Abstract: The present invention is related to a memory circuit comprising: a resistive memory element comprising a programmable metallization cell, a bit line, a selection transistor operable to address the resistive memory element for coupling the resistive memory element to the bit line, and a further transistor coupled with the resistive memory element for applying a predefined potential at a node between the selection transistor and the resistive memory element.

Abstract: A memory device and method of operating the same. In one embodiment, the memory device includes a resistive memory cell including a resistive memory element wherein the resistive memory element is designed to acquire a low resistance state when applying a programming voltage and acquire to a high resistance state when applying an erasing voltage; and wherein the writing time for changing the resistance state of the resistive memory element can be relatively reduced.

Abstract: A memory includes a resistive memory cell and a circuit configured to provide an output signal indicating a state of the memory cell based on a comparison of a voltage across the memory cell to a threshold voltage.

Abstract: A memory device and method for operating a memory device is described. In one embodiment, the memory device has at least one memory cell including an active material, a current supply line, and a first switching device for switching a first current from the current supply line through the active material. The memory cell additionally includes at least one further switching device for switching a further current from the current supply line through the active material.

Abstract: According to one embodiment of the present invention, an integrated circuit is provided which includes a plurality of resistivity changing cells. At least two resistance ranges are assigned to each resistivity changing cell, each resistance range defining a possible state of the resistivity changing cell. The integrated circuit is operable in a cell initializing mode in which initializing signals are applied to the resistivity changing cells. The strengths and durations of the initializing signals are chosen such that the resistance of each resistivity changing cell is shifted into one of the resistance ranges assigned to the resistivity changing cell.

Abstract: According to one embodiment of the present invention, an integrated circuit includes a plurality of memory cells, the integrated circuit being operable in a memory cell testing mode in which testing signals are applied to the memory cells, wherein the strengths and durations of the testing signals at least partly differ from the strengths and durations of programming signals or sensing signals used for programming and sensing memory states of the memory cells.

Abstract: An integrated circuit having a resistance-based or resistively switching memory cell, and a method for operating a resistively switching memory cell is disclosed. One embodiment is adapted to be put in a low-resistance state by applying a first threshold voltage and in a high-resistance state by applying a second threshold voltage, wherein reading out of the data content from the memory cell is performed by applying a voltage to the memory cell in the range of the first or second threshold voltage or a higher voltage.

Abstract: The invention relates to a method for reading a memory datum from a resistive memory cell comprising a selection transistor which is addressable via a control value, the method comprising detecting a cell current flowing through the resistive memory cell, setting the control value depending on the detected cell current, and providing an information associated to the control value as a memory datum.

Abstract: An integrated circuit having a resistive memory including a resistive memory element, a selection device, a conductive line, and a reference electrode is disclosed. In one embodiment, the conductive line is set to a first voltage for establishing a first resistive state of the resistive memory element and to a second voltage, being lower than the first voltage, for establishing a second resistive state of the resistive memory element. The reference electrode is coupled to the resistive memory element and is set to a voltage level being provided between the first voltage and the second voltage.

Abstract: An integrated circuit comprises a resistive memory cell, at least one reference cell, a first device configured to apply a predetermined read voltage to the resistive memory cell and a second device configured to apply the predetermined read voltage to the reference cell. The resistive memory cell can be switched between a highly resistive memory state and at least one lowly resistive memory state. The reference cell comprises a resistance value representing a reference state. The first device generates the read voltage for a first resistance range, the first resistance range comprising the memory states of the resistive memory cell. The second device generates the read voltage for a second resistance range, the second resistance range being smaller in comparison to the first resistance range and comprising the reference state of the reference cell.

Abstract: An integrated circuit comprises a resistive memory cell, at least one reference cell, a first device configured to apply a predetermined read voltage to the resistive memory cell and a second device configured to apply the predetermined read voltage to the reference cell. The resistive memory cell can be switched between a highly resistive memory state and at least one lowly resistive memory state. The reference cell comprises a resistance value representing a reference state. The first device generates the read voltage for a first resistance range, the first resistance range comprising the memory states of the resistive memory cell. The second device generates the read voltage for a second resistance range, the second resistance range being smaller in comparison to the first resistance range and comprising the reference state of the reference cell.

