Abstract: A vehicle includes a system performing a method of operating a camera for the vehicle. The camera is configured to capture an image. The processor is configured to query the camera to obtain an intrinsic parameter of the camera, estimate a unified parameter based on the intrinsic parameter of the camera, and perform at least one application on the image using the unified parameter.

Abstract: Provided are a water-soluble Pd(II) complex, a synthesis method thereof and use thereof as a catalytic precursor. The complex has a chemical name, ammonium dinitrooxalato palladium (II), and a molecular formula of (NH4)2[Pd(NO2)2(C2O4)]·nH2O (n is the number of crystal water). The Pd(II) complex is synthesized by using PdCl2 or [Pd(NH3)2Cl2] as a starting material which is firstly converted into [Pd(NH3)4]Cl2 in ammonium hydroxide, followed by a chemical reaction between [Pd(NH3)4]Cl2 and excessive NaNO2 to produce trans-[Pd(NH3)2(NO2)2] via ligand substitution mechanism, and finally dissolving trans-[Pd(NH3)2(NO2)2] in an aqueous solution of oxalic acid leads to the formation of the target product (NH4)2[Pd(NO2)2(C2O4)]·2H2O. The complex does not contain chlorine and other elements that are harmful to a catalyst, is readily soluble in water and has a low thermal decomposition temperature.

Abstract: A computer-implemented method for aligning a sensor to reference coordinate system includes initiating a plurality of threads, each thread executes simultaneously and independent of each other. A first thread parses data received from the sensor and stores the parsed data in a data buffer. A second thread computes an alignment transformation using the parsed data to determine alignment between the sensor and the reference coordinate system. The computing includes checking that the data buffer contains at least predetermined amount of data. If at least the predetermined amount of data exists, an intermediate result is computed using the parsed data in the data buffer; otherwise, the second thread waits for the first thread to add more data to the data buffer. The second thread outputs the intermediate result into the data buffer. A third thread outputs the alignment transformation, in response to completion of alignment computations.

Abstract: A semiconductor device has a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or else have a overlap count of less than two. In another embodiment the mark is formed using a wobble scan methodology. By forming marks as described, defects from the marking process may be reduced or eliminated.

Abstract: A method of forming a semiconductor transistor device. The method comprises forming a channel structure over a substrate and forming a first source/drain structure and a second source/drain structure on opposite sides of the fin structure. The method further comprises forming a gate structure surrounding the fin structure. The method further comprises flipping and partially removing the substrate to form a back-side capping trench while leaving a lower portion of the substrate along upper sidewalls of the first source/drain structure and the second source/drain structure as a protective spacer. The method further comprises forming a back-side dielectric cap in the back-side capping trench.

Abstract: A fan brake structure includes a fan and a brake device. The fan has a frame body, a fan impeller and a stator. The brake device is disposed under a bottom of a bearing cup. The brake device has a driving member, a brake member and an elastic member. The elastic member abuts against one end of the brake member. The other end of the brake member has a boss body. The driving member has a spiral rail. When the driving member rotates, the boss body moves along the spiral rail, whereby the brake member linearly reciprocally moves upward to brake the fan impeller or linearly reciprocally moves downward to release the fan impeller from the braking.

Abstract: A fan braking structure includes a fan including a frame having an upright bearing cup, and a fan impeller having a vertical rotating shaft pivotally received in the bearing cup and provided at a free end with a groove; a braking structure located at a lower part of the bearing cup and including a brake plate and an electromagnet, and the brake plate being provided at one side with a protruded brake pin and at another side with a magnetic member; and an elastic element disposed between and pressed against the brake plate and the electromagnet. When the fan is powered off, the electromagnet is energized and produces magnetic poles that magnetically repel the magnetic member, such that the brake pin is pushed by a magnetic force and the elastic element toward the rotating shaft to engage with the groove, causing the fan to brake and stop rotating inertially.

Abstract: The present application relates to a field of a biological detection technology, in particular, relates to a universal probe, a primer-probe set and a kit. The present application provides a universal probe, in which, from 5? end to 3? end, the universal probe sequentially comprises: quenching group-fragment A -fluorophore-fragment B-C3; the fragment A has a nucleotide sequence selected from a group consisting of SEQ ID NO:1-7; and the fragment B has a nucleotide sequence selected from a group consisting of SEQ ID NO:8-14. The present application further provide a primer-probe set, an application and the kit.

