Patents by Inventor Hee In Nam

Hee In Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organic layer composition, organic layer, and method of forming patterns
    Patent number: 9908990
    Abstract: An organic layer composition, an organic layer, and a method of forming patterns, the composition including a polymer that includes a substituted or unsubstituted fluorene structure, an additive represented by Chemical Formula 1, and a solvent:
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: March 6, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Sun-Hae Kang, Youn-Hee Nam, Min-Soo Kim, Dominea Rathwell, You-Jung Park, Hyun-Ji Song, Sun young Yang
  • FRONT ELECTRODE FOR SOLAR CELL AND SOLAR CELL INCLUDING THE SAME
    Publication number: 20180047859
    Abstract: A front electrode for solar cells and a solar cell, the front electrode including a stepped structure at an outermost surface thereof, wherein the stepped structure is composed of n stages, in which n is an integer of 3 or greater, and an nth stage has a smaller cross-sectional area than an (n?1)th stage such that the (n?1)th stage is partially exposed, and the stepped structure occupies about 5% to about 100% of a total surface area of the outermost surface.
    Type: Application
    Filed: July 27, 2017
    Publication date: February 15, 2018
    Inventors: Dong Suk KIM, Hee In NAM, Sang Hee PARK, Seok Hyun JUNG, Jae Hwi CHO
  • DIELECTRIC CERAMIC COMPOSITION, MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME, AND MANUFACTURING METHOD OF MULTILAYER CERAMIC CAPACITOR
    Publication number: 20180033555
    Abstract: A dielectric ceramic composition contains: a barium titanate-based powder as a main ingredient; a first accessory ingredient containing Na; a second accessory ingredient containing Ba; and a third accessory ingredient containing Si. A content of the first accessory ingredient (based on moles of Na) is 0.3 to 4.0 moles per 100 moles of the main ingredient, and a Ba/Si ratio is in a range of 0.16 to 1.44.
    Type: Application
    Filed: April 4, 2017
    Publication date: February 1, 2018
    Inventors: Seok Hyun YOON, Jung Deok PARK, Chang Hak CHOI, Dong Hun KIM, Seung Ho LEE, Chan Hee NAM
  • Monomer, polymer, organic layer composition, organic layer, and method of forming patterns
    Patent number: 9862668
    Abstract: A monomer, a polymer, an organic layer composition, an organic layer and associated methods, the monomer being represented by Chemical Formula 1:
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: January 9, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Youn-Hee Nam, Hyo-Young Kwon, Sung-Hwan Kim, Seung-Hyun Kim, Ran Namgung, Dominea Rathwell, Soo-Hyoun Mun, Seulgi Jeong, Hyeon-Il Jung, Yu-Mi Heo
  • Composite perovskite powder, preparation method thereof, and paste composition for internal electrode having the same
    Patent number: 9842696
    Abstract: There are provided a composite perovskite powder, a preparation method thereof, and a paste composition for an internal electrode having the same, the composite perovskite powder capable of preventing ions from being eluted from an aqueous system at the time of synthesis while being ultra-atomized, such that when the composite perovskite powder is used as an inhibitor powder for an internal electrode, sintering properties of the internal electrode may be deteriorated, and sintering properties of a dielectric material may be increased; accordingly, connectivity of the internal electrode may be improved, and permittivity and reliability of a multilayer ceramic capacitor (MLCC) may be increased.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: December 12, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kum Jin Park, Chang Hak Choi, Sang Min Youn, Kwang Hee Nam, Ki Myoung Yun, Hyung Joon Jeon, Jong Hoon Yoo
  • DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20170345882
    Abstract: Disclosed are a display device and a method of manufacturing the same. In the disclosed display device, a pad cover electrode disposed on a pad area comes into contact with an upper surface and a side surface of a pad electrode since a planarization layer is disposed on an active area excluding the pad area, which may prevent contact failure between the pad cover electrode and a conductive ball. In addition, in the display device, a first electrode, which is connected to a thin film transistor via a pixel connection electrode, is formed via the same mask process as the planarization layer so that it has a line width similar to that of the planarization layer and overlaps the planarization layer, which may simplify a structure and a manufacturing process.
    Type: Application
    Filed: May 30, 2017
    Publication date: November 30, 2017
    Inventors: Seung-Hee NAM, Jeong-Oh KIM, Jung-Ho BANG, Jung-Sun BEAK, Jong-Won LEE
  • METHOD FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM AND DEVICE FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM
    Publication number: 20170336315
    Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of applying a voltage to the polymer film, while at least one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.
