Patents by Inventor Hee In Nam

Hee In Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric ceramic composition, multilayer ceramic capacitor containing the same, and manufacturing method of multilayer ceramic capacitor
    Patent number: 10236125
    Abstract: A dielectric ceramic composition contains: a barium titanate-based powder as a main ingredient; a first accessory ingredient containing Na; a second accessory ingredient containing Ba; and a third accessory ingredient containing Si. A content of the first accessory ingredient (based on moles of Na) is 0.3 to 4.0 moles per 100 moles of the main ingredient, and a Ba/Si ratio is in a range of 0.16 to 1.44.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 19, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Hyun Yoon, Jung Deok Park, Chang Hak Choi, Dong Hun Kim, Seung Ho Lee, Chan Hee Nam
  • Display device and method of manufacturing the same
    Patent number: 10147776
    Abstract: Disclosed are a display device and a method of manufacturing the same. In the disclosed display device, a pad cover electrode disposed on a pad area comes into contact with an upper surface and a side surface of a pad electrode since a planarization layer is disposed on an active area excluding the pad area, which may prevent contact failure between the pad cover electrode and a conductive ball. In addition, in the display device, a first electrode, which is connected to a thin film transistor via a pixel connection electrode, is formed via the same mask process as the planarization layer so that it has a line width similar to that of the planarization layer and overlaps the planarization layer, which may simplify a structure and a manufacturing process.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: December 4, 2018
    Assignee: LG Display Co., Ltd.
    Inventors: Seung-Hee Nam, Jeong-Oh Kim, Jung-Ho Bang, Jung-Sun Beak, Jong-Won Lee
  • Electronic device for determining sleep state and method of controlling same
    Patent number: 10123735
    Abstract: Disclosed is a method for an electronic device. The method may include: acquiring a galvanic skin response; generating a first parameter for a first interval and a second parameter for a second interval based on the galvanic skin response, the second interval being an interval before the first interval; determining a first threshold corresponding to the first interval based on the second parameter; and determining an activity state of the first interval based on the first threshold and the first parameter corresponding to the first interval.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: November 13, 2018
    Assignees: Samsung Electronics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Hyun-Jae Baek, Kwang-Suk Park, Sang-Bae Park, Do-Yoon Kim, Jung-Taek Oh, Jae-Geol Cho, Byung-Hun Choi, Sang-Won Seo, Hee-Nam Yoon, Da-Woon Jung, Sang-Ho Choi, Su-Hwan Hwang
  • BIOMARKER COMPOSITION, DIAGNOSTIC KIT, AND METHOD FOR PROVIDING INFORMATION
    Publication number: 20180274010
    Abstract: Provided are a biomarker composition that includes a nucleotide with a nucleotide sequence of SEQ ID NO: 1 or SEQ ID NO: 2 as an active ingredient, a diagnostic kit that includes the biomarker composition, and a method of providing information for diagnosis of atopic dermatitis (AD) that includes detecting a subspecies of F. prausnitzii (F06). By using the present disclosure, whether a subspecies of F. prausnitzii (F06) having a specific nucleotide sequence is present may be usefully determined, and in particular, whether AD is likely to occur may be easily and accurately diagnosed before AD occurs, and thus the present disclosure may be very useful for individuals both before and after AD occurs.
    Type: Application
    Filed: September 21, 2016
    Publication date: September 27, 2018
    Inventor: Hee Nam KIM
  • ADHESIVE FILM, PREPARATION METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
    Publication number: 20180265758
    Abstract: The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.
    Type: Application
    Filed: September 23, 2016
    Publication date: September 20, 2018
    Applicant: LG CHEM, LTD.
    Inventors: Jung Hak KIM, Hee Jung KIM, Se Ra KIM, Kwang Joo LEE, Young Kook KIM, Seung Hee NAM
  • APPARATUS AND METHOD FOR MEASURING WAVEFORM OF LIGHT WAVE
    Publication number: 20180266891
    Abstract: The present invention relates to a apparatus and method for measuring a waveform of a light wave. A light wave measurement apparatus according to an embodiment of the present invention includes a pulse separation unit to separate an input light wave into a fundamental pulse and a signal pulse, a time delay adjustment unit to adjust a time delay between the fundamental pulse and the signal pulse, a focusing unit to focus the fundamental pulse and the signal pulse whose time delay is adjusted on an ionization material, and an ionization yield measurement unit to measure an ionization yield from electrons and/or ions generated by the focused fundamental pulse and signal pulse. The waveform of the input light wave is obtained by obtaining an ionization yield modulation changed by the signal pulse as a function of the time delay.
    Type: Application
    Filed: May 17, 2018
    Publication date: September 20, 2018
    Applicants: Institute for Basic Science, Gwangju Institute of Science and Technology
    Inventors: Kyung-Taec KIM, Chang-Hee Nam, Seung-Beom Park, Wo-Sik Cho, Kyung-Seung Kim
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20180261576
    Abstract: The present invention relates to a semiconductor device and a method of manufacturing a semiconductor device, and more particularly, to a semiconductor device capable of reducing the uppermost semiconductor chip damage and stably performing wire bonding even if an excessive force is applied during a die bonding process or a wire bonding process, and a method for manufacturing the semiconductor device.
