Abstract: Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array.

Abstract: A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.

Abstract: The present invention relates to a MEMS package, and in particular, to the structure of a MEMS package. One aspect of the invention provides an optical modulator module package comprising a substrate, an optical modulator positioned on the substrate which modulates an optical signal and transmits the optical signal through the substrate, a driver IC (driver integrated circuit) mounted adjacent to the optical modulator which operates the optical modulator, circuit wiring formed on the substrate and configured which transfers signals for operating the optical modulator, and a printed circuit board positioned facing the substrate on the optical modulator and the driver IC for signal connection with an external circuit. With a MEMS module package according to an aspect of the invention, the overall size can be reduced by providing a different form of layer composition.

Abstract: A semiconductor chip package capable of detecting an open and a short is disclosed, comprising: a first pad group comprising a plurality of first substrate pad sub groups, formed on a substrate, each composed of first substrate pads electrically connected, and insulated from each other, and a plurality of first element pad sub groups formed on an element and composed of first element pads electrically connected such that each first substrate pad sub group is electrically connected through the first element pads corresponding to the first substrate pads; a second pad group electrically insulated from the first pad group when the element is connected to the substrate, and comprising a plurality of second substrate pad sub groups formed on the substrate, composed of second substrate pads electrically connected, and insulated from each other, and a plurality of second element pad sub groups formed on the element, and composed of second element pads electrically connected such that each second substrate pad sub gr

Abstract: A MEMS module package using a sealing cap having heat releasing capability is disclosed, which comprises a lower substrate, a MEMS element mounted on the lower substrate, a driver integrated circuit mounted on the lower substrate adjacently to the MEMS element which operates the MEMS element, and a sealing cap positioned in contact with the lower substrate which has a MEMS-element protrusion portion in physical contact with the MEMS element and has one or more grooves for housing the MEMS element and the driver integrated circuit. The MEMS module package using a sealing cap having heat releasing capability and a manufacturing method thereof according to an aspect of the present invention utilize an effective heat releasing structure to release the heat generated in each element.

Abstract: An optical modulator module is disclosed, comprising a bendable flexible printed circuit board in which a circuit pattern is formed, and to which control signals are inputted from the outside; an optical modulator element modulating an incident light according to a driving voltage and sending out the modulated light; an at least partially transparent substrate through which the incident light and the modulated light pass, and in which a circuit pattern is formed; and a driving integrated circuit electrically connected with the flexible printed circuit board, and supplying the optical modulator element with the driving voltage according to the inputted control signals, the flexible printed circuit board being electrically connected with the substrate.

Abstract: An optical modulator module package includes a substrate having a through-hole through which light passes and having a circuit formed on at least one of its inner and outer surfaces; a transparent lid held in the through-hole for transmitting incident light inputted to an optical modulator element and diffracted light emitted from the optical modulator element; and a metal connection part attached to a surface of the substrate for mounting the optical modulator element and driver integrated circuits. With an optical modulator module package according to embodiments of the present disclosure, the size of the module package may be minimized, as a transparent lid installed with a displacement from the optical modulator element is embedded within the substrate.

Abstract: An embedded IC packaging structure is disclosed. The embedded IC packaging structure allows a micro-electro-mechanical system (MEMS) having a great number of electrodes to be bonded to another semiconductor device, such as a driver IC, using a secondary substrate, thus ensuring an easy bonding process, providing IC devices capable of executing high-speed signal processing, reducing the production costs, and improving the production yield of the IC devices.

Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

Abstract: Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.

Abstract: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed.

Abstract: An embedded IC packaging structure is disclosed. The embedded IC packaging structure allows a micro-electro-mechanical system (MEMS) having a great number of electrodes to be bonded to another semiconductor device, such as a driver IC, using a secondary substrate, thus ensuring an easy bonding process, providing IC devices capable of executing high-speed signal processing, reducing the production costs, and improving the production yield of the IC devices.

Abstract: A micro-electro-mechanical system (MEMS) package with a side sealing member and a method of manufacturing the package are disclosed. In the MEMS package and method of the present invention, a sealing member is formed on a side surface of a lid glass that is mounted on a spacer surrounding MEMS elements provided on a base substrate and covers the MEMS elements, so that the sealing member hermetically seals the MEMS elements from the external environment.

Abstract: A wavelength stabilization module having a light-receiving element array and a method of manufacturing the same are disclosed.

Abstract: A silicon optical bench for packaging an optical switch device is provided. The silicon optical bench includes a silicon substrate. The silicon substrate includes a first region where the optical switch device will be installed, a second region placed on a first side of the first region so as to allow an optical input unit to be installed therein, and a third region placed on a second side of the first region so as to allow an optical output unit to be installed therein. Here, a cavity is formed in the first region through the silicon substrate, and grooves are arranged in the second and third regions of the silicon substrate so that a lens and an optical fiber for defining optical fibers can be installed in the grooves.

Abstract: A disk and hub assembly for an electromagnetic clutch, comprising: a plate including a stopper, which is projected from a face thereof and having a bolt through hole, and an inner ring portion folded from the outer periphery of the plate; a hub including a hub body, which is perforated through both ends and has a coupling hole to be coupled to a drive shaft of a compressor, a seating space for receiving and seating the stopper and a flange outwardly extended from an end of the hub body to be coupled to the plate; an outer including an outer ring portion surrounding the inner ring portion at a predetermined interval and a flange outwardly and angularly folded from the outer ring portion; a damper rubber received between the inner ring portion and the outer ring portion; and a disk coupled to the flange of the outer.