Abstract: A blank oscillator 300? is prepared for each office, and control data is written into this blank oscillator 300?, thereby manufacturing an oscillator 300. Upon receiving an order from a user terminal 10, a business center server 100 selects the most suitable office for the delivery of the oscillator and sends the data to the office. A data writing apparatus 200 installed in this office generates control data based on the data, and writes the control data into the blank oscillator 300?, thereby manufacturing the oscillator 300.

Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.

Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.

Abstract: In an LED lamp, a Zener diode is mounted on a copper plate, and a GaN-based light-emitting element is mounted on the Zener diode with an electrode of the element being oriented facedown. Two Zener diodes close to the center of the LED lamp are mounted on a common copper plate, thereby interconnecting the two light-emitting elements in series. Consequently, a Zener diode is connected to the respective two Zener diodes by means of a wire serving as a conductive member. Four light-emitting elements are connected in series, so that four light-emitting elements are connected in series, thus completing a circuit configuration. In this way, use of the Zener diodes for interconnection purpose enables a reduction in the number of minimum required wires. It is better to connect the wire to the upper surfaces of the Zener diodes, thereby obviating a necessity for a redundant wire space and enabling miniaturization of the LED lamp.

Abstract: Separate leads and a common lead are provided on the upper and lower surfaces of a substrate. A plurality of LED elements are disposed in an array on the common lead on the upper surface of the substrate. The common lead provided on the upper surface of the substrate is connected to the common lead provided on the lower surface of the substrate through through-hole plating. Heat generated from the plurality of LED elements is transferred through the common lead provided on the upper surface of the substrate and the through-hole plating to the common lead provided on the lower surface of the substrate and is release therefrom into the air. By virtue of this construction, an light emitting device can be realized in which heat radiating properties are homogenized, heat radiation efficiency is improved, and a compact structure is obtained and, thus, the color balance is improved and unfavorable phenomena such as lowering in the output of light emitting elements and shortening of the service life are avoided.

Abstract: A light emitting device has a light emitting element portion that radiates light with a predetermined wavelength, and a wavelength conversion portion that surrounds a phosphor to be excited by the light with the predetermined wavelength with a transparent and non-moisture permeability material in the form of laminae. Further, a light emitting device has a plurality of LED elements disposed on a same plane, and a wavelength conversion portion that comprises a flat transparent base member that is disposed opposite to the plurality of LED elements and a phosphor layer that is of a phosphor to be excited by light emitted from the LED element and is formed like a film on the base member. The phosphor layer includes part with no phosphor in plane.

Abstract: A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.

Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.

Abstract: A light emitting apparatus has: a semiconductor light emitting element that emits light with a predetermined wavelength; a light-transmitting portion that has a recess to house the semiconductor light emitting element, the light-transmitting portion being of a light-transmitting material and the recess being formed by molding the light-transmitting material; and a phosphor layer portion that is thinly formed along the surface of the recess, the phosphor portion having a phosphor to be excited by irradiating light emitted from the semiconductor light emitting element.

Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light emitting element. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.

Abstract: Irregularities are formed on at least a side surface of a light emitting layer of a light emitting element. In one form of the invention, an n-type layer which is a Group-III nitride compound semiconductor or the like, a light emitting layer, and a p-type layer are successively formed on a sapphire substrate through MOVPE or the like. Then, dry etching is carried out to expose the n-type layer to form a pedestal electrode. In this etching process, an etching pattern is employed to form a wave shape on the periphery of the p-type layer.

Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.

Abstract: A light emitting device has a light emitting element, and a phosphor layer of phosphor glass to generate fluorescence while being excited by light emitted from the light emitting element. The light emitting element emits ultraviolet light, and the phosphor glass generates visible fluorescence while being excited by the ultraviolet light.

Abstract: An LED package has a light emitting element, a first optical section that is disposed around the light emitting element, and a second optical section that is disposed around the first optical while being separated from the first optical section. A gap is formed between the first and second optical sections. The gap allows part of light emitted from the light emitting element to be radiated from the first optical section as nearly parallel light converged in the direction vertical to the center axis of the light emitting element. The second optical section includes a reflection surface to reflect the nearly parallel light in the direction parallel to the center axis of the light emitting element.

Abstract: There is provided an error rate select circuit activated in an information sustaining mode, wherein a plurality of pieces of data is read out from a memory circuit comprising dynamic memory cells and inspection bits for detection and correction of an error existing in the pieces of data are generated. The inspection bits are stored in an additional memory circuit. An ECC circuit reads out the pieces of data from the memory circuit and the inspection bits associated with the pieces of data from the additional memory circuit to detect and correct an error existing in the pieces of data at fixed refresh intervals. If no error is detected, a first detection signal is accumulated in a first direction, that is, the first detection signal is added to a sum.

Abstract: A method for controlling power for a semiconductor storage device and the semiconductor storage device are provided which enable power consumption to be greatly reduced in a standby state. The power control method uses an ultra-low power consumption mode in which power control can be exerted in the standby state. In the ultra-low power consumption mode, a burst self-refresh state, power-OFF state, and power-ON state are provided. In the burst self-refresh state, memory cells are refreshed in a centralized manner. In the power-OFF state, an internal power source circuit can be partially turned OFF. In the power-ON state, internal power sources having been partially turned OFF are turned ON. Therefore, it is possible to greatly reduce power consumption in the standby state.

Abstract: A light emitting diode has: a ceramics substrate that has a high thermal conductivity; a light emitting element that is mounted on the ceramics substrate; and a radiation plate that is bonded to the back surface of the ceramics substrate. The radiation plate contacts the ceramics substrate at a contact region that includes a region of the back surface of the ceramics substrate corresponding to a region of the ceramics substrate on which the light emitting element is mounted.

Abstract: A light source in a backlight portion is composed of red LEDs, green LEDs, and blue LEDs. The numbers of respective kinds of LEDs used are selected so that the number of blue LEDs is not smaller than the number of red LEDs and the number of blue LEDs is not smaller than the number of green LEDs.

Abstract: A controlling device of a compressor is provided. A noise filter is arranged at an input of the inverter circuit that converts the commercial frequency to a driving frequency to control a motor driving a compressor mechanism, for suppressing a common mode noise of the commercial power source and the inverter circuit, and is connected to a ground through a metal frame used for receiving a compressor main body. The noise filter comprises coils connected between first capacitors and second capacitors that are connected in series between the AC power lines, and further comprises a clamper connected between nodes of the second capacitors and the metal frame for clamping a voltage and a third capacitor connected to the clamper in parallel. even though the new refrigerant, such as R410A, and the three-phase AC power source are used, the leakage current can be reduced by a simple structure and the increase of the noise terminal voltage can be also suppressed.

Abstract: After measurement, light-emitting elements are temporarily numbered (1), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (1), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (1), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.