    Type: Application
    Filed: November 4, 2016
    Publication date: September 13, 2018
    Applicant: LG Chem, Ltd.
    Inventors: Jung Hak Kim, Hee Jung Kim, Se Ra Kim, Jung Ho Jo, Kwang Joo Lee, Seung Hee Nam, Young Kook Kim
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20180261499
    Abstract: A semiconductor device includes a substrate, a first metal interconnection provided on a first region of the substrate, and a second metal interconnection provided on a second region of the substrate. A width of the second metal interconnection is greater than a width of the first metal interconnection. The first metal interconnection includes a metal pattern. The second metal interconnection includes a lower metal pattern having a concave surface at its top, an upper metal pattern disposed on the concave surface at the top of the lower metal pattern, and a first barrier pattern interposed between the lower metal pattern and the upper metal pattern. The metal interconnections are formed by a damascene process including deposition, reflow, metal implantation, and planarization processes.
    Type: Application
    Filed: May 9, 2018
    Publication date: September 13, 2018
    Inventors: SANGHO RHA, KYOUNG HEE NAM, JEONGGIL LEE, HYUNSEOK LIM, SEUNGJONG PARK, SEULGI BAE, JAEJIN LEE, KWANGTAE HWANG
  • SEMICONDUCTOR DEVICE
    Publication number: 20180237663
    Abstract: The present invention relates to a semiconductor device including: a first semiconductor element formed on an adherend; and an adhesive film for embedding the first semiconductor element, wherein the adhesive film satisfies a predetermined ratio between a melt viscosity and a weight loss ratio at a high temperature.
    Type: Application
    Filed: March 28, 2017
    Publication date: August 23, 2018
    Applicant: LG CHEM, LTD.
    Inventors: Jung Hak KIM, Hee Jung KIM, Seung Hee NAM, Kwang Joo LEE, Se Ra KIM, Young Kook KIM
  • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180237667
    Abstract: The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.
    Type: Application
    Filed: March 31, 2017
    Publication date: August 23, 2018
    Applicant: LG CHEM, LTD.
    Inventors: Jung Hak KIM, Hee Jung KIM, Se Ra KIM, Kwang Joo LEE, Seung Hee NAM, Young Kook KIM
  • Hardmask composition and method of forming patterns using the hardmask composition
    Patent number: 10018914
    Abstract: A hardmask composition includes a polymer including a moiety represented by the following Chemical Formula 1 and a solvent. *-A-B—*??[Chemical Formula 1] In the Chemical Formula 1, A and B are the same as defined in the detailed description.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: July 10, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Youn-Hee Nam, Mi-Young Kim, You-Jung Park, Yun-Jun Kim, Hea-Jung Kim, Joon-Young Moon, Hyun-Ji Song, Chung-Heon Lee, Yoo-Jeong Choi
  • Method for manufacturing metallic reflector for LED package
    Patent number: 10014435
    Abstract: A metallic reflector manufacturing method for an LED package. The method includes preparing a metal plate, and processing a stamping reflector that includes a lower body and an upper body that is extended from an upper side of the lower body and is integrally formed with the lower body. A reflection surface that is slanted by a predetermined angle is formed at a central portion of the upper body and the lower body to reflect the light of the LED chip to the outside. A fixation portion is formed to fix the lower body on a substrate that the LED chip is mounted on. The method further includes sequentially plating Ni and Ag on the reflection surface or the stamping reflector surface. The stamping processing includes a piercing step, a drawing step, a first noting step, a half etching step that forms the fixation portion, and a second notching step.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: July 3, 2018
    Assignee: FIRSTENG CO., LTD.
    Inventors: Yung Cheon Kim, Deok Hee Nam, Min Chul Park, Hae Chul Park, Baek Won Kang
  • Substrate including thin film transistor for touch display
    Patent number: 10001858
    Abstract: A substrate can include a thin film transistor for a touch display, which is capable of preventing oxidation of a touch connection electrode. In the substrate including a thin film transistor, an inorganic insulation film for covering a side surface of a planarization film, which exposes a touch sensing line, is formed of a material different from that of the planarization film, and a touch connection electrode is located on a side surface of the inorganic insulation film.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 19, 2018
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Min-Joo Kim, Seung-Hee Nam
  • Semiconductor device and method of manufacturing the same
    Patent number: 9997400
    Abstract: A semiconductor device includes a substrate, a first metal interconnection provided on a first region of the substrate, and a second metal interconnection provided on a second region of the substrate. A width of the second metal interconnection is greater than a width of the first metal interconnection. The first metal interconnection includes a metal pattern. The second metal interconnection includes a lower metal pattern having a concave surface at its top, an upper metal pattern disposed on the concave surface at the top of the lower metal pattern, and a first barrier pattern interposed between the lower metal pattern and the upper metal pattern. The metal interconnections are formed by a damascene process including deposition, reflow, metal implantation, and planarization processes.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: June 12, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sangho Rha, Kyoung Hee Nam, Jeonggil Lee, Hyunseok Lim, Seungjong Park, Seulgi Bae, Jaejin Lee, Kwangtae Hwang
  • SEMICONDUCTOR DEVICES
    Publication number: 20180158730
    Abstract: A semiconductor device includes an insulating interlayer disposed on a substrate, a first protection pattern, a first barrier pattern, a first adhesion pattern, and a first conductive pattern. The insulating interlayer includes a via hole and a first trench, The via hole extends through a lower portion of the insulating interlayer. The first trench is connected to the via hole and extends through an upper portion of the insulating interlayer, The first protection pattern covers a lower surface and sidewalls of the via hole and a portion of a lower surface and a lower sidewall of the first trench, and includes a conductive material. The first barrier pattern covers the protection pattern and an upper sidewall of the first trench. The first adhesion pattern covers the first barrier pattern. The first conductive pattern is disposed on the first adhesion pattern, and fills the via hale and the first trench.
