Abstract: Disclosed herein is an inertial sensor including: a sensor part including a driving body, a flexible substrate part displaceably supporting the driving body, a support part supporting the flexible substrate part so that the driving body is freely movable in a state in which it is floated, and a lower cap covering a lower portion of the driving body and coupled to the support part; an application specific integrated circuit (ASIC) including the sensor part stacked thereon and coupled thereto; a printed circuit board including the ASIC stacked thereon and coupled thereto and electrically connected to the sensor part and the ASIC by a wire; and a cap covering the sensor part and the ASIC and coupled to the printed circuit board, wherein the cap includes an air discharging hole formed in order to discharge internal air to the outside.

Abstract: Disclosed herein is a MEMS component. The MEMS component according to the exemplary embodiment of the present invention includes: a plate-shaped membrane 110; a post 130 disposed under an edge 115 of the membrane 110; a stopper 140 disposed under the membrane 110 and disposed more inwardly than the post 130 so as to form a space 143 between the stopper 140 and the post 130; and a cap 150 disposed under the post 130 so as to cover the post 130, whereby the influence of disturbance or noise occurring from external environments or interference from surrounding sensors can be interrupted by using a predetermined region 145 of the membrane 110 disposed above the space 143.

Abstract: Disclosed herein is an inertial sensor including: a sensor part including a driving body displaceably mounted on a flexible substrate part, a driving unit moving the driving body, and a displacement detection unit detecting a displacement of the driving body, wherein the inertial sensor includes an application specific integrated circuit (ASIC) including the sensor part coupled thereto; a printed circuit board including the ASIC coupled thereto and electrically connected to the sensor part and the ASIC by a wire; and a cap covering the sensor part and the ASIC and coupled to the printed circuit board, whereby the driving body and the flexing substrate part is protected and an interval between the driving body and the flexible substrate part is optimized to obtain efficient driving characteristics and a Q factor and improve a freedom of design in a space use.

Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

Abstract: Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other.

Abstract: Disclosed herein is an inertial sensor. An inertial sensor 100 according to a preferred embodiment of the present invention includes a plate-shaped membrane 110, a mass body 130 that is provided under a central portion 111 of the membrane 110 and includes an integrated circuit, and a post 140 that are provided under an edge 112 of the membrane 110 to surround the mass body 130, whereby the overall thickness and area of the inertial sensor can be reduced by including the integrated circuit in the mass body 130 to implement a thin and small inertial sensor 100.

Abstract: Disclosed herein is an inertial sensor. The inertial sensor includes a sensor unit including a flexible substrate part on which a driving electrode and a sensing electrode are formed, a mass displaceably mounted on the flexible substrate part, and a support body coupled with the flexible substrate part in order to support the mass in a floated state and made of silicon; and a lower cap covering a bottom portion of the mass and made of silicon, wherein the lower cap and the sensor unit are coupled by a silicon direct bonding method, whereby the inertial sensor and the method of manufacturing the same may be obtained to improve the convenience in manufacturing and the reliability of the sensor by bonding the sensor unit and the lower cap by the silicon direct bonding method.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor using a polling method of a piezoelectric element performing a polling after packaging the piezoelectric element, the method of manufacturing an inertial sensor including: forming a driving electrode and a sensing electrode on a flexible substrate on which a piezoelectric material is deposited; electrically connection the driving electrode and the sensing electrode; packaging the flexible substrate; polling by applying voltage and heat to the driving electrode and the sensing electrode; and electrically separating the driving electrode from the sensing electrode by applying heat to the driving electrode and the sensing electrode.

Abstract: Disclosed herein is an inertial sensor. There is provided an inertial sensor 100, including: a plate-like substrate layer 110, a mass body 130, a post 140, a support part 150 extending in the central direction of the mass body 130 from the post 140, and a detection unit 170 detecting the displacement of the displacement part 113. The inertial sensor adopts the support part 150 limiting the downward displacement of the mass body 130 to prevent the support portion of the mass body 130 from being damaged.

Abstract: Disclosed herein is an inertial sensor which includes a sensing unit including a mass mounted to be displaced on a flexible substrate part, a driving unit moving the mass, and a displacement detecting unit detecting a displacement of the mass, the inertial sensor comprising: a top cap covering a top of the flexible substrate part; and a bottom cap covering a bottom of the mass. Thereby, the inertial sensor can be implemented in an economic EMC molding package shape, while protecting the mass and the piezo-electric element. Further, the inertial sensor optimizes a thickness of the cap covering the mass and the piezo-electric element and an interval between the mass and the piezo-electric element to have improved freedom in design of space utilization as well as improved driving characteristics and Q values.

