Abstract: A method of operating a semiconductor device includes applying a first voltage to a first source select line coupled to first source select transistors of memory strings included in an unselected memory block, among memory blocks, floating the first source select line after the first voltage is applied thereto, applying a second voltage having a lower voltage level than the first voltage to a second source select line coupled to second source select transistors of the memory strings included in the unselected memory block, applying a precharge voltage to a common source line, and applying a program voltage to a word line coupled to selected memory cells of memory strings included in a selected memory block, among the memory blocks.

Abstract: A semiconductor memory device includes a memory string and a control logic. The memory string is connected between a common source line and a bit line and includes at least one first select transistor, a plurality of memory cells, and a plurality of second select transistors. The control logic is configured to apply a first voltage to a first group among second select lines respectively connected to the second select transistors, float a second group among the second select lines and then apply an erase voltage to the common source line, during an erase operation.

Abstract: Provided herein may be a semiconductor memory device. The semiconductor memory device may include a memory cell array, a peripheral circuit, and control logic. The memory cell array includes a plurality of memory cells. The peripheral circuit performs a read operation on the memory cells. The control logic controls the read operation of the peripheral circuit. During the read operation, the control logic controls the peripheral circuit so that a read voltage is applied to a selected word line among a plurality of word lines coupled to the memory cells, a first pass voltage is applied to an unselected word line disposed adjacent to the selected word line and a second pass voltage is applied to an unselected word line that is not disposed adjacent thereto. The peripheral circuit adjusts a magnitude of the first or second pass voltage based on a temperature of the semiconductor memory device.

Abstract: Disclosed is a memory system and a method of operating the memory system. The memory system includes a semiconductor memory device configured to read data stored in a selected logical page among a plurality of logical pages by applying different read voltages to a selected word line corresponding to the plurality of logical pages. The memory system also includes a controller configured to perform an operation for detecting and correcting an error of the data whenever each of the read voltages is applied to the selected word line.

Abstract: A semiconductor memory device includes a precharge block, a select block, a peripheral circuit, and control logic. The precharge block is connected to bit lines and includes memory cells in an erase state. The select block shares the bit lines with the precharge block and includes memory cells in a program state. The peripheral circuit performs erase operation on the select block. The control logic controls the peripheral circuit to turn on a first circuit connected to the precharge block and apply first voltage to global lines connected to the first circuit when erase voltage is applied to a source line commonly connected to the precharge block and the select block. The memory cells of the precharge block are turned on by the first voltage applied from the global lines, and the erase voltage applied to the source line is transferred to the bit lines through the precharge block.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: a memory block including a plurality of memory cells; and a peripheral circuit for performing a program operation and an erase operation on the memory block. The program operation is performed by using a hole injection method, and the erase operation is performed by using an electron charging method. The plurality of memory cells are programmed when a threshold voltage of each of at least some of the plurality of memory cells is decreased to be less than a set level in the program operation, and are erased when the threshold voltage of each of the plurality of memory cells is increased to be the set level or higher in the erase operation.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: sub-blocks divided with respect to a buffer page in which buffer cells are included; a voltage generator for, in a program operation of a selected sub-block among the sub-blocks, applying a first pass voltage to unselected word lines connected to the selected sub-block, and applying a second pass voltage lower than the first pass voltage to unselected word lines connected to an unselected sub-block; and a buffer line circuit for selectively turning on or turning off the buffer cells by selectively applying a turn-on voltage or a turn-off voltage to buffer lines connected to the buffer cells. A position of the buffer page is set as a default according to a physical structure of memory cells included in the sub-blocks, and is reset according to an electrical characteristic of the memory cells.

Abstract: A method of operating a semiconductor device includes applying a first voltage to a first source select line coupled to first source select transistors of memory strings included in an unselected memory block, among memory blocks, floating the first source select line after the first voltage is applied thereto, applying a second voltage having a lower voltage level than the first voltage to a second source select line coupled to second source select transistors of the memory strings included in the unselected memory block, applying a precharge voltage to a common source line, and applying a program voltage to a word line coupled to selected memory cells of memory strings included in a selected memory block, among the memory blocks.

Abstract: A method of operating a semiconductor memory device includes dummy-programming selected memory cells representing all the memory cells to be programmed for a programming operation. The method also includes determining as a first group of memory cells those selected memory cells having threshold voltages less than or equal to a reference threshold voltage and determining as a second group of memory cells those selected memory cells having threshold voltages greater than the reference threshold voltage. The method further includes programming the selected memory cells by applying a first bit line voltage to the memory cells of the first group, applying a second bit line voltage different from the first bit line voltage to the memory cells of the second group, and applying a same program pulse to the memory cells of the first and second groups.

Abstract: A method of operating a semiconductor device, the semiconductor device includes: a memory block including a plurality of word lines; and a control logic for performing a first program operation on first memory cells corresponding to a first word line among the plurality of word lines, performing the first program operation on second memory cells corresponding to a second word line adjacent to the first word line, performing a second program operation on the first memory cells, performing a dummy program operation on third memory cells corresponding to a third word line adjacent to the second word line, and performing the second program operation on the second memory cells.

