Abstract: A collecting plate is disclosed. The collecting plate includes a body having a plurality of holes arranged in an array and a plurality of mitt members respectively disposed over the plurality of holes. The holes and the mitt members are configured to capture and store contaminant particle and prevent contaminant particles from entering processing chamber.

Abstract: An apparatus for ion implantation is disclosed. The apparatus comprising an arc chamber and an electron source device. The electron source device includes a cathode and a filament. The filament is disposed within the cathode. The cathode has a body and a cap disposed over the body. The cap has a receiving surface and a emitting surface opposite the receiving surface. The emitting surface has a convex shape facing the receiving area of the arc chamber and the receiving surface has a conical shape where a center area is a flat surface and the center area being surrounded by a tapered sidewall.

Abstract: A method of forming an oxide structure is disclosed. The method includes forming trenches on a top surface of a substrate and performing a surface treatment process on the substrate. The surface treatment includes forming an amorphous layer on the substrate, removing a portion of the amorphous layer to form a liner layer, and forming a dielectric liner on the liner layer. The liner layer formed are substantially uniform in thickness to prevent contamination and pinhole defects on the oxide structure.

Abstract: A collecting plate is disclosed. The collecting plate includes a body having a plurality of holes arranged in an array and a plurality of mitt members respectively disposed over the plurality of holes. The holes and the mitt members are configured to capture and store contaminant particle and prevent contaminant particles from entering processing chamber.

Abstract: An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

Abstract: An electronic module includes a first component, a second component, a spacer, and an adhesive portion. The first component includes a first surface. The second component is disposed to be spaced apart from the first surface by a distance of about 40 ?m to about 200 ?m. The spacer spaces the first component and the second component apart from each other. The adhesive portion is disposed between the first surface and a bonding surface of the spacer facing the first surface. The spacer includes an inner spacer having a ring shape, and an outer spacer surrounding the inner spacer and disposed spaced apart from the inner spacer by 50% or less of an overall width of the inner spacer and the outer spacer, and an overall width of the adhesive portion is 100% to 150% of the overall width of the inner spacer and the outer spacer.

Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Abstract: An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

Abstract: An electronic module includes a first component, a second component, a spacer, and an adhesive portion. The first component includes a first surface. The second component is disposed to be spaced apart from the first surface by a distance of about 40 ?m to about 200 ?m. The spacer spaces the first component and the second component apart from each other. The adhesive portion is disposed between the first surface and a bonding surface of the spacer facing the first surface. The spacer includes an inner spacer having a ring shape, and an outer spacer surrounding the inner spacer and disposed spaced apart from the inner spacer by 50% or less of an overall width of the inner spacer and the outer spacer, and an overall width of the adhesive portion is 100% to 150% of the overall width of the inner spacer and the outer spacer.

Abstract: An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

Abstract: An image sensor assembly, a method of manufacturing the same, and a camera module are provided. The image sensor assembly includes an image sensor including a pixel region provided on a surface of the image sensor, a cover disposed above the pixel region, a spacer disposed on a surface of the cover and the spacer being configured to maintain a distance between the image sensor and the cover, and an adhesive configured to fixedly attach the spacer to the image sensor, wherein the spacer comprises a first and a second member disposed parallel to and at a distance from each other.

Abstract: A printed circuit board, a semiconductor package, and a method of producing the same are provided. The printed circuit board (PCB) includes an insulating layer and a circuit layer including metal pads exposed on a side surface and a lower surface of the insulating layer.

Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.

Abstract: Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

Abstract: There are provided a micro electro mechanical systems (MEMS) structure and a method of manufacturing the same. The MEMS structure includes: a middle structure including an insulating layer, a circuit layer formed on the insulating layer, a mass formed beneath the insulating layer, and supports formed so as to be spaced apart from sides of the mass, and having corner portions of sides formed in a concave shape; an upper structure formed so as to enclose an upper portion of the middle structure; and a lower structure formed so as to enclose a lower portion of the middle structure.

Abstract: The microphone package includes: a package substrate including a lead frame and an insulating portion; and an acoustic device mounted on the package substrate and having a space formed in a lower surface thereof, wherein the package substrate includes an acoustic space connected to the space of the acoustic device.

Abstract: There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.

Abstract: Embodiments of the invention provide a micro electro mechanical systems (MEMS) microphone, which includes a microphone chip, a premold lead frame comprising a lead frame to which the microphone chip is electrically connected, and a cover coupled to the premold lead frame to cover the microphone chip and electrically connected to the premold lead frame.