    Type: Application
    Filed: November 7, 2017
    Publication date: June 7, 2018
    Inventors: Ho-Yun Jeon, Rak-Hwan Kim, Byung-Hee Kim, Kyoung-Hee Nam, Jong-Jin Lee, Jae-Won Hwang
  • Polymer, organic layer composition, organic layer, and method of forming patterns
    Patent number: 9971243
    Abstract: A polymer includes a structural unit represented by Chemical Formula 1 and an organic layer composition including the same. wherein in Chemical Formula 1, A is a carbon cyclic group including at least one hetero atom, B is one of groups in Group 1, where Ar1 to Ar4, R11 to R14, L and m are as defined in the specification and * is a linking point.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: May 15, 2018
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Yu-Shin Park, Tae-Ho Kim, Yoo-Jeong Choi, Sun-Hae Kang, Hyo-Young Kwon, Sang-Kyun Kim, Young-Min Kim, Youn-Hee Nam, Hyun-Ji Song, Byeri Yoon, Dong-Geun Lee, Seulgi Jeong
  • Dielectric composition and multilayer ceramic capacitor containing the same
    Patent number: 9959976
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on outer surfaces of the ceramic body, wherein the dielectric layer contains zirconium (Zr), a Zr content is 2×Zr/(Ba+Ca+Ti+Zr) based on an atomic ratio, a first crystal grain is composed of a core part having a Zr content of 3.0 at % or less and a shell part having a Zr content of 4.0 to 15.0 at %, and a number fraction of the first crystal grain to all crystal grains in the dielectric layer is 4% or more.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: May 1, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Hyun Yoon, Dong Hun Kim, Jung Deok Park, Chan Hee Nam, Jung Wook Seo
  • Display Device with Touch Sensor
    Publication number: 20180095567
    Abstract: Disclosed are an organic light emitting display device and a method of manufacturing the same to reduce thickness and weight. The organic light emitting display device with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensing electrode and a touch driving electrode arranged in parallel and a color filter on an encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.
    Type: Application
    Filed: February 21, 2017
    Publication date: April 5, 2018
    Inventors: Jae-Won LEE, Seung-Hee NAM, Min-Joo KIM, Kwon-Shik PARK, Jae-Young OH, Deuk-Su LEE, Bu-Yeol LEE, Eun-Hye LEE
  • Display Device with Touch Sensor
    Publication number: 20180095566
    Abstract: Disclosed is an organic light emitting display having reduced thickness and weight. The organic light emitting display with a touch sensor removes the necessity of an additional adhesion process by directly forming a touch sensor including a touch sensing line and a touch driving line and a color filter on the encapsulation layer covering a light emitting device, thereby simplifying a manufacturing process and reducing manufacturing costs.
    Type: Application
    Filed: February 21, 2017
    Publication date: April 5, 2018
    Inventors: Jae-Won LEE, Seung-Hee NAM, Min-Joo KIM, Kwon-Shik PARK, Jae-Young OH, Deuk-Su LEE, Bu-Yeol LEE, Eun-Hye LEE, Tae-hwan KIM
  • Dielectric ceramic composition and multilayer ceramic capacitor containing the same
    Patent number: 9928959
    Abstract: A dielectric ceramic composition and a multilayer ceramic capacitor containing the same are provided. The dielectric ceramic composition contains a base material powder represented by (1?x)BaTiO3?xPbTiO3 containing a first main ingredient represented by BaTiO3 and a second main ingredient represented by PbTiO3, wherein x satisfies 0.0025?x?0.4. The multilayer ceramic capacitor includes a ceramic body in which dielectric layers containing the dielectric ceramic composition are alternately stacked with first and second internal electrodes, and first and second external electrodes formed on both end portions of the ceramic body and respectively electrically connected to the first and second internal electrodes.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: March 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Hyun Yoon, Sung Kwon Wi, Jung Deok Park, Jung Wook Seo, Chan Hee Nam, Dong Hun Kim