    Type: Application
    Filed: January 29, 2016
    Publication date: November 23, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Young Kook KIM, Jung Hak KIM, Hee Jung KIM, Se Ra KIM, Jung Ho JO, Kwang Joo LEE, Seung Hee NAM, Ji Ho HAN
  • METHOD FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM AND DEVICE FOR MEASURING METAL ION PERMEABILITY OF POLYMER FILM
    Publication number: 20170328851
    Abstract: The present invention relates to a method for measuring metal ion permeability of a polymer film, comprising the steps of: applying a voltage to the polymer film at a temperature of 5° C. to 250° C., while one side of the polymer film is brought into contact with an electrolyte comprising metal ions, an organic solvent and an aqueous solvent; and measuring the change rate of resistance or change rate of current of the polymer film according to time, after the voltage is applied, and a device for measuring metal ion permeability of a polymer film used therefor.
    Type: Application
    Filed: January 29, 2016
    Publication date: November 16, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Jung Hak KIM, Young Kook KIM, Kwang Joo LEE, Hee Jung KIM, Se Ra KIM, Jung Ho JO, Seung Hee NAM, Ji Ho HAN
  • METHOD AND SYSTEM FOR PROVIDING RINGBACK TONE SERVICE AND RINGTONE SERVICE IN VOICE OVER INTERNET PROTOCOL (VOIP) CALL SERVICE
    Publication number: 20170331948
    Abstract: Provided is a method, a system, an apparatus, and/or a non-transitory computer readable medium for providing a ringback tone and a ringtone using a Voice over Internet Protocol (VoIP) call service. A call method may provide sound sources directly edited by users as a ringtone or a ringback tone in a VoIP call service.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 16, 2017
    Applicant: LINE Corporation
    Inventors: Deok Yong AHN, Sanghyuk SUH, Keum Ryong KIM, Tae Jeong LEE, Jaehyun LEE, Min Jeong KIM, Hee Nam BYUN, Jeongrok KIM, Hwan KIM, Seung Wook CHOI
  • EXHAUST MANIFOLD FOR VEHICLE
    Publication number: 20170284267
    Abstract: An exhaust manifold for a vehicle configured for improving fuel efficiency of the vehicle by improving fluidity of exhaust gas may include a manifold body having a plurality of inlet portions which are outwardly extended and an outlet portion which is outwardly extended, wherein the manifold body may have a flat surface formed on at least a portion of a top surface thereof.
    Type: Application
    Filed: November 30, 2016
    Publication date: October 5, 2017
    Applicant: Hyundai Motor Company
    Inventors: Jin Woo KWAK, In Woong LYO, Ji Ho KIM, Min Kyu PARK, Kyong Hwa SONG, Seung Woo LEE, Han Saem LEE, Hong Kil BAEK, Byung Wook KIM, Kwang Hee NAM, Sang Soo MIN
  • DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME
    Publication number: 20170271082
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on outer surfaces of the ceramic body, wherein the dielectric layer contains zirconium (Zr), a Zr content is 2×Zr/(Ba+Ca+Ti+Zr) based on an atomic ratio, a first crystal grain is composed of a core part having a Zr content of 3.0 at % or less and a shell part having a Zr content of 4.0 to 15.0 at %, and a number fraction of the first crystal grain to all crystal grains in the dielectric layer is 4% or more.
    Type: Application
    Filed: September 27, 2016
    Publication date: September 21, 2017
    Inventors: Seok Hyun YOON, Dong Hun KIM, Jung Deok PARK, Chan Hee NAM, Jung Wook SEO
  • Dicing film and dicing die-bonding film
    Patent number: 9761476
    Abstract: The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*105 to 4*106 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: September 12, 2017
    Assignee: LG CHEM, LTD.
    Inventors: Se Ra Kim, Jung Ho Jo, Young Kook Kim, Hee Jung Kim, Kwang Joo Lee, Jung Hak Kim, Seung Hee Nam
  • Semiconductor devices and methods of manufacturing the same
    Patent number: 9754826
    Abstract: A semiconductor device includes a metal pattern filling a trench formed through at least a portion of an insulating interlayer on a substrate and including copper, and a wetting improvement layer pattern in the metal pattern including at least one of tantalum, tantalum nitride, titanium, titanium nitride, ruthenium, cobalt and manganese.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: September 5, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Won Hong, Hei-Seung Kim, Kyoung-Hee Nam, In-Sun Park, Jong-Myeong Lee
  • Composition for solar cell electrode and electrode prepared using the same
    Patent number: 9741877
    Abstract: A composition for solar cell electrodes, the composition including silver (Ag) powder; a glass frit; an organic binder; and a solvent, the organic binder including a compound containing a repeat unit represented by Formula 1: wherein R1 is Na+, K+, NH4+, or PH3+; R2 is a hydrogen atom or a C1 to C2 alkyl group; and n is an integer of 1 to 3,500.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: August 22, 2017
    Assignee: Samsung SDI Co., Ltd.