Abstract: A memory device and an operating method thereof are provided. The memory device includes: a plurality of memory strings connected between a bit and source lines, the plurality of memory strings connected to a first select line, a plurality of word lines, and a second select line, which are disposed between the bit line and the source line; a peripheral circuit for programming a selected memory cell included in a selected memory string among the memory strings; and control logic for controlling the peripheral circuit to program the selected memory cell. The control logic controls the peripheral circuit to apply a positive voltage to the bit and source lines, which are connected to an unselected memory string, before a program voltage is applied to a selected word line connected to the selected memory cell, and discharge the word lines and the first and second select lines at different times.

Abstract: An error correction circuit includes a memory that stores at least one decoding parameter, a low density parity check (LDPC) decoder that includes a first variable node storing one bit of the data, receives the at least one decoding parameter from the memory, decides a degree of the first variable node based on the at least one decoding parameter, and decides a decoding rule necessary for decoding of the one bit based on the degree of the first variable node, and an adaptive decoding controller that outputs corrected data based on a decoding result of the LDPC decoder.

Abstract: A semiconductor device includes a first memory block including a first memory string, a second memory block including a second memory string, a common source line commonly coupled to the first memory block and the second memory block, a first bit line coupled to the first memory string, a second bit line coupled to the second memory string, a first page buffer for accessing the first memory string through the first bit line, and a second page buffer for accessing the second memory string through the second bit line. The first bit line and the first page buffer are electrically connected to each other when the first memory block is selected.

Abstract: A memory system includes: a plurality of dies including a plurality of memory blocks; and a memory controller for outputting a normal program command when a die including a selected memory block is a normal die having an electrical characteristic higher than or equal to a reference value in a program operation, and outputting a partial program command and a partial erase command when the die including the selected memory block is a low status die having an electrical characteristic lower than the reference value.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: sub-blocks divided with respect to a buffer page in which buffer cells are included; a voltage generator for, in a program operation of a selected sub-block among the sub-blocks, applying a first pass voltage to unselected word lines connected to the selected sub-block, and applying a second pass voltage lower than the first pass voltage to unselected word lines connected to an unselected sub-block; and a buffer line circuit for selectively turning on or turning off the buffer cells by selectively applying a turn-on voltage or a turn-off voltage to buffer lines connected to the buffer cells. A position of the buffer page is set as a default according to a physical structure of memory cells included in the sub-blocks, and is reset according to an electrical characteristic of the memory cells.

Abstract: A method of operating a semiconductor device includes applying a first voltage to a first source select line coupled to first source select transistors of memory strings included in an unselected memory block, among memory blocks, floating the first source select line after the first voltage is applied thereto, applying a second voltage having a lower voltage level than the first voltage to a second source select line coupled to second source select transistors of the memory strings included in the unselected memory block, applying a precharge voltage to a common source line, and applying a program voltage to a word line coupled to selected memory cells of memory strings included in a selected memory block, among the memory blocks.

Abstract: An error correction circuit includes a memory that stores at least one decoding parameter, a low density parity check (LDPC) decoder that includes a first variable node storing one bit of the data, receives the at least one decoding parameter from the memory, decides a degree of the first variable node based on the at least one decoding parameter, and decides a decoding rule necessary for decoding of the one bit based on the degree of the first variable node, and an adaptive decoding controller that outputs corrected data based on a decoding result of the LDPC decoder.

Abstract: A semiconductor device is provided which includes: a first group including a plurality of first memory blocks; a second group including a plurality of second memory blocks; a first common source line connected to the first group; a second common source line connected to the second group; a source line voltage supplying circuit supplying a source line voltage; a first switch controlling a connection between the first common source line and the source line voltage supplying circuit; and a second switch controlling a connection between the second common source line and the source line voltage supplying circuit. When one first memory block among the plurality of first memory blocks of the first group is selected, the first switch may be turned on, and the second switch may be turned off.

Abstract: A semiconductor device includes a first memory block including a first memory string, a second memory block including a second memory string, a common source line commonly coupled to the first memory block and the second memory block, a first bit line coupled to the first memory string, a second bit line coupled to the second memory string, a first page buffer for accessing the first memory string through the first bit line, and a second page buffer for accessing the second memory string through the second bit line. The first bit line and the first page buffer are electrically connected to each other when the first memory block is selected.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: sub-blocks divided with respect to a buffer page in which buffer cells are included; a voltage generator for, in a program operation of a selected sub-block among the sub-blocks, applying a first pass voltage to unselected word lines connected to the selected sub-block, and applying a second pass voltage lower than the first pass voltage to unselected word lines connected to an unselected sub-block; and a buffer line circuit for selectively turning on or turning off the buffer cells by selectively applying a turn-on voltage or a turn-off voltage to buffer lines connected to the buffer cells. A position of the buffer page is set as a default according to a physical structure of memory cells included in the sub-blocks, and is reset according to an electrical characteristic of the memory cells.