Abstract: A semiconductor device includes a semiconductor substrate having an upper surface and a lower surface opposed to the upper surface. Integrated circuitry is formed at the upper surface of the semiconductor substrate. A plurality of active through-vias are electrically coupled to the integrated circuitry and extend from the upper surface to the lower surface of the semiconductor substrate. In addition, a plurality of other through-vias extend from the upper surface to the lower surface of the semiconductor substrate and are electrically isolated from any integrated circuitry in the substrate.

Abstract: A method and a circuit configuration for generating a reference voltage in a resistive semiconductor memory includes generating a reference voltage by connecting together two bitlines having different voltages. This method for generating a reference voltage can be used in a method and in a circuit configuration for reading at least one memory cell of a resistive memory cell array in a semiconductor memory. The generated reference voltage and a voltage dependent on the content of a resistive memory cell are applied to an amplifier to determine the content of the memory cell. The content of the memory cell is determined dependent on a relationship between the reference voltage and the voltage dependent on the content of the memory cell.

Abstract: A memory device, and method of operating the same, wherein the device includes resistive memory cells being switched between a low-resistive state and a high-resistive state; an evaluation unit, being coupled to a resistive memory cell to determine a resistive state of the resistive memory cell; and a voltage regulation circuit, being coupled to the resistive memory cell and to the evaluation unit. The voltage being applied to the resistive memory cell is regulated with respect to a target voltage.

Abstract: A method of determining the memory state of a resistive memory cell including a first electrode, a second electrode and an active material being arranged between the first electrode and the second electrode, comprises generating a read capacity by applying a voltage between the first electrode and the second electrode, discharging the read capacity over the active material of the memory cell, and determining the memory state of the memory cell in dependence on a change of the voltage during the discharge of the read capacity.

Abstract: The invention relates to a method for reading a memory datum from a resistive memory cell comprising a selection transistor which is addressable via a control value, the method comprising detecting a cell current flowing through the resistive memory cell, setting the control value depending on the detected cell current, and providing an information associated to the control value as a memory datum.

Abstract: The present invention is related to a memory circuit comprising: a resistive memory element comprising a programmable metallization cell, a bit line, a selection transistor operable to address the resistive memory element for coupling the resistive memory element to the bit line, and a further transistor coupled with the resistive memory element for applying a predefined potential at a node between the selection transistor and the resistive memory element.

Abstract: Memory device and method for operating a memory device is disclosed. In one embodiment, the memory device has at least one memory cell including an active material, a current supply line, and a first switching device for switching a first current from the current supply line through the active material. The memory cell additionally comprises at least one further switching device for switching a further current from the current supply line through the active material.

Abstract: A method and a circuit configuration for generating a reference voltage in a resistive semiconductor memory includes generating a reference voltage by connecting together two bitlines having different voltages. This method for generating a reference voltage can be used in a method and in a circuit configuration for reading at least one memory cell of a resistive memory cell array in a semiconductor memory. The generated reference voltage and a voltage dependent on the content of a resistive memory cell are applied to an amplifier to determine the content of the memory cell. The content of the memory cell is determined dependent on a relationship between the reference voltage and the voltage dependent on the content of the memory cell.

Abstract: The invention relates to a memory circuit comprising a resistive memory cell having a selection transistor and a resistive memory element connected in series, wherein the resistive memory element is coupled to a plate potential; and a control circuit to control the selection transistor by means of an activation signal a pre-charge circuit coupled with a node between the selection transistor and the resistive memory element and to apply a compensation potential to the node; wherein the control circuit controls the pre-charge circuit so that a compensation potential is applied to the node prior to a level transition of the activation signal.