    Inventors: HyungSeok Park, EunKyung Kim, Hee In Nam, SungIl Moon, Young Sil Lee
  • ADHESIVE FILM FOR SEMICONDUCTOR
    Publication number: 20170233610
    Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.
    Type: Application
    Filed: April 29, 2016
    Publication date: August 17, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Hee Jung KIM, Se Ra KIM, Jung Hak KIM, Seung Hee NAM, Jung Ho JO, Kwang Joo LEE, Young Kook KIM
  • ADHESIVE COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR, AND DICING DIE BONDING FILM
    Publication number: 20170198182
    Abstract: The present invention relates to an adhesive composition for a semiconductor including: a thermoplastic resin having a glass transition temperature of ?10° C. to 20° C.; a curing agent containing a phenol resin having a softening point of 70° C. or more; a solid epoxy resin; and a liquid epoxy resin, wherein a weight ratio of the total contents of the solid epoxy resin and the liquid epoxy resin to the thermoplastic resin is 1.6 to 2.6, an adhesive film for a semiconductor including the adhesive composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive composition for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film.
    Type: Application
    Filed: April 29, 2016
    Publication date: July 13, 2017
    Applicant: LG CHEM, LTD.
    Inventors: Hee Jung KIM, Se Ra KIM, Jung Hak KIM, Seung Hee NAM, Jung Ho JO, Kwang Joo LEE, Young Kook KIM
  • Monomer for hardmask composition, hardmask composition including the monomer, and method of forming patterns using the hardmask composition
    Patent number: 9683114
    Abstract: A monomer for a hardmask composition, a hardmask composition, and a method of forming patterns, the monomer being represented by the following Chemical Formula 1:
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: June 20, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Hea-Jung Kim, Sung-Hwan Kim, Youn-Hee Nam, Yun-Jun Kim, Joon-Young Moon, Hyun-Ji Song, Yong-Woon Yoon, Chung-Heon Lee
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20170170058
    Abstract: A semiconductor device includes a substrate, a first metal interconnection provided on a first region of the substrate, and a second metal interconnection provided on a second region of the substrate. A width of the second metal interconnection is greater than a width of the first metal interconnection. The first metal interconnection includes a metal pattern. The second metal interconnection includes a lower metal pattern having a concave surface at its top, an upper metal pattern disposed on the concave surface at the top of the lower metal pattern, and a first barrier pattern interposed between the lower metal pattern and the upper metal pattern. The metal interconnections are formed by a damascene process including deposition, reflow, metal implantation, and planarization processes.
    Type: Application
    Filed: October 24, 2016
    Publication date: June 15, 2017
    Inventors: SANGHO RHA, KYOUNG HEE NAM, JEONGGIL LEE, HYUNSEOK LIM, SEUNGJONG PARK, SEULGI BAE, JAEJIN LEE, KWANGTAE HWANG
  • THERMOELECTRIC GENERATING SYSTEM
    Publication number: 20170155027
    Abstract: A thermoelectric generating system is provided. The system includes one or more thermoelectric modules that are mounted on a top surface of a heat source part and a cooling part that is disposed over the thermoelectric modules. A pressurizing device is configured to pressurize the thermoelectric modules and the cooling part toward the heat source part and a cover is installed to cover an upper portion of the pressurizing device.
    Type: Application
    Filed: July 13, 2016
    Publication date: June 1, 2017
    Inventors: Jin Woo Kwak, In Woong Lyo, Kyong Hwa Song, Han Saem Lee, Byung Wook Kim, Hong Kil Baek, Seung Woo Lee, Tae Won Lim, Kwang Hee Nam, Sang Soo Min
  • Dielectric ceramic composition and multilayer ceramic capacitor containing the same
    Patent number: 9666369
    Abstract: There are provided a dielectric ceramic composition and a multilayer ceramic capacitor containing the same. The dielectric ceramic composition according to the present disclosure may contain a main base material ingredient and a first accessory ingredient, wherein the first accessory ingredient contains samarium (Sm) and other rare earth (RE) elements, and a ratio (a/b) of a content (a) of samarium (Sm) to a content (b) of other rare earth elements in the first accessory ingredient satisfies 0.1?a/b?2.0.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: May 30, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Sung Park, Chan Hee Nam, Doo Young Kim, Seok Hyun Yoon, Du Won Choi, Chang Hoon Kim