recessed to form an operation hole.