Abstract: A through-silicon via access device (TSVAD) for establishing an electrical connection to a through-silicon via (TSV) located in a planar stack of semiconductor chips is disclosed. The TSVAD may include a switching circuit, having a conductive pad terminal, a TSV terminal, an input terminal coupled to a sending logic circuit, an output terminal coupled to a receiving logic circuit, and logic devices to, in response to control signals, couple the TSV terminal to the conductive pad terminal, in one configuration, and couple the TSV terminal to another terminal in another configuration. The TSVAD may also include a control circuit to generate control signals to cause an input selection circuit to drive a signal from the sending logic circuit onto the input terminal, and to cause an output selection circuit to drive a logic signal from the output terminal to the receiving logic circuit.

Abstract: An aspect relates to a memory array that includes at least a first and a second six transistor static random access memory cell, and first and second address decoders. The first address decoder comprises a first latch, the second address decoder a second latch. First and second address data paths provide first and second address data to the at least two address decoders. The first latch is electrically conductive connected to the first data path and the second latch is electrically conductive connected to the second data path. The first latch is further electrically conductive connectable to the second data path via a first multiplexer. The first multiplexer and the at least two latches are configured to be selectively operated in a first write mode for a write access or in a read mode for a read access to the memory array.

Abstract: Systems, methods and computer program product provide for pipelining out-of-order instructions. Embodiments comprise an instruction reservation station for short instructions of a short latency type and long instructions of a long latency type, an issue queue containing at least two short instructions of a short latency type, which are to be chained to match a latency of a long instruction of a long latency type, a register file, at least one execution pipeline for instructions of a short latency type and at least one execution pipeline for instructions of a long latency type; wherein results of the at least one execution pipeline for instructions of the short latency type are written to the register file, preserved in an auxiliary buffer, or forwarded to inputs of said execution pipelines. Data of the auxiliary buffer are written to the register file.

Abstract: Systems, methods and computer program product provide for pipelining out-of-order instructions. Embodiments comprise an instruction reservation station for short instructions of a short latency type and long instructions of a long latency type, an issue queue containing at least two short instructions of a short latency type, which are to be chained to match a latency of a long instruction of a long latency type, a register file, at least one execution pipeline for instructions of a short latency type and at least one execution pipeline for instructions of a long latency type; wherein results of the at least one execution pipeline for instructions of the short latency type are written to the register file, preserved in an auxiliary buffer, or forwarded to inputs of said execution pipelines. Data of the auxiliary buffer are written to the register file.

Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: A through-silicon via access device (TSVAD) for establishing an electrical connection to a through-silicon via (TSV) located in a planar stack of semiconductor chips is disclosed. The TSVAD may include a switching circuit, having a conductive pad terminal, a TSV terminal, an input terminal coupled to a sending logic circuit, an output terminal coupled to a receiving logic circuit, and logic devices to, in response to control signals, couple the TSV terminal to the conductive pad terminal, in one configuration, and couple the TSV terminal to another terminal in another configuration. The TSVAD may also include a control circuit to generate control signals to cause an input selection circuit to drive a signal from the sending logic circuit onto the input terminal, and to cause an output selection circuit to drive a logic signal from the output terminal to the receiving logic circuit.

Abstract: A through-silicon via access device (TSVAD) for establishing an electrical connection to a through-silicon via (TSV) located in a planar stack of semiconductor chips is disclosed. The TSVAD may include a switching circuit, having a conductive pad terminal, a TSV terminal, an input terminal coupled to a sending logic circuit, an output terminal coupled to a receiving logic circuit, and logic devices to, in response to control signals, couple the TSV terminal to the conductive pad terminal, in one configuration, and couple the TSV terminal to another terminal in another configuration. The TSVAD may also include a control circuit to generate control signals to cause an input selection circuit to drive a signal from the sending logic circuit onto the input terminal, and to cause an output selection circuit to drive a logic signal from the output terminal to the receiving logic circuit.