Abstract: An optical modulator module package includes a substrate having a through-hole through which light passes and having a circuit formed on at least one of its inner and outer surfaces; a transparent lid held in the through-hole for transmitting incident light inputted to an optical modulator element and diffracted light emitted from the optical modulator element; and a metal connection part attached to a surface of the substrate for mounting the optical modulator element and driver integrated circuits. With an optical modulator module package according to embodiments of the present disclosure, the size of the module package may be minimized, as a transparent lid installed with a displacement from the optical modulator element is embedded within the substrate.

Abstract: Disclosed are a laser module apparatus and a display apparatus using the same. In accordance with an embodiment of the present invention, a laser module package which generates a green laser beam can include a pumping light source, configured to generate and output a pump beam; a laser medium, configured to receive the pump beam and output an infrared beam; an optical crystal, configured to receive the infrared beam and output a laser beam having a green wavelength band; and a micro heater, configured to be thermally coupled to the pumping light source and control an operation temperature of the pumping light source to be maintained to a predetermined target temperature.

Abstract: A projection type of display apparatus for removing a noise is disclosed. In accordance with an embodiment of the present invention, the projection type of display apparatus includes: a light source; an optical board, incidenting a beam of light emitted from the light source; and an optical modulator, being fixed on one surface of the optical board and modulating and emitting the beam of light that passed through the optical board. The blocking layer is formed on the optical board. With the present invention, it is possible to remove the noise of the image and display the image more clearly by enhancing the contrast.

Abstract: Disclosed is an optical modulator module having a micro-heater. The optical modulator module can include an optical modulator, modulating a beam of light emitted from a light source and emitting the modulated beam of light; and a micro-heater, manufactured in the optical modulator. The present invention provides an optical modulator module having a micro-heater and a temperature sensor that can control temperature in order to prevent an error of the operation of an optical modulator caused by the temperature and that can make the operation of an optical modulator stable within a shorter during of time directly after a power is supplied to the optical modulator module.

Abstract: A green laser module package is disclosed. A green laser module package which generates a laser in a wavelength range of green visible lights comprising: a stem located on a basal surface of the green laser module package; a pumping light source that generates a pumping light; a laser medium that converts the pumping light into an infrared light; an optical crystal that converts the infrared light into a laser in wavelength range of green visible lights; a first thermoelectric element, located on the stem and thermally coupled to the pumping light source, that controls working temperature of the pumping light source; an optical part that reflects the green laser from the optical crystal in a perpendicular direction to an optical axis of the pumping light source; and a window that transmits the perpendicularly reflected green laser, toward outside of the green laser module package, is provided.

Abstract: An optical modulator module is disclosed, comprising a bendable flexible printed circuit board in which a circuit pattern is formed, and to which control signals are inputted from the outside; an optical modulator element modulating an incident light according to a driving voltage and sending out the modulated light; an at least partially transparent substrate through which the incident light and the modulated light pass, and in which a circuit pattern is formed; and a driving integrated circuit electrically connected with the flexible printed circuit board, and supplying the optical modulator element with the driving voltage according to the inputted control signals, the flexible printed circuit board being electrically connected with the substrate.

Abstract: The present invention relates to a MEMS package, more specifically to an optical module package. According to an aspect of the present invention, the optical modulator module package includes an optical modulator, emitting a beam of light, which is modulated by diffracting and interfering the beam of light by an upwardly and downwardly spaced distance of a mirror, the beam of light being incident from a light source; a driver IC, mounted on the surrounding of the optical modulator to drive the optical modulator; and a noise removing member, intercepting a beam of light, which is not incident to a mirror area of the light modulator, of the incident beams of light.

Abstract: A semiconductor chip package capable of detecting an open and a short is disclosed, comprising: a first pad group comprising a plurality of first substrate pad sub groups, formed on a substrate, each composed of first substrate pads electrically connected, and insulated from each other, and a plurality of first element pad sub groups formed on an element and composed of first element pads electrically connected such that each first substrate pad sub group is electrically connected through the first element pads corresponding to the first substrate pads; a second pad group electrically insulated from the first pad group when the element is connected to the substrate, and comprising a plurality of second substrate pad sub groups formed on the substrate, composed of second substrate pads electrically connected, and insulated from each other, and a plurality of second element pad sub groups formed on the element, and composed of second element pads electrically connected such that each second substrate pad sub gr

Abstract: Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.