Patents by Inventor Hideaki Kato
Hideaki Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7285803Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.Type: GrantFiled: August 5, 2004Date of Patent: October 23, 2007Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Hideaki Kato, Kanae Matsumura, Shunsuke Ohtsuka
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Patent number: 7279723Abstract: An LED lamp has a package and a plurality of light emitting elements that are electrically connected to a plurality of electrode plates provided in the package and that are sealed with transparent material. A red light emitting element of the plurality of light emitting elements is wire bonded along the longitudinal direction of the package, a green light emitting element and a blue light emitting element are flip-chip bonded with its electrode faced down, and the electrodes are extended to a surface opposite to the light emission surface of the LED lamp while being embedded in the package.Type: GrantFiled: March 19, 2004Date of Patent: October 9, 2007Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Kanae Matsumura, Hideaki Kato, Kiyotaka Teshima, Shunsuke Ohtsuka
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Publication number: 20070194709Abstract: A light emitting device has a light emitting element and an adhesion layer to bond the light emitting element to a mounting member. The adhesion layer is of inorganic material particles and a transparent inorganic binding layer to be formed between the neighboring inorganic material particles, and the inorganic material particles are substantially connected with each other in the adhesion layer. Another light emitting device has a light emitting element and a phosphor layer that radiates fluorescent light while being excited by light emitted from the light emitting element. The phosphor layer is of phosphor particles and transparent inorganic binding layer to be formed between the neighboring phosphor particles.Type: ApplicationFiled: January 9, 2004Publication date: August 23, 2007Applicants: Toyoda Gosei Co., Ltd., Tsuchiya Co., Ltd.Inventors: Hideaki Kato, Mitsuhiro Inoue, Hiroaki Hayashi, Kazuyoshi Tahashi
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Patent number: 7249289Abstract: An error rate select circuit activated in an information sustaining mode is provided, wherein a plurality of pieces of data are read from a dynamic memory circuit and inspection bits which are used to detect an error existing in the pieces of data are generated. If no error is detected, a first predetermined value is added to a total value. If an error is detected, a second predetermined value greater than the first predetermined value is subtracted from the total value. If the total value exceeds a first set value, a refresh period is lengthened by a predetermined time increment. If the total value becomes smaller than a second set value, the refresh period is shortened by the predetermined time increment.Type: GrantFiled: March 25, 2004Date of Patent: July 24, 2007Assignee: Elpida Memory, Inc.Inventors: Masaya Muranaka, Hideaki Kato, Yutaka Ito
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Publication number: 20070120463Abstract: A phosphor plate has a wavelength conversion plate member formed of a base material with a phosphor included therein. The phosphor is operable to radiate a wavelength-converted light by being excited by a light emitted from a light emitting element. The base material further has a converter of light travel direction.Type: ApplicationFiled: October 17, 2006Publication date: May 31, 2007Applicant: TOYODA GOSEI, CO., LTDInventors: Toshimasa Hayashi, Hideaki Kato, Hiroaki Kawaguchi, Takumi Narita
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Patent number: 7161187Abstract: A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.Type: GrantFiled: October 26, 2004Date of Patent: January 9, 2007Assignee: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Hideaki Kato, Kunihiro Hadame
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Publication number: 20060261364Abstract: A method for manufacturing a solid element device, which comprises providing a glass-containing Al2O3 substrate (3) having a GaN based LED element (2) placed thereon, setting a P2O5—ZnO based low melting point glass in parallel with the substrate, and carrying out a press working at a temperature of 415° C. or higher under a pressure of 60 kgf in a nitrogen atmosphere. Under these conditions, the low melting point glass has a viscosity of 109 poise, and is adhered via an oxide formed on the surface of the glass-containing Al2O3 substrate (3). A solid element device manufactured by the above method can be manufactured through a glass sealing working at a low temperature and also has a highly reliable sealing structure.Type: ApplicationFiled: March 10, 2004Publication date: November 23, 2006Inventors: Yoshinobu Suehiro, Mitsuhiro Inoue, Hideaki Kato, Kunihiro Hadame, Ryoichi Tohmon, Satoshi Wada, Koichi Ota, Kazuya Aida, Hiroki Watanabe, Yoshinori Yamamoto, Masaaki Ohtsuka, Naruhito Sawanobori
