Abstract: An integrated memory has a memory cell array with memory cells which are connected to word lines and bit lines. For the purpose of reading from or writing to one of the memory cells, a first word line can be connected to a supply circuit via a controllable first switching device and a second word line can be connected to the supply circuit via a controllable second switching device. A control circuit can drive the first switching device in dependence of an activation state of the second word line and the second switching device in dependence of an activation state of the first word line. Consequently, existing word lines that are not currently being used can be used for addressing one of the memory cells. As a result, only one wiring plane is required for the word lines.

Abstract: In order to provide a particularly space-saving capacitor configuration in a memory device, a plurality of second electrode regions which are not in direct electrical contact with one another are formed on areas of a first electrode region covered by a dielectric material. During operation of the capacitor configuration, portions of the first electrode region form bottom electrodes which are connected by a connecting region, so that an additional connecting device for the bottom electrodes is not necessary.

Abstract: The form of leads of a cell array of a multiplicity of magnetic memory cells is optimized by deviating from a square cross section of the leads in such a way that the magnetic field component of the write currents lying in the cell array plane decreases sufficiently rapidly with increasing distance from the crossover point. The cell array is constructed from a matrix of the column leads and the row leads.

Abstract: The invention relates to a memory device comprising numerous memory cells, each cell comprising at least one selection transistor and one stacked capacitor and driven via word and bit lines. This memory device comprises two metallized sheets through which the bit line is led and between which the memory cell stacked capacitor is arranged.

Abstract: It is difficult to fabricate a semiconductor memory device without any faulty memory storage cells. One solution is to produce more storage cells than needed on a device and faulty storage cells are replaced by the redundant storage cells. This solution requires that the addresses of the faulty storage cells, along with the replacement storage cells, be saved in a memory. The present invention teaches the use of non-volatile memory cells, particularly magnetoresistive random access memory (MRAM) cells, to store the addresses. Non-volatile memory cells can effectively replace the laser fuses currently used and also provides an advantage in the elimination of the laser fuse-burning step during the fabrication of the device.

Abstract: A circuit configuration for controlling write operations and read operations in an MRAM memory configuration includes selection transistors grouped in sections of equal numbers of the selection transistors. The selection transistors of each of the sections are jointly connected, at the ends of the bit lines, to a respective interacting pair of read/write amplifiers via those electrode terminals of the selection transistors that are not connected to the bit lines. The read/write amplifiers are controlled such that if a write signal is fed thereto, write currents for writing a logic “1” or “0” flow in a first direction or a second direction in all of the bit lines selected by a corresponding column select signal and, if a read signal is fed in, a logic state stored in one of the magnetoresistive memory cells can be read out.

Abstract: An MRAM device (200) and method of manufacturing thereof having second conductive lines (228) with a narrow width. The second conductive lines (228) partially contact the resistive memory elements (214), reducing leakage currents in neighboring cells (214).

Abstract: A structure and method of manufacture is disclosed herein for a semiconductor memory cell having size of 4.5 F2 or less, where F is the minimum lithographic dimension. The semiconductor memory cell includes a storage capacitor formed in a trench, a transfer device formed in a substantially electrically isolated mesa region extending over a substantial arc of the outer perimeter of the trench, a buried strap which conductively connects the transfer device to the storage capacitor, wherein the transfer device has a controlled conduction channel located at a position of the arc removed from the buried strap.

Abstract: A fuse circuit configuration is described wherein a compensation capacitor counteracts a parasitic capacitor. The parasitic capacitor occurs between a connection point of a switching transistor and a fuse and ground. The compensation capacitor is connected to an evaluation circuit. In this manner, the negative effects caused by the parasitic capacitor are compensated for.

Abstract: An integrated memory has a multiplexer and a differential sense amplifier with a differential input. The differential sense amplifier is connected to three bit lines by the multiplexer. The multiplexer electrically connects the differential input of the sense amplifier to any two of the three bit lines connected to it respectively, in accordance with its activation.

