Abstract: An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost. An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.

Abstract: A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Abstract: This invention relates to a composition for plug in a base-isolated structure capable of providing a plug for base-isolated structure having sufficient damping performance, displacement following property and the like, and more particularly to a composition for plug in a base-isolated structure characterized by including powder and an elastomer composition formed by compounding an elastomer component with a reinforcing filler.

Abstract: A method for processing audio signals can include receiving left and right front audio signals and left and right rear audio signals, where the left and right rear audio signals. In addition, the method can include applying at least one front perspective filter to each of the left and right front audio signals to yield filtered left and right front output signals, where the left and right front output signals each drive a front speaker. Moreover, the method can include applying at least one rear perspective filter to each of the left and right rear audio signals to yield left and right rear output signals, where the left and right rear output signals each drive a rear speaker to simulate a rear surround sound effect when positioned in front of a listener.

Abstract: A light emitting apparatus includes a belt-like substrate, a light emitting element mounted on the substrate, and a luminous flux control member mounted on the substrate. The substrate has a pair of fracture surfaces formed at predetermined intervals along a lengthwise direction and formed at both ends in a widthwise direction between luminous flux control members neighboring each other along the lengthwise direction, wherein dimensions W1 and W2 in the widthwise direction between the pair of fracture surfaces are less than a dimension in the widthwise direction of the luminous flux control member, and the dimension W2 in the widthwise direction of a part overlapping the luminous flux control member in a plan view is less than the dimension W1 in the widthwise direction between the pair of fracture surfaces.

Abstract: A light-emitting device includes a substrate having a metal film on a first surface, a light-emitting element mounted on the first surface of the substrate and connected to the metal film, a heat sensitive circuit breaker mounted on the first surface of the substrate and connected to the metal film, a light-proof cover that covers the heat sensitive circuit breaker to block light emitted from the light-emitting element and travelling toward the heat sensitive circuit breaker, and a heat dissipating member formed on a second surface of the substrate to dissipate heat of the substrate, the second surface being opposite to the first surface.

Abstract: A solid-state image pickup device including a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.

Abstract: A method for processing audio signals can include applying at least one front perspective filter to each of left and right front audio signals to yield filtered left and right front output signals, where the left and right front output signals each drive a front speaker. Moreover, the method can include applying at least one rear perspective filter to each of left and right rear audio signals to yield left and right rear output signals, where the left and right rear output signals each drive a rear speaker to simulate a rear surround sound effect when positioned in front of a listener.

Abstract: A sheet peeling apparatus 10 includes: a sticking means 14 for sticking a peeling tape PT by pressing the peeling tape PT onto an adhesive sheet S; a moving means 15 for moving the peeling tape PT stuck to the adhesive sheet S and a holding means 11 for holding a wafer W relative to each other to peel the adhesive sheet S; a detecting means 17 for detecting the position of the outer periphery of the adhesive sheet S, and outputting a signal thereof; an input means 18 for inputting a correction value; a controlling means 19 for determining a pressing position of the peeling tape PT to the adhesive sheet S based on the output signal from the detecting means 17 and the correction value, and controlling the moving means 15 so as to stick the adhesive sheet S at the pressing position.

Abstract: A recording apparatus includes: a recording head which conducts recording onto a printing medium; a supporter which supports the recording head at a recording position; and a vibration damper interposed between the recording head and the supporter. The recording head includes a recording surface facing a printing medium and a gradient inclined relative to the recording surface. The gradient is provided at an end of the recording surface. The vibration damper abuts: at least one of the recording surface and a surface parallel to the recording surface of the recording head; and the gradient.

Abstract: An engine exhaust purification device comprises: a selective reduction type NOx catalyst; an oxidation catalyst disposed on an upstream side of the NOx catalyst; a reducing agent adding device which adds an NOx reducing agent to an exhaust gas of an engine; a control device which controls the reducing agent adding device; and an NO2 ratio calculation device which estimates an NO2 ratio of the exhaust gas flowing into the NOx catalyst. The NO2 ratio of the exhaust gas flowing into the NOx catalyst is calculated by a catalytic reaction model where the oxidation reaction of NO in the oxidation catalyst is numerically formulated, and the NO2 ratio is reflected to calculate an amount of ammonia adsorbed on the NOx catalyst by a catalytic reaction model where a chemical reaction concerned with the reduction of NOx in the NOx catalyst is numerically formulated.

Abstract: To include a first inverter that receives an input signal to output an inverted signal, a second inverter that receives the inverted signal to output a first internal signal, and a third inverter that receives the input signal and outputs a second internal signal by using the inverted signal as a power supply. According to the present invention, because a signal on one signal path is used as a power supply of an inverter included in the other signal path, phases of a pair of output signals based on the input signal can be exactly matched without adding a capacitor or a resistor for adjustment.

Abstract: A light emitting apparatus emits light emitted from a light emitting element (200) mounted on a substrate (300) via a luminous flux control member (100). The luminous flux control member (100) has a bottom surface section (101) opposite to the substrate (300), an input surface section (106) for causing the light emitted from a light emitting element (200) to enter inside the input surface section (106), a light control output surface section (102) for refracting the light having entered from the input surface section (106) and outputting the light outside, and two or more leg sections (103) are formed to project outward from the bottom surface section (101) inside a circle with a circumference on which a position where the amount of light reflected by the light control output surface section (102) and yet reaching the bottom surface section (101) peaks is located, and attached to the substrate (300).

Abstract: A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.

Abstract: An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost. An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.

Abstract: A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

Abstract: A light emitting apparatus capable of increasing the number of substrates formed from one multi-surface pattern substrate and capable of reducing the manufacturing cost. The light emitting apparatus (100) includes a belt-like substrate (101), a light emitting element (102) mounted on the substrate (101), and a luminous flux control member (103) mounted on the substrate (101).

Abstract: A light emitting apparatus emits light emitted from a light emitting element (200) mounted on a substrate (300) via a luminous flux control member (100). The luminous flux control member (100) has a bottom surface section (101) opposite to the substrate (300), an input surface section (106) for causing the light emitted from a light emitting element (200) to enter inside the input surface section (106), a light control output surface section (102) for refracting the light having entered from the input surface section (106) and outputting the light outside, and two or more leg sections (103) are formed to project outward from the bottom surface section (101) inside a circle with a circumference on which a position where the amount of light reflected by the light control output surface section (102) and yet reaching the bottom surface section (101) peaks is located, and attached to the substrate (300).

Abstract: To include a first inverter that receives an input signal to output an inverted signal, a second inverter that receives the inverted signal to output a first internal signal, and a third inverter that receives the input signal and outputs a second internal signal by using the inverted signal as a power supply. According to the present invention, because a signal on one signal path is used as a power supply of an inverter included in the other signal path, phases of a pair of output signals based on the input signal can be exactly matched without adding a capacitor or a resistor for adjustment.

Abstract: A solid-state image pickup device includes a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.