Abstract: The present invention relates to a memory circuit and method of operating the same. In at least one embodiment, the memory circuit includes a resistive memory element coupled to a plate potential by a first terminal; a bit line which is connectable to a second terminal of the resistive memory element; a programming circuit operable to change the resistance of the resistive memory element; a bleeder circuit operable to provide a bleeding current to or from the bit line due to a change of the resistance of the resistive memory element caused by the programming circuit.

Abstract: A memory device and method of operating the same. In one embodiment, the memory device includes a resistive memory cell including a resistive memory element wherein the resistive memory element is designed to acquire a low resistance state when applying a programming voltage and acquire to a high resistance state when applying an erasing voltage; and wherein the writing time for changing the resistance state of the resistive memory element can be relatively reduced.

Abstract: The present invention relates to an integrated memory circuit for storing information, the memory circuit comprising a memory cell having a memory element with a first contact for connecting to a write/read unit and a second contact for connecting to a reference potential provided by a potential source and a resistive connecting element provided with a programmable resistance connected between the potential source to the second contact.

Abstract: A memory device includes a magnetic tunnel junction memory cell having a magnetic tunnel junction structure and a read switch. In one example, the read switch is connected to a conductor that is used to write to the magnetic tunnel junction structure. In a further example, the read switch is a transistor electrically coupled to the magnetic tunnel junction structure by a deep via contact. In a further example, the memory device includes a plurality of magnetic tunnel junction memory cells and a plurality of conductors respectively associated with the cells for writing information to the associated magnetic tunnel junction structures. Each read switch is connected to the conductor associated with a magnetic tunnel junction cell other than the cell in which the read switch resides.

Abstract: The state is read out from the ferroelectric transistor or stored in the ferroelectric transistor. During the read-out or storage of the state, at least one further ferroelectric transistor in the memory matrix is driven in such a way that it is operated in its depletion region.

Abstract: A memory device is configured to guarantee a high degree of flexibility and a compact construction. To this end, the existing plate line device of the memory device which functions on the basis of a hysteresis process is configured to detect the state of a memory capacitor and hence, the information that is stored.

Abstract: A memory matrix has at least one cell array including column lines and row lines. Memory elements are situated at points where the row lines and column lines intersect one another. In each case two adjacent lines are guided such that they cross one another in such a way that the two lines change their spatial configurations in sections along the direction in which they run. Thus an overcoupling of signals between the lines is minimized.

Abstract: A magnetic memory configuration stores data and avoids ageing effects. The memory configuration contains a cell array containing magnetic memory cells disposed along a first direction and a second direction crossing the former, a multiplicity of electrical lines along the first direction, and a multiplicity of electrical lines along the second direction. The magnetic memory cells in each case are disposed at crossover points of the electrical lines. A first current supply device supplies respectively selected electrical lines along the first direction with current. A second current supply device supplies respectively selected electrical lines along the second direction with current. The second current supply device is configured for setting the direction of the current in accordance with an information item to be written. The first current supply device is suitable for changing over the direction of the current as desired.

Abstract: The invention relates to an MRAM configuration that includes a selection transistor connected to several MTJ memory cells. The selection transistor has an increased channel width.

Abstract: It is difficult to fabricate a semiconductor memory device without any faulty memory storage cells. One solution is to produce more storage cells than needed on a device and faulty storage cells are replaced by the redundant storage cells. This solution requires that the addresses of the faulty storage cells, along with the replacement storage cells, be saved in a memory. The present invention teaches the use of non-volatile memory cells, particularly magnetoresistive random access memory (MRAM) cells, to store the addresses. Non-volatile memory cells can effectively replace the laser fuses currently used and also provides an advantage in the elimination of the laser fuse-burning step during the fabrication of the device.

Abstract: An integrated magnetoresistive semiconductor memory system, in which n memory cells that contain two magnetic layers each separated by a thin dielectric barrier, and associated word lines and bit lines that cross one another are vertically stacked in n layers. The system further contains a decoding circuit for selecting one of the n memory layers. The decoding circuit, on both ends of a word line or a bit line, is provided with one configuration each that contains n layer selecting transistors for selecting one of the n memory layers, and with a line selection transistor for selecting the respective horizontal word line or bit line on which a voltage is to be impressed.

