Abstract: An embodiment of the present invention is a technique to distribute clock. At least a metal layer is formed to have a standing-wave structure to distribute a clock signal to receiver end points from a clock source such that the receiver end points are substantially electrically equivalent with respect to the clock source. The metal layer is embedded in dielectric layers made of thick film using a wafer-level thick film (WLTF) process.

Abstract: A system is disclosed. The system includes an external waveguide and an IC coupled to the external waveguide. The IC includes at least two lenses and a second waveguide. The lenses couple radiant energy from the external waveguide to the second waveguide.

Abstract: Micro-displays used for front or rear projection systems as well as near-eye viewing systems may be enhanced using embodiments of the present invention. In one embodiment, the invention may include an array of micromechanical optical modulators, an electronic control system for operating the optical modulators in accordance with a received video signal, and an overlayer for the array of modulators to modify the fill factor for incident light on the array of modulators, the incident light corresponding to at least one color constituent of a video signal.

Abstract: An embodiment of the present invention is a technique to distribute clock. At least a metal layer is formed to have a standing-wave structure to distribute a clock signal to receiver end points from a clock source such that the receiver end points are substantially electrically equivalent with respect to the clock source. The metal layer is embedded in dielectric layers made of thick film using a wafer-level thick film (WLTF) process.

Abstract: Micro-displays used for front or rear projection systems as well as near-eye viewing systems may be enhanced using embodiments of the present invention. In one embodiment, the invention may include an array of micromechanical optical modulators, an electronic control system for operating the optical modulators in accordance with a received video signal, and an overlayer for the array of modulators to modify the fill factor for incident light on the array of modulators, the incident light corresponding to at least one color constituent of a video signal.

Abstract: An embodiment of the present invention is a technique to distribute clock. At least a metal layer is formed to have a standing-wave structure to distribute a clock signal to receiver end points from a clock source such that the receiver end points are substantially electrically equivalent with respect to the clock source. The metal layer is embedded in dielectric layers made of thick film using a wafer-level thick film (WLTF) process.

Abstract: A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.

Abstract: An embodiment of the present invention is a technique to distribute clock. At least a metal layer is formed to have a standing-wave structure to distribute a clock signal to receiver end points from a clock source such that the receiver end points are substantially electrically equivalent with respect to the clock source. The metal layer is embedded in dielectric layers made of thick film using a wafer-level thick film (WLTF) process.

Abstract: A waveguide has a curved surface to redirect light from a first significant axis to a second significant axis. The curved surface may comprise multiple distinct angled segments or facets or may comprise a graduated curve.

Abstract: An optical or optoelectroronic component is mounted to a substrate, and an optical thumbtack is inserted into a through-hole of the substrate. The optical thumbtack is positioned to receive light from or send light to the optical or optoelectronic component and provide a conditioned, for example collimated or focused, beam. The optical thumbtack comprises a lens portion, a spacer portion, and a foot portion. Light may enter the thumbtack from either direction.

Abstract: One or more optical or optoelectronic components are mounted to one or more substrates/boards, and an optical assembly is inserted into one or more through-holes in the one or more substrates/boards. The optical assembly is positioned to receive light from or send light to the optical or optoelectronic components and provide a conditioned, for example collimated or focused, beam. The optical assembly comprises at least one lens portion, spacer portion, coupler portion, and a waveguide.

Abstract: An optical or optoelectronic component is mounted to a substrate, and an optical thumbtack is inserted into a through-hole of the substrate. The optical thumbtack is positioned to receive light from or send light to the optical or optoelectronic component and provide a conditioned, for example collimated or focused, beam. The optical thumbtack comprises a lens portion, a spacer portion, and a foot portion. Light may enter the thumbtack from either direction.

Abstract: A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.

Abstract: An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

Abstract: An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

Abstract: An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

Abstract: An electronic package and method for spatially distributing a clock signal is presented. The electronic package includes a low-loss structure, a semiconductor die, clocking vias, and clock receivers on the die. The low-loss structure is constructed and arranged to be driven by a clock signal and to produce standing waves. The clocking vias are constructed and arranged to connect the low-loss structure to the die and to conduct the standing waves to the die. The clock receivers generate respective synchronous on-chip clock signals based at least in part on the conducted standing waves.

Abstract: A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.

Abstract: The invention relates to a method and a device for the processing of medical image data so as to determine output function data (S(k)), situated at grid points (8) of a selected grid, from input function data (I.sub.c (r)) situated at grid points (2, 7) of a Cartesian grid (1, 6). A method of this kind is used, for example in magnetic resonance tomography or computer tomography, so as to calculate arbitrary projections from given function data. The method of the invention includes the following steps: determination of modified input function data (I.sub.c '(r)) by division of the input function data (I.sub.c (r)) by the Fourier transform (c(r)) of a convolution kernel (C(k)), determination of the Fourier transform (S.sub.c '(k)) of the modified input function data (I.sub.c '(r)), and determination of the output function data (S(k)) by convolution of the Fourier transform (S.sub.