Abstract: Semiconductor structures and methods are provided. An exemplary method includes depositing a first conductive material layer over a substrate, patterning the first conductive material layer to form a first conductor plate over the substrate, forming a first high-K dielectric layer over the first conductor plate, forming a second high-K dielectric layer on the first high-K dielectric layer, forming a third high-K dielectric layer on the second high-K dielectric layer, and forming a second conductor plate over the third high-K dielectric layer and vertically overlapped with the first conductor plate, where a composition of the first high-K dielectric layer is the same as a composition of the third high-K dielectric layer and is different from a composition of the second high-K dielectric layer.

Abstract: Examples of an integrated circuit with gate cut features and a method for forming the integrated circuit are provided herein. In some examples, a workpiece is received that includes a substrate and a plurality of fins extending from the substrate. A first layer is formed on a side surface of each of the plurality of fins such that a trench bounded by the first layer extends between the plurality of fins. A cut feature is formed in the trench. A first gate structure is formed on a first fin of the plurality of fins, and a second gate structure is formed on a second fin of the plurality of fins such that the cut feature is disposed between the first gate structure and the second gate structure.

Abstract: A wireless communication method and apparatus for handling radio resource collision are provided. The wireless communication method includes receiving a Radio Resource Control (RRC) configuration indicating a first Control Resource Set (CORESET) pool index associated with a Physical Uplink Control Channel (PUCCH) designated to carry Uplink Control Information (UCI); determining whether the PUCCH overlaps one or more Physical Uplink Shared Channels (PUSCHs) in time domain; after determining that the PUCCH overlaps at least one of the one or more PUSCHs in the time domain, multiplexing the UCI on a particular PUSCH of the one or more PUSCHs that is associated with the first CORESET pool index; and transmitting the UCI via the particular PUSCH.

Abstract: A method for testing burning performance of a dark-colored cigarette using a dark-colored cigarette paper is provided. The dark-colored cigarette paper has a grayscale less than 255. The method includes: simulating, by a robotic arm, a cigarette smoking process and environment; acquiring, by a full-vision camera system, an image of a burn line and ash column region of the dark-colored cigarette; and analyzing a burning performance indicator of the dark-colored cigarette according to coordinate information of the burn line and ash column region. The method is based on a surface reflection characteristic of the dark-colored cigarette paper and a principle of optical reflection to light and highlight an edge of the dark-colored cigarette sample by a light source at a certain angle from a side. In this way, the method forms a chromatic aberration to localize the dark-colored cigarette sample, thereby testing the burning performance of the dark-colored cigarette sample.

Abstract: The present disclosure provides a soft ground cleaning vehicle, including a main body frame; wherein each of both sides of the main body frame is arranged with a screw propulsion mechanism, and a lower portion of each of the both sides of the main body frame is arranged with a bottom frame; a power assembly is arranged on the bottom frame, and an extension frame is arranged on a lower portion of the bottom frame; the extension frame is arranged with a rotation assembly; a plastic track is arranged on the power assembly and the rotation assembly; a plurality of stand plates are arranged on an outer strip surface of the plastic track.

Abstract: In some embodiments, the present disclosure relates to an integrated chip structure. The integrated chip structure includes a substrate. A gate electrode is over the substrate and a spacer structure laterally surrounds the gate electrode. A conductive via is disposed on the gate electrode. A liner is arranged along one or more sidewalls of the spacer structure. The conductive via has a bottommost surface that has a larger width than a part of the conductive via that is laterally adjacent to one or more interior sidewalls of the liner.

Abstract: The disclosure provides a battery pack. The battery pack includes a battery pack box body and a plurality of cells, wherein the battery pack box body has an accommodation space, the plurality of cells are stacked in the accommodation space, and each cell of the plurality of cells has a safety valve, a positive electrode terminal and a negative electrode terminal, the positive electrode terminal and the negative electrode terminal are located on a first surface of the cell, and the safety valve is located on a second surface of the cell; the battery pack box body further includes an accommodation pipeline and a cooling mechanism, wherein the accommodation pipeline and the cooling mechanism are both located in the accommodation space, the cooling mechanism is configured for supporting the second surface and cooling the cell, the accommodation pipeline is configured for accommodating molten substance collected by the accommodation holes.

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A method performed by a user equipment for a beam operation is provided. The method includes: receiving an RRC configuration for configuring a set of joint TCI states; receiving, from the BS, a MAC CE for activating a subset of joint TCI states in the set of joint TCI states, the MAC CE is used to map the subset of joint TCI states to codepoints of a TCI field in DCI; receiving the DCI indicating a joint TCI state included in the subset of joint TCI states activated by the MAC CE; determining whether the DCI includes a DL assignment; transmitting, in response to reception of the DCI, first HARQ-ACK information in a case that the DCI does not include the DL assignment; and transmitting, in response to the reception of the DCI and reception of a PDSCH, second HARQ-ACK information in a case that the DCI includes the DL assignment.

Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.