Abstract: An integrated magnetoresistive semiconductor memory in which each memory cell contains a switching transistor or a diode in the form of an activatable isolating element, and two magnetic layers that are isolated by a thin tunnel barrier. Connecting conductors are respectively integrated for word lines, digit lines and bit lines and also for the purpose of activating the switching transistor in one or more memory cells. These connecting conductors are located in only two metallization planes and in a polysilicon connection plane.

Abstract: The form of leads of a cell array of a multiplicity of magnetic memory cells is optimized by deviating from a square cross section of the leads in such a way that the magnetic field component of the write currents lying in the cell array plane decreases sufficiently rapidly with increasing distance from the crossover point. The cell array is constructed from a matrix of the column leads and the row leads.

Abstract: The data memory has a plurality of banks, each with a multiplicity of memory cells that form a matrix of rows and columns with respectively assigned matrix row lines and column lines. The banks are arranged spatially one on top of the other as stacks, with the stack edges that are parallel to the matrix rows and at which the ends of the column lines that are connected to a respective column-driving device are located, lie in a common plane. The common plane extends in the direction of the matrix rows and is substantially orthogonal with respect to the direction of the columns. The column-driving devices of all the banks are arranged directly adjacent to one another as a block in the direction of the columns, on or near the same edge of the bank stack. The banks preferably contain memory cells which can be read out without damage, and in each case a plurality of column lines are each assigned to one common sense amplifier in the column-driving device of each bank.

Abstract: A memory device includes a magnetic tunnel junction memory cell having a magnetic tunnel junction structure and a read switch. In one example, the read switch is connected to a conductor that is used to write to the magnetic tunnel junction structure. In a further example, the read switch is a transistor electrically coupled to the magnetic tunnel junction structure by a deep via contact. In a further example, the memory device includes a plurality of magnetic tunnel junction memory cells and a plurality of conductors respectively associated with the cells for writing information to the associated magnetic tunnel junction structures. Each read switch is connected to the conductor associated with a magnetic tunnel junction cell other than the cell in which the read switch resides.

Abstract: The state is read out from the ferroelectric transistor or stored in the ferroelectric transistor. During the read-out or storage of the state, at least one further ferroelectric transistor in the memory matrix is driven in such a way that it is operated in its depletion region.

Abstract: The present invention relates to a method and apparatus for reducing data errors in a magneto-resistive random access memory (MRAM). According to the disclosed method, data bits and associated error correction code (ECC) check bits are stored into a storage area. Thereafter, the data bits and ECC check bits are read out and any errors are detected and corrected. A data refresh is then initiated based on a count and data bits and associated ECC check bits stored in the storage area are then refreshed by accessing the stored data bits and the associated ECC check bits, and ultimately by checking, correcting and restoring the data bits and the ECC check bits to the storage area.

Abstract: A memory device is configured to guarantee a high degree of flexibility and a compact construction. To this end, the existing plate line device of the memory device which functions on the basis of a hysteresis process is configured to detect the state of a memory capacitor and hence, the information that is stored.

Abstract: An integrated magnetoresistive semiconductor memory system, in which n memory cells that contain two magnetic layers each separated by a thin dielectric barrier, and associated word lines and bit lines that cross one another are vertically stacked in n layers. The system further contains a decoding circuit for selecting one of the n memory layers. The decoding circuit, on both ends of a word line or a bit line, is provided with one configuration each that contains n layer selecting transistors for selecting one of the n memory layers, and with a line selection transistor for selecting the respective horizontal word line or bit line on which a voltage is to be impressed.

Abstract: An integrated ferroelectric memory configuration and a method for producing the integrated ferroelectric memory configuration, in which memory cells are arranged using the stacking principle, and both capacitor electrodes, which are located one above the other, of each memory cell are directly electrically connected by means of contact plugs to corresponding source and drain regions of an associated selection transistor in the substrate. Contact plugs for the contact connection to the upper capacitor electrodes are produced from above the configuration.