Abstract: A method for processing an integrated circuit includes forming first and second gate all around transistors. The method forms a dipole oxide in the first gate all around transistor without forming the dipole oxide in the second gate all around transistor. This is accomplished by entirely removing an interfacial dielectric layer and a dipole-inducing layer from semiconductor nanosheets of the second gate all around transistor before redepositing the interfacial dielectric layer on the semiconductor nanosheets of the second gate all around transistor.

Abstract: The present disclosure describes a method to form a backside power rail (BPR) semiconductor device with an air gap. The method includes forming a fin structure on a first side of a substrate, forming a source/drain (S/D) region adjacent to the fin structure, forming a first S/D contact structure on the first side of the substrate and in contact with the S/D region, and forming a capping structure on the first S/D contact structure. The method further includes removing a portion of the first S/D contact structure through the capping structure to form an air gap and forming a second S/D contact structure on a second side of the substrate and in contact with the S/D region. The second side is opposite to the first side.

Abstract: A method includes placing a plurality of package components over a carrier, encapsulating the plurality of package components in an encapsulant, forming a light-sensitive dielectric layer over the plurality of package components and the encapsulant, exposing the light-sensitive dielectric layer using a lithography mask, and developing the light-sensitive dielectric layer to form a plurality of openings. Conductive features of the plurality of package components are exposed through the plurality of openings. The method further includes forming redistribution lines extending into the openings. One of the redistribution lines has a length greater than about 26 mm. The redistribution lines, the plurality of package components, the encapsulant in combination form a reconstructed wafer.

Abstract: A method includes forming a first waveguide over a substrate; forming a first layer of low-dimensional material on the first waveguide; forming a first layer of dielectric material over the first layer of low-dimensional material; forming a second layer of low dimensional material on the first layer of dielectric material; and forming a first conductive contact that electrically contacts the first layer of low-dimensional material and a second conductive contact that electrically contacts the second layer of low-dimensional material.

Abstract: Provided herein are Bridged Compounds having the following structures: wherein R1a, R1b, R1c, R1d, R2a, R2b, R2c, R2d, R3a, R3b, R3c, R3d, R4, R5, R6, R7, R8, m1, m2, m3, n2, n3, n4, q, X1, X2, Y1, Y2, L1 and ring A are as defined herein, compositions comprising an effective amount of a Bridged Compound, and methods for treating or preventing various diseases, e.g., pancreatic cancer, or a condition treatable or preventable by inhibition of the function of KRAS protein. In another aspect, a Bridged Compound is useful for treating or preventing a condition treatable or preventable by inhibition of the function of KRAS protein with G12D mutation. In another aspect, a Bridged Compound is useful for treating or preventing a condition treatable or preventable by inhibition of a RAS/MAPK pathway.

Abstract: A computer-implemented method for aligning a sensor to a vehicle includes receiving a first frame of measurement from the sensor which includes a first point cloud. One or more clusters Ci representing one or more objects or the ground are segmented. A first set of feature vectors fi is computed for each cluster Ci. Based on the first set of feature vectors fi a second set of feature vectors fi? is predicted respectively using an initial transformation. A third set of feature vectors fj is computed for a second frame with a second point cloud with clusters Cj. A pair of matching clusters is identified from Ci and Cj. A feature distance between the matching clusters is computed. An alignment transformation is computed by updating the initial transformation based on the feature distance. The method further includes aligning the sensor and the vehicle based on the alignment transformation.

Abstract: An automatic material changing and welding system for stamping materials includes a welding transfer sliding table and a welding platform. The automatic material changing device further includes a feeding system. The feeding system includes a double-head uncoiling machine, an automatic feeding machine and a flattening machine. The automatic material changing device is used for automatic feeding for a stamping machine. The system triggers a material changing signal through a sensor to control and integrate the welding transfer sliding table and the welding platform to act to execute a welding procedure, so that the stamping materials are in welding connection with new and old coiled materials through a welding connection plate to realize continuous production operation of an automated stamping production line.

Abstract: A chip-level software and hardware cooperative relay protection device is provided. The device includes: a control chip, wherein a first control unit, a second control unit, and multiple logic circuits are integrated on the control chip; and the logic circuits perform microsecond-level rapid calculation on electrical signals of a protected electrical device, obtain fault feature parameters of the protected electrical device are and transmit same to the first control unit, then perform millisecond-level real-time protection logic determination according to the fault feature parameters of the protected electrical device to obtain relay protection results of the protected electrical device, and protect the protected electrical device by controlling an external relay according to the relay protection results.

Abstract: A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.