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Patent number: 7111964Abstract: An LED package has a light emitting element, a first optical section that is disposed around the light emitting element, and a second optical section that is disposed around the first optical while being separated from the first optical section. A gap is formed between the first and second optical sections. The gap allows part of light emitted from the light emitting element to be radiated from the first optical section as nearly parallel light converged in the direction perpendicular to the center axis of the light emitting element. The second optical section includes a reflection surface to reflect the nearly parallel light in the direction parallel to the center axis of the light emitting element.Type: GrantFiled: March 12, 2004Date of Patent: September 26, 2006Assignee: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Hideaki Kato, Mitsuhiro Inoue
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Patent number: 7071959Abstract: After measurement, light-emitting elements are temporarily numbered (1), . . . in measuring order and arranged successively on a temporary palette. In parallel with this operation, measured light intensity data are input to a computer system in association with the temporary numbers (1), . . . In the computer system, the measured light intensity data are rearranged according to predetermined algorithm to make the light intensity values of adjacent light-emitting elements substantially equal, so that the temporary numbers (1), . . . are rearranged on a memory in accordance with the rearranged data. The rearranged data are sent from the computer system to a robot, so that the light-emitting elements on the temporary palette are arranged on a taping.Type: GrantFiled: July 9, 2003Date of Patent: July 4, 2006Assignee: Toyoda Gosei Co., Ltd.Inventors: Hideaki Kato, Koichi Kaga, Kanae Matsumura
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Patent number: 7017027Abstract: An address-counter control system includes a counter circuit, path switches, and a control circuit. The counter circuit includes a first series of address counters which corresponds to a non-contiguous region portion and second and third series of address counters which correspond to respective contiguous region portions and which are located at two opposite ends of the first series of address counters. The path switches are provided at connection paths between the second and the third series of address counters. The path switches disconnect the first series of address counters and directly connect the second and third series of address counters or disconnect the direct connection between the second and third series of address counters and connect the first series of address counters to and between the second and the third series of address counters. The control circuit control the path switches.Type: GrantFiled: September 24, 2003Date of Patent: March 21, 2006Assignees: Elpida Memory, Inc., Hitachi ULSI Systems Co., Ltd., Hitachi, Ltd.Inventors: Tomoyuki Inaba, Kiyoshi Nakai, Hideaki Kato
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Patent number: 6998777Abstract: A light emitting diode has: a ceramics substrate that has a high thermal conductivity; a light emitting element that is mounted on the ceramics substrate; and a radiation plate that is bonded to the back surface of the ceramics substrate. The radiation plate contacts the ceramics substrate at a contact region that includes a region of the back surface of the ceramics substrate corresponding to a region of the ceramics substrate on which the light emitting element is mounted.Type: GrantFiled: December 10, 2003Date of Patent: February 14, 2006Assignee: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Mitsuhiro Inoue, Hideaki Kato, Tatsuya Takashima
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Patent number: 6953265Abstract: A light source device has a light shielding member having an aperture, a light source arranged on one side of the light shielding member, and a converging member arranged relatively with respect to the light source and the light source to thereby converge light emitted from the light source in the aperture or in a vicinity of the aperture. Another type of light source device has a single light source, and a converging member for converging light from the light source to thereby distribute the light to at least two points. Still another type of light source device has a light source, and a reflecting mirror arranged to enclose a side of a light emission direction of the light source, the reflecting mirror reflecting light emitted from the light source in a direction except the light source so that the light is radiated outside.Type: GrantFiled: April 25, 2003Date of Patent: October 11, 2005Assignee: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Yuji Takahashi, Takemasa Yasukawa, Hideaki Kato, Hideki Omoya, Hideyuki Nakano, Hisao Yamaguchi
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Patent number: 6946788Abstract: A light-emitting element has a light-emitting layer and at lease one light-extracting portion. At least a partial part of the light-extracting portion is formed into a concave or convex surface for enhancing the efficiency of extracting light. Another light-emitting element has a light-emitting layer and a concave or convex surface for reflecting light emitted from the light-emitting layer toward one or more other surfaces of the light-emitting element through an inside of the light-emitting element.Type: GrantFiled: May 29, 2002Date of Patent: September 20, 2005Assignee: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Masayoshi Koike, Hideaki Kato