Abstract: The invention relates to a method for operating a ferroelectric memory configuration in the VDD/2 mode. The memory configuration has a large number of memory cells which each have at least one selection transistor, one storage capacitor with an upper and a lower electrode and one short-circuiting transistor whose source-drain junction is connected in parallel with the storage capacitor. After a read or write procedure in which the memory cells are driven via respectively associated word lines and via respectively associated bit lines which are precharged in a precharge phase, the short-circuiting transistor is driven during a standby phase and in the process short-circuits the electrodes in the storage capacitor. The method is characterized in that the time of the standby phase coincides with the time of the precharge phase and, in the process, the bit lines are at a different potential with respect to that of the two electrodes of the storage capacitor.

Abstract: An integrated memory contains two normal read amplifiers and two first redundant read amplifiers. It also contains bit lines which are combined into at least two individually addressable normal columns, at least one of which from each normal column is connected to one of the normal read amplifiers. It also has first redundant bit lines which are combined into one individually addressable redundant column, at least one of which is connected to one of the redundant read amplifiers. The first redundant read amplifier and its redundant columns are provided for replacing the two normal read amplifiers and one of the normal columns.

Abstract: An MRAM device (100) and method of manufacturing thereof having wordlines (112) that run non-orthogonal relative to bitlines (122), resulting in lower current and power consumption.

Abstract: An integrated semiconductor memory has memory cells with a ferroelectric memory property. The memory cells are in each case connected between a column line and a charge line. The column line is connected to a read amplifier which supplies an output signal. The charge line is connected to a driver circuit which provides the charge line with a given potential. In an inactive mode, the column line and the charge line are jointly connected to a connection for a common supply potential in the read amplifier or in the driver circuit. As a result, a relatively quick equalization of a potential between the lines is possible. Thus, unintended changes in the memory cell content due to interfering voltages are avoided.

Abstract: A circuit configuration and a method for accelerating aging in an MRAM, in which additional circuit are provided in order to feed a higher current into a control line of a memory cell which is located nearer the soft-magnetic layer. A second transistor is inserted in parallel with the driver transistors, which form a first control unit. The second transistor supplies a current through the control line located nearer the soft-magnetic layer. The second transistor can drive a higher current through the control line and can be activated in a test mode.

Abstract: The integrated memory has driver units DRVi, via which the column select lines CSLi are connected to the plate line segments PLi and which, as a function of the potential of the associated column select lines CSLi and the word addresses RADR on the plate line segments PLi connected to them, generate potentials which have defined values for each operating state of the memory.

Abstract: The invention provides a method. In a first step of a method for fabricating a ferroelectric memory configuration, there is provided a substrate having a multiplicity of memory cells. Each of the memory cells has at least one select transistor, at least one short-circuit transistor, and at least one ferroelectric capacitor. The transistors are connected in an electrically conductive manner to a first of the electrodes of the ferroelectric capacitor. In the next step, at least one electrically insulating layer is applied. In the next step, at least one contact hole for connecting a second electrode of the ferroelectric capacitors is produced. Next, contact holes for connecting the short-circuit transistors are produced. Next, the contact holes are filled with electrically conductive material. Next, an electrically conductive layer is applied and patterned, so that the second electrodes of the ferroelectric capacitors are each conductively connected to the short-circuit transistors.

Abstract: An MRAM device (100) and method of manufacturing thereof having magnetic memory storage cells or stacks (MS0, MS1, MS2, MS3) coupled together in series. Devices (X0, X1, X2, and X3) are coupled in parallel to each magnetic memory storage cell (MS0, MS1, MS2, MS3). The active area (AA) is continuous, and contact vias (VU1, VL1, VU2, VL2 and VU3) are shared by magnetic stacks (MS0, MS1, MS2, MS3). N+ regions (108, 110, 112, 114, 116, 118) are coupled together by devices (X0, X1, X2, and X3).

Abstract: The memory has identically constructed memory cells and reference cells. An item of reference information is written into the reference cells by uncoupling the reference cells from the read amplifiers via first switching elements, and by electrically connecting the part of the bit lines that is connected to the reference cells via second switching elements to a potential line carrying the reference information.

Abstract: A decoder element is provided with an output, whereby an output signal with one of three different possible potentials is produced. The output signal may have a value of either a first potential, a second potential, and a third potential, where the second potential lies between the first potential and the third potential. The output signal is produced according to voltage values of input signals at terminal connections of the decoder element.