Patents by Inventor Hem Takiar

Hem Takiar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150001739
    Abstract: A memory device, and a method of making the memory device, are disclosed. The memory device is fabricated by mounting one or more semiconductor die on a substrate, and wire bonding the die to the substrate. The die and wire bonds are encapsuated, and the encapsulated device is singulated. The wire bonds are severed during the singulation step, and thereafter the severed wire bonds are connected to the substrate by external connectors on one or more surfaces of the molding compound.
    Type: Application
    Filed: October 22, 2012
    Publication date: January 1, 2015
    Inventors: Chin Tien Chiu, Cheeman Yu, Hem Takiar
  • Patent number: 8878368
    Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: November 4, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar
  • Patent number: 8878346
    Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: November 4, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Hua Java Zhu, Jack Chang-Chien, Cheemen Yu
  • Patent number: 8852999
    Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: October 7, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
  • Patent number: 8728864
    Abstract: A portable memory card formed from a multi-die assembly, and methods of fabricating same, are disclosed. One such multi-die assembly includes an LGA SiP semiconductor package and a leadframe-based SMT package both affixed to a PCB. The multi-die assembly thus formed may be encased within a standard lid to form a completed portable memory card, such as a standard SD™ card. Test pads on the LGA SiP package, used for testing operation of the package after it is fabricated, may also be used for physically and electrically coupling the LGA SiP package to the PCB.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: May 20, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Ning Ye, Robert C. Miller, Cheemen Yu, Hem Takiar, Andre McKenzie
  • Patent number: 8659133
    Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: February 25, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang, Hem Takiar
  • Patent number: 8653653
    Abstract: A semiconductor package is disclosed including a plurality semiconductor die mounted on stacked and bonded layers of substrate, for example polyimide tape used in tape automated bonding processes. The tape may have a plurality of repeating patterns of traces and contact pads formed thereon. The traces each include aligned interconnect pads on the respective top and bottom surfaces of the substrate for bonding the traces of one pattern to the traces of another pattern after the patterns have been singulated from the substrate, aligned and stacked. Semiconductor die such as flash memory and a controller die are mounted on the traces of the respective patterns on the substrate. In order for the controller die to uniquely address a specific flash memory die in the stack, a group of traces on each substrate supporting the memory die are used as address pins and punched in a unique layout relative to the layout of the traces other substrates.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: February 18, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Cheeman Yu, Chih-Chin Liao, Hem Takiar
  • Patent number: 8637963
    Abstract: A semiconductor device is disclosed including an electromagnetic radiation shield. The device may include a substrate having a shield ring defined in a conductance pattern on a surface of the substrate. One or more semiconductor die may be affixed and electrically coupled to the substrate. The one or more semiconductor die may then be encapsulated in molding compound. Thereafter, a metal may be plated around the molding compound and onto the shield ring to form an EMI/RFI shield for the device.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: January 28, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Kumar Upadhyayula, Hem Takiar, Chih-Chin Liao
  • Patent number: 8637972
    Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: January 28, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Chih-Chin Liao, Ning Ye, Cheemen Yu, Jack Chang Chien, Hem Takiar
  • Patent number: 8637978
    Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: January 28, 2014
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Robert C. Miller, Warren Middlekauff, Michael W. Patterson, Shrikar Bhagath
  • Publication number: 20140015116
    Abstract: A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.
    Type: Application
    Filed: December 16, 2011
    Publication date: January 16, 2014
    Applicants: Sandisk Information Technology (Shanghai) Co.,, Sandisk Semiconductor (Shanghai) Co., Ltd.
    Inventors: Peng Fu, Shan Luo, Zhong Lu, Kaiyou Qian, Chin Tien Chiu, Cheeman Yu, Hem Takiar, Ye Bai
  • Publication number: 20130299959
    Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
    Type: Application
    Filed: July 15, 2013
    Publication date: November 14, 2013
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar
  • Patent number: 8575739
    Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: November 5, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Suresh Upadhyayula, Ming Hsun Lee, Hem Takiar
  • Patent number: 8575724
    Abstract: A semiconductor device including a semiconductor die in a die stack under-filled with a film. Once the semiconductor die are formed, they may be stacked and interconnected. The interconnection may leave a small space between semiconductor die in the die stack. This space is advantageously completely filled using a vapor deposition process where a coating is deposited as a vapor which flows over all surfaces of the die stack, including into the spaces between the die in the stack. The vapor then deposits on the surfaces between and around the die and forms a film which completely fills the spaces between the die in the die stack. The material used in the vapor deposition under-fill process may for example be a member of the parylene family of polymers, and in embodiments, may be parylene-N.
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: November 5, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Shrikar Bhagath, Hem Takiar
  • Patent number: 8487441
    Abstract: A rigid wave pattern formed on a first side of a substrate in a semiconductor die package. The rigid wave pattern aligns with and overlies the contact fingers formed on the second side of the substrate. The rigid wave pattern includes a first pattern with an etched portion and an unetched portion around the etched portion. When the substrate and dice are encased during the molding process, the rigid wave pattern effectively reduces deformation of and stresses on the dice, therefore substantially alleviating die cracking.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: July 16, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Cheemen Yu, Hem Takiar
  • Patent number: 8482139
    Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: July 9, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu
  • Patent number: 8470640
    Abstract: A method of fabricating a semiconductor die and a low profile semiconductor package are disclosed. The semiconductor package may include at least first and second stacked semiconductor die mounted to a substrate. The first and/or second semiconductor die may be fabricated with localized cavities through a bottom surface of the semiconductor die, along a side edge of the semiconductor die. The one or more localized cavities in a side take up less than the entire side. Thus, the localized cavities allow low height stacking of semiconductor die while providing each die with a high degree of structural integrity to prevent cracking or breaking of the die edge during fabrication.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: June 25, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Shrikar Bhagath, Cheemen Yu, Chih-Chin Liao
  • Patent number: 8461675
    Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
    Type: Grant
    Filed: December 13, 2005
    Date of Patent: June 11, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Ken Jian Ming Wang, Chih-Chin Liao, Han-Shiao Chen
  • Patent number: 8432043
    Abstract: A low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and/or second semiconductor die may be fabricated with a plurality of redistribution pads formed over and electrically coupled to a plurality of bond pads. After the semiconductor die are formed and diced from the wafer, the die may be mounted to the substrate using a low profile reverse wire bond according to the present invention. In particular, a wedge bond may be formed between the wire and the redistribution pad without having to use a second wire bond ball on the die bond pad as in conventional reverse ball bonding processes.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: April 30, 2013
    Assignee: SanDisk Technologies Inc.
    Inventors: Hem Takiar, Shrikar Bhagath
  • Publication number: 20130087895
    Abstract: A semiconductor device is disclosed including an electromagnetic radiation shield. The device may include a substrate having a shield ring defined in a conductance pattern on a surface of the substrate. One or more semiconductor die may be affixed and electrically coupled to the substrate. The one or more semiconductor die may then be encapsulated in molding compound. Thereafter, a metal may be plated around the molding compound and onto the shield ring to form an EMI/RFI shield for the device.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 11, 2013
    Inventors: Suresh Kumar Upadhyayula, Hem Takiar, Chih-Chin Liao