Abstract: Methods, apparatus, and processor-readable storage media for automatically determining work environment-related ergonomic data are provided herein. An example computer-implemented method includes obtaining ergonomic-related data pertaining to one or more of an individual within a work environment and the work environment; determining one or more ergonomic parameter values by processing at least a portion of the obtained ergonomic-related data using one or more models; generating and outputting, to the individual via one or more automated systems, at least one notification based at least in part on the one or more ergonomic parameter values; and performing one or more automated actions based at least in part on one or more of the one or more ergonomic values and the at least one notification.

Abstract: An electronic circuit includes a first transistor coupled between a first node and a supply voltage and controlled by a first node, a second transistor coupled between a second node and the supply voltage and controlled by the first node, a third transistor coupled between a third node and the supply voltage and controlled by a fourth node, a fourth transistor coupled between the fourth node and the supply voltage and controlled by the fourth node, a fifth transistor coupled between the first node and the fifth node and controlled by a reference voltage, a sixth transistor coupled between the second node and a ground and controlled by the third node, a seventh transistor coupled between the fourth node and the ground and controlled by the second node, a first resistor coupled the fourth node to the ground, and a second resistor coupled to the fifth node.

Abstract: A method for comprehensively analyzing and/or evaluating cigarette burning quality index is disclosed. The steps include collecting cigarette burning quality index data, filtering the cigarette burning quality index data, standardizing cigarette data, and measuring cigarette burning quality. The importance of the cigarette burning quality indicators can also be evaluated. The method for comprehensively analyzing and/or evaluating cigarette burning quality indicators can reflect general laws more accurately by maintaining the sample distribution through a singularity detection method, and analyzing correlations of each index with cigarette performance from multiple perspectives, to fuse them into a comprehensive measurement value. The importance ranking and weight of indicators can be obtained more completely and stably.

Abstract: An indoor positioning method includes scanning for registered Wi-Fi nodes with known coordinates to generate a list of the registered Wi-Fi nodes. The method also includes performing a ranging operation by (i) selecting nodes to range with from the list of the registered Wi-Fi nodes, and (ii) processing ranging responses from the selected nodes to generate a series of distance measurements. The method further includes obtaining a series of sensor readings generated by one or more inertial measurement units (IMUs) of a device. The method also includes estimating a position of the device based on the series of distance measurements and the series of sensor readings using first and second filtering operations that are performed in parallel.

Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.

Abstract: A semiconductor device structure is provided. The device includes one or more first semiconductor layers, each first semiconductor layer of the one or more first semiconductor layers is surrounded by a first intermixed layer, wherein the first intermixed layer comprises a first material and a second material.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against a top of the shell and the brake plate. When the fan is inactive, the electromagnet is energized to produce magnetic poles that repel the magnetic member and compress the elastic element, such that the brake pin is magnetically pushed toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: Liquid reservoirs, cartridge assemblies and related systems and methods are disclosed. An example implementation includes an apparatus that includes a body, a cover, and a lid assembly. The body includes a top surface and a storage chamber having an opening at the top surface. The cover covers or is positioned within the opening of the storage chamber. The lid assembly is coupled to the top surface and covers the opening of the storage chamber. The top surface and the first portion define a plenum. The cover is at least one of piercable, breakable, or movable to allow the storage chamber to be fluidly coupled to the plenum without venting the plenum to atmosphere.

Abstract: A method for SCell BFR performed by a UE is provided. The method includes: receiving a first SCell BFR configuration corresponding to a first SCell, the first SCell BFR configuration including at least one of a resource list for BFD and a resource list for NBI; detecting a beam failure condition in the first SCell by measuring at least one BFD reference signal; determining a first new candidate beam index for the first SCell based on the first SCell BFR configuration; and transmitting a beam failure recovery request that includes a cell index of the first SCell in which beam failure occurs and the determined first new candidate beam index.

Abstract: A system and a method for generating an arbitrary waveform of a microwave photon based on optical frequency tuning are provided. The system includes an optical frequency comb, a first optical distribution unit, a first photoelectric conversion unit, a frequency-shift drive circuit, and an optical frequency doubling/dividing unit, an optical frequency-shift combining optical circuit, a second photoelectric conversion unit, and a second electrical processing circuit. The optical frequency comb is used as the frequency source, with the features of high stability and low phase noise of the optical frequency comb, the arbitrary waveforms of microwave photons can be generated through optical frequency tuning control; the performance of the optical frequency comb is three orders of magnitude or more higher than that of the common microwave frequency sources, therefore, the waveforms with high-frequency, ultra-wideband, low phase noise, and high stability can be generated.