Patents by Inventor Henning Haffner

Henning Haffner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6232154
    Abstract: A method to optimize the size and filling of decoupling capacitors for very large scale integrated circuits (VLSI) using existing lithographic fillers. The method combines the automatic or manual generation of lithographic fill patterns with the forming of the capacitors. According to the method, when the chip layout is about to be finished, all remaining empty space on the chip gets identified by a layout tool. Then, the closest power-supply nets get extracted. All power supplies and their combinations are sorted in a connection table which determines the appropriate types of capacitances once the power-supply nets closest to the empty spaces extracted from the layout. The empty spaces are then assigned appropriate decoupling capacitances. Decoupling capacitors generated by the method are suitable for VLSI power supplies for noise reduction.
    Type: Grant
    Filed: November 18, 1999
    Date of Patent: May 15, 2001
    Assignee: Infineon Technologies North America Corp.
    Inventors: Armin M. Reith, Louis Hsu, Henning Haffner, Gunther Lehmann