Abstract: The present invention provides a system and method of testing CAMs and RAMs. In an exemplary embodiment, the system includes a multiple input signature register (MISR) logically coupled to digital outputs of a CAM, to digital inputs of a RAM, and to digital outputs of an ABIST controller circuit, where the MISR includes a plurality of L1 latch circuits logically coupled to a plurality of L2 latch circuits, a plurality of multiplexer circuits logically coupled to the plurality of L1 latch circuits, a plurality of exclusive or circuits (inner XOR circuits) logically coupled to the plurality of MUX circuits and to the plurality of L2 latch circuits, and at least two XOR circuits (outer XOR circuits), each of the outer XOR circuits logically coupled to one of the inner XOR circuits, to at least one of the MUX circuits, and to at least one of the L2 latch circuits.

Abstract: Respective large block synthesis (LBS) blocks of an integrated circuit (IC) are overlapped along a corner of each respective LBS block to form an overlap area having an area less than respective areas of respective LBS blocks that are overlapped. A first portion of the overlap area is allocated to a first LBS block and configured to be used by the first LBS block, and a second portion of the overlap area is allocated to a second LBS block and configured to be used by the second LBS block.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Respective large block synthesis (LBS) blocks of an integrated circuit (IC) are overlapped along a corner of each respective LBS block to form an overlap area having an area less than respective areas of respective LBS blocks that are overlapped. A first portion of the overlap area is allocated to a first LBS block and configured to be used by the first LBS block, and a second portion of the overlap area is allocated to a second LBS block and configured to be used by the second LBS block.

Abstract: Systems, methods and computer program product provide for pipelining out-of-order instructions. Embodiments comprise an instruction reservation station for short instructions of a short latency type and long instructions of a long latency type, an issue queue containing at least two short instructions of a short latency type, which are to be chained to match a latency of a long instruction of a long latency type, a register file, at least one execution pipeline for instructions of a short latency type and at least one execution pipeline for instructions of a long latency type; wherein results of the at least one execution pipeline for instructions of the short latency type are written to the register file, preserved in an auxiliary buffer, or forwarded to inputs of said execution pipelines. Data of the auxiliary buffer are written to the register file.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: Generating a layout of an integrated circuit chip area from a description of an integrated circuit (IC). The description includes a register-transfer-level (RTL) design. The RTL design is partitioned in large blocks for synthesis of large block synthesis (LBS) blocks. The description of the IC further includes a floorplan for the IC, wherein each LBS block to be synthesized is assigned to a respective rectilinear shape in the floorplan and the rectilinear shapes do not overlap each other.

Abstract: A method, executed by one or more processors, includes receiving IR-drop information as a function of location for a placement for a plurality of circuit blocks corresponding to an integrated circuit, calculating a target density for decoupling capacitors as a function of location based on the IR-drop information, placing a plurality of decoupling capacitors according to the target density to provide placed decoupling capacitors. The placed decoupling capacitors may be locally clustered to improve decoupling performance. The method may also include incrementally moving circuit elements or placed decoupling capacitors to avoid collisions within one or more circuit blocks, and routing the integrated circuit. A corresponding computer program product and computer system are also disclosed herein.

Abstract: A method, executed by one or more processors, includes receiving IR-drop information as a function of location for a placement for a plurality of circuit blocks corresponding to an integrated circuit, calculating a target density for decoupling capacitors as a function of location based on the IR-drop information, placing a plurality of decoupling capacitors according to the target density to provide placed decoupling capacitors. The placed decoupling capacitors may be locally clustered to improve decoupling performance. The method may also include incrementally moving circuit elements or placed decoupling capacitors to avoid collisions within one or more circuit blocks, and routing the integrated circuit. A corresponding computer program product and computer system are also disclosed herein.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: A technique for operating a processor includes storing a first result to a writeback buffer, in response to a first execution unit of the processor attempting to write the first result of a first completed instruction to a register file of the processor at a same processor time as a second execution unit of the processor is attempting to write a second result of a second completed instruction to the register file. The writeback buffer is positioned in a dataflow between the first execution unit and the register file. A buffer full indicator logic is used to detect that the writeback buffer is unavailable. A buffer unavailable signal is transmitted, from the buffer full indicator logic, in response to detecting the writeback buffer is unavailable. In response to receiving the buffer unavailable signal, a buffer retrieving logic writes the first result from the writeback buffer to the register file.

Abstract: A through-silicon via access device (TSVAD) for establishing an electrical connection to a through-silicon via (TSV) located in a planar stack of semiconductor chips is disclosed. The TSVAD may include a switching circuit, having a conductive pad terminal, a TSV terminal, an input terminal coupled to a sending logic circuit, an output terminal coupled to a receiving logic circuit, and logic devices to, in response to control signals, couple the TSV terminal to the conductive pad terminal, in one configuration, and couple the TSV terminal to another terminal in another configuration. The TSVAD may also include a control circuit to generate control signals to cause an input selection circuit to drive a signal from the sending logic circuit onto the input terminal, and to cause an output selection circuit to drive a logic signal from the output terminal to the receiving logic circuit.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: A method, executed by one or more processors, includes receiving IR-drop information as a function of location for a placement for a plurality of circuit blocks corresponding to an integrated circuit, calculating a target density for decoupling capacitors as a function of location based on the IR-drop information, placing a plurality of decoupling capacitors according to the target density to provide placed decoupling capacitors. The placed decoupling capacitors may be locally clustered to improve decoupling performance. The method may also include incrementally moving circuit elements or placed decoupling capacitors to avoid collisions within one or more circuit blocks, and routing the integrated circuit. A corresponding computer program product and computer system are also disclosed herein.

Abstract: A method, executed by one or more processors, includes receiving IR-drop information as a function of location for a placement for a plurality of circuit blocks corresponding to an integrated circuit, calculating a target density for decoupling capacitors as a function of location based on the IR-drop information, placing a plurality of decoupling capacitors according to the target density to provide placed decoupling capacitors. The placed decoupling capacitors may be locally clustered to improve decoupling performance. The method may also include incrementally moving circuit elements or placed decoupling capacitors to avoid collisions within one or more circuit blocks, and routing the integrated circuit. A corresponding computer program product and computer system are also disclosed herein.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: An aspect relates to a memory array that includes at least a first and a second six transistor static random access memory cell, and first and second address decoders. The first address decoder comprises a first latch, the second address decoder a second latch. First and second address data paths provide first and second address data to the at least two address decoders. The first latch is electrically conductive connected to the first data path and the second latch is electrically conductive connected to the second data path. The first latch is further electrically conductive connectable to the second data path via a first multiplexer. The first multiplexer and the at least two latches are configured to be selectively operated in a first write mode for a write access or in a read mode for a read access to the memory array.