Abstract: Disclosed herein is an angular velocity sensor, including: a sensing module including a mass body part which includes a plurality of mass bodies disposed to be parallel with each other, an internal frame which movably supports the mass body, and sensing side flexible parts which rotatably connect the mass body to the internal frame; an external frame supporting the sensing module; and a vibration side flexible part rotatably connecting the sensing module to the external frame, wherein the vibration side flexible part is disposed between the internal frame and the external frame to be parallel with each other with respect to a disposition direction of the mass body part which is disposed in the internal frame.

Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

Abstract: Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element.

Abstract: Disclosed herein is a micro electro mechanical systems (MEMS) sensor module package. The MEMS sensor module package includes: an MEMS sensor; a base part formed so as to encapsulate the MEMS sensor with a resin; an external terminal provided on one surface of the base part; a through mold via (TMV) provided in the base part to electrically connect the external terminal and the MEMS sensor to each other; and an application specific integrated circuit (ASIC) stacked on the MEMS sensor. Compared to a MEMS sensor module package structure according to the prior art, the present invention is to reduce the entire size and implement electric shielding.

Abstract: Disclosed herein is a MEMS sensor module package. The MEMS sensor module package according to a preferred embodiment of the present invention includes: a printed circuit board (PCB); an application specific integrated circuit (ASIC) stacked on the PCB, one side of the ASIC being wire-bonded to the PCB; a MEMS sensor stacked on the ASIC; and a molding encapsulating the MEMS sensor and the ASIC with a resin. Accordingly, the electrical connection distance between a MEMS sensor and an ASIC is shortened so that electrical characteristic may be improved. Further, a sensor module package may be implemented in an ASIC size, so that size reduction may be achieved to meet the requirements of mobile devices.

Abstract: There is provided a microphone package including: a microphone element formed on a semiconductor element; a mold enclosing the semiconductor element and the microphone element; and a conductive pattern formed on one surface of the mold and having a hole formed therein, the hole being connected to the microphone element.

Abstract: There is provided a semiconductor package including: an application specific integrated circuit (ASIC) chip including a first bump ball and a second bump ball formed inwardly of the first bump ball; a micro electro mechanical system (MEMS) sensor electrically connected to the second bump ball; a lead frame electrically connected to the first bump ball and including a through hole formed therein; and a molded part covering the ASIC chip, the MEMS sensor, and the lead frame, wherein the ASIC chip is disposed above the lead frame.

Abstract: There are provided an acoustic device manufactured using a micro electro mechanical system (MEMS) technology, and a microphone package including the acoustic device. The acoustic device includes a device substrate including a cavity formed therein, a diaphragm formed to cover the cavity on the device substrate, a back plate formed to be spaced apart from the diaphragm, and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes, and shielding noise introduced from outside.

Abstract: There are provided a microphone package and a mounting structure thereof, allowing for an increase in a back volume, the microphone package including: a package substrate; an acoustic element mounted on the package substrate and having a space formed in a lower portion thereof; and at least one electronic component mounted on the package substrate and having a space formed in a lower portion thereof, wherein the package substrate includes an acoustic volume connecting the space of the acoustic element and the space of the electronic component.

Abstract: There is provided an electronic component module including: a substrate on which an electronic component is mounted; at least one insulating member coupled to the substrate and having a surface on which a plating layer is formed; and a molded portion covering the electronic component and the at least one insulating member, wherein the insulating member is bonded to the substrate and a metal layer is formed on a bonding surface between the substrate and the insulating member.

Abstract: Disclosed herein are an inertial sensor and a method of manufacturing the same. The inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 disposed under a central portion 113 of the membrane 110, a post 130 disposed under an edge 115 of the membrane 110 so as to support the membrane 110, and a bottom cap 150 of which the edge 153 is provided with the first cavity 155 into which an adhesive 140 is introduced, wherein the adhesive 140 bonds an edge 153 to a bottom surface of the post, whereby the edge 153 of the bottom cap 150 is provided with the first cavity 155 to introduce the adhesive 140 into the first cavity 155, thereby preventing the adhesive 140 from being permeated into the post 130.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor using a polling method of a piezoelectric element performing a polling after packaging the piezoelectric element, the method of manufacturing an inertial sensor including: forming a driving electrode and a sensing electrode on a flexible substrate on which a piezoelectric material is deposited; electrically connection the driving electrode and the sensing electrode; packaging the flexible substrate; polling by applying voltage and heat to the driving electrode and the sensing electrode; and electrically separating the driving electrode from the sensing electrode by applying heat to the driving electrode and the sensing electrode.