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Publication number: 20050173708Abstract: A light emitting device has: a light emitting element; a conducting portion to supply power to the light emitting element; an element housing portion that houses the light emitting element therein; and a sealing material that seals the light emitting element housed in the element housing portion. The sealing material contains a transparent resin material and a transparent filler with a thermal expansion coefficient smaller than the transparent resin material, and the transparent filler has a refractive index nearly equal to the transparent resin material.Type: ApplicationFiled: February 4, 2005Publication date: August 11, 2005Applicant: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Hideaki Kato, Seiji Takano
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Publication number: 20050161771Abstract: A light emitting apparatus has a light emitting element, and a transparent glass section and a metal section that surround the light emitting element. The transparent glass section and the metal section have a ratio in thermal expansion coefficient to the light emitting element in a range of 150% to 500%.Type: ApplicationFiled: January 18, 2005Publication date: July 28, 2005Applicant: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Hideaki Kato, Kunihiro Hadame
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Publication number: 20050082561Abstract: A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.Type: ApplicationFiled: October 26, 2004Publication date: April 21, 2005Applicant: Toyoda Gosei Co., Ltd.Inventors: Yoshinobu Suehiro, Hideaki Kato, Kunihiro Hadame
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Patent number: 6876893Abstract: A blank oscillator 300? is prepared for each office, and control data is written into this blank oscillator 300?, thereby manufacturing an oscillator 300. Upon receiving an order from a user terminal 10, a business center server 100 selects the most suitable office for the delivery of the oscillator and sends the data to the office. A data writing apparatus 200 installed in this office generates control data based on the data, and writes the control data into the blank oscillator 300?, thereby manufacturing the oscillator 300.Type: GrantFiled: October 9, 2001Date of Patent: April 5, 2005Assignee: Seiko Epson CorporationInventors: Toshihiko Kano, Kenya Kodaira, Yoshio Morita, Hideaki Kato
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Patent number: 6872585Abstract: In an LED device, an opening portion of a package in which a plurality of five light-emitting elements are mounted is filled with a transparent epoxy resin and sealed with the resin. The transparent epoxy resin is shrunk when cured. Hence, the surface of the transparent epoxy resin is dented in the center portion so that the outer edge portion becomes higher than the center portion. The light-emitting elements located at opposite ends are the highest in element height among the five light-emitting elements. Hence, when the light-emitting elements are mounted at opposite ends of a single row, distances from light-emitting surfaces of the five light-emitting elements to the surface of the transparent epoxy resin are made uniform and luminous intensity distribution characteristics thereof are made uniform. Tips of leads are further bent up along side surfaces of the package.Type: GrantFiled: May 11, 2004Date of Patent: March 29, 2005Assignees: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Kanae Matsumura, Yuji Takahashi, Hideaki Kato, Shunsuke Ohtsuka
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Publication number: 20050030762Abstract: A notch portion 7A is disposed on a formation surface of a wiring pattern 7 and is located in a contact point with a wiring pattern 9 of an outside substrate 8, so that a solder 9a melted by reflow soldering slowly flows up along an edge of the notch portion 7A, improving a solder-joint performance. The notch portion 7A is formed in a recess shape as formed by cutting away the substrate 6 and as a result, the melted solder stays in the recess portion, which prevents the melted solder from moving up over the notch portion 7A.Type: ApplicationFiled: August 5, 2004Publication date: February 10, 2005Applicants: Toyoda Gosei Co., Ltd., Koha Co., Ltd.Inventors: Hideaki Kato, Kanae Matsumura, Shunsuke Ohtsuka
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Patent number: 6841931Abstract: In an LED lamp, a Zener diode is mounted on a copper plate, and a GaN-based light-emitting element is mounted on the Zener diode with an electrode of the element being oriented facedown. Two Zener diodes close to the center of the LED lamp are mounted on a common copper plate, thereby interconnecting the two light-emitting elements in series. Consequently, a Zener diode is connected to the respective two Zener diodes by means of a wire serving as a conductive member. Four light-emitting elements are connected in series, so that four light-emitting elements are connected in series, thus completing a circuit configuration. In this way, use of the Zener diodes for interconnection purpose enables a reduction in the number of minimum required wires. It is better to connect the wire to the upper surfaces of the Zener diodes, thereby obviating a necessity for a redundant wire space and enabling miniaturization of the LED lamp.Type: GrantFiled: April 11, 2002Date of Patent: January 11, 2005Assignees: Toyoda Gosei Co., Ltd., Matsushita Electric Industrial Co., Ltd.Inventors: Yuji Takahashi, Koichi Kaga, Hideaki Kato, Tadaaki Ikeda, Michio Miyawaki