Abstract: A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC.

Abstract: A three-dimensional (3D) permute unit for a single-instruction-multiple-data stacked processor includes a first vector permute subunit and a second vector permute subunit. The first and second vector permute subunits are arranged in different layers of a 3D chip package. The vector permute subunits are each configured to process a portion of at least two input vectors. A first contact sub-field of the first vector permute subunit is configured to connect output ports of a first crossbar of the first vector permute subunit, holding an intermediate result of the first vector permute subunit, to a second contact sub-field of the second vector permute subunit. A first contact sub-field of the second vector permute subunit is configured to connect output ports of a first crossbar of the second vector permute subunit, holding an intermediate result of the second vector permute subunit, to a second contact sub-field of the first vector permute subunit.

Abstract: A computer program product or hardware description language (“HDL”) design structure in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.

Abstract: An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation.

Abstract: A mechanism is provided for efficiently recycling a charge from a power domain that is discharging. A side of a discharging power domain normally coupled to a voltage supply is disconnected from the voltage supply. The side of the precharging power domain normally coupled to the voltage supply is currently disconnected from the voltage supply. The side of the discharging power domain normally coupled to the voltage supply is connected to a side of the precharging power domain normally coupled to the voltage supply. A side of the discharging power domain normally coupled to the ground is disconnected from ground. The side of the discharging power domain normally coupled to ground is connected to the voltage supply, thereby precharging the precharging power domain with the charge from the discharging power domain that would normally be lost due to leakage.

Abstract: A mechanism is provided for efficiently recycling a charge from a power domain that is discharging. A side of a discharging power domain normally coupled to a voltage supply is disconnected from the voltage supply. The side of the precharging power domain normally coupled to the voltage supply is currently disconnected from the voltage supply. The side of the discharging power domain normally coupled to the voltage supply is connected to a side of the precharging power domain normally coupled to the voltage supply. A side of the discharging power domain normally coupled to the ground is disconnected from ground. The side of the discharging power domain normally coupled to ground is connected to the voltage supply, thereby precharging the precharging power domain with the charge from the discharging power domain that would normally he lost due to leakage.

Abstract: A technique for operating a processor includes storing a first result to a writeback buffer, in response to a first execution unit of the processor attempting to write the first result of a first completed instruction to a register file of the processor at a same processor time as a second execution unit of the processor is attempting to write a second result of a second completed instruction to the register file. The writeback buffer is positioned in a dataflow between the first execution unit and the register file. A buffer full indicator logic is used to detect that the writeback buffer is unavailable. A buffer unavailable signal is transmitted, from the buffer full indicator logic, in response to detecting the writeback buffer is unavailable. In response to receiving the buffer unavailable signal, a buffer retrieving logic writes the first result from the writeback buffer to the register file.

Abstract: A method of power gating a microprocessor having an instruction scheduling unit for receiving issued instructions from an instruction decoder; an execution unit receiving and sending signals from and to the instruction scheduling unit; and a state machine. The method comprises: obtaining a number of instructions per cycle being issued to the instruction scheduling unit; determining, if the number of instruction per cycle being issued to the instruction scheduling unit is less than a threshold level, and then determining if at least two of the instructions being issued to the instruction scheduling unit are independent of each other only when the instructions per cycle is less than the threshold level; determining when at least two of the instructions being issued to the instruction scheduling unit are independent of each other; and power gating the microprocessor to gate off power to idle macros with a signal from the state machine.

Abstract: An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L1-LN) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l1-ln), wherein n?1 and N?2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.

Abstract: A method in a computer-aided design system for generating a functional design model of an integrated circuitry structure including generating a functional representation of at least first and second regions of the integrated circuitry structure, generating a functional representation of an optical layer comprising optical waveguides, and generating a functional representation of a heat-conductive material for transferring heat from at least the second region through the optical layer to a heat sink.