Abstract: Disclosed herein are a semiconductor package, a method of manufacturing a semiconductor package, and a stack type semiconductor package. The semiconductor package according to a preferred embodiment of the present invention includes: a base substrate on which a first circuit layer is formed; a semiconductor device formed on the base substrate; a molding part formed on the base substrate and formed to enclose the first circuit layer and the semiconductor device; a first via formed on the first circuit layer and formed to penetrate through the molding part; and a second circuit layer formed on an upper surface of the molding part and integrally formed with the first via.

Abstract: Disclosed herein is an inertial sensor including: a driving part displaceably supported by a support; a driving electrode vibrating the driving part; and a detecting electrode detecting a force acting on the driving part in a predetermined direction, wherein the driving part includes: a center driving mass positioned at the center of the inertial sensor; side driving masses connected to and interlocking with the center driving mass and positioned at four sides based on the center driving mass; and connection bridges connecting the center driving mass, the side driving masses, and the support to each other.

Abstract: An inertial sensor includes a plate-like substrate layer, a mass body, a support frame, a limit stop extending in the central direction of the mass body from the support frame, and a detection unit detecting the displacement of the displacement part. The inertial sensor adopts the limit stop limiting the downward displacement of the mass body to prevent the support portion of the mass body from being damaged.

Abstract: Disclosed herein is an inertial sensor. An inertial sensor 100 according to a preferred embodiment of the present invention includes a plate-shaped membrane 110, a mass body 130 that is provided under a central portion 111 of the membrane 110 and includes an integrated circuit, and a post 140 that are provided under an edge 112 of the membrane 110 to surround the mass body 130, whereby the overall thickness and area of the inertial sensor can be reduced by including the integrated circuit in the mass body 130 to implement a thin and small inertial sensor 100.

Abstract: Disclosed herein is a MEMS component. The MEMS component according to the exemplary embodiment of the present invention includes: a plate-shaped membrane 110; a post 130 disposed under an edge 115 of the membrane 110; a stopper 140 disposed under the membrane 110 and disposed more inwardly than the post 130 so as to form a space 143 between the stopper 140 and the post 130; and a cap 150 disposed under the post 130 so as to cover the post 130, whereby the influence of disturbance or noise occurring from external environments or interference from surrounding sensors can be interrupted by using a predetermined region 145 of the membrane 110 disposed above the space 143.

Abstract: Disclosed herein is a method of manufacturing an inertial sensor. The method of manufacturing an inertial sensor 100 includes (A) applying a polymer 120 to a base substrate 110, (B) patterning the polymer 120 so as to form an opening part 125 in the polymer 120, (C) completing a cap 130 by forming a cavity 115 on the base substrate 110 exposed fro the opening part 125 through an etching process in a thickness direction, and (D) bonding the cap 130 to a device substrate 140 by using a polymer 120, whereby the polymer 120 is applied to the base substrate 110 in a constant thickness D3, such that the cap 130 may be easily bonded to the device substrate 140 by using the polymer 120.

Abstract: Disclosed herein is an inertial sensor including: a membrane; a mass body provided under the membrane; a plurality of patterned magnets provided under the mass body; and a magnetoresistive element provided to be spaced apart from the mass body and measuring static DC acceleration acting on the mass body through resistance changed according to magnetic fields of the plurality of patterned magnets. The plurality of patterned magnets and the magnetoresistive element are included, thereby making it possible to measure static DC acceleration (particularly, gravity acceleration) that is difficult to measure using an existing to piezoelectric element.

Abstract: Disclosed herein is an inertial sensor. The inertial sensor includes a sensor part including a driving mass, a flexible substrate part displaceably supporting the driving mass, and a support part supporting the flexible substrate part so that the driving mass is freely movable in a state in which the driving mass is floated; a lower cap covering a lower portion of the driving mass and coupled with the support part and provided with a stopper part limiting a displacement of the driving mass; and a dry film resist coupling the sensor part with the cover and providing an interval between the driving mass and the stopper.