Patents by Inventor Hidekazu Sato

Hidekazu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11462449
    Abstract: A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: October 4, 2022
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Hiroshi Sato, Yoshinori Murakami, Hidekazu Tanisawa, Shinji Sato, Fumiki Kato, Kazuhiro Mitamura, Yui Takahashi
  • Publication number: 20220305007
    Abstract: An object of the present invention is to provide a sustained-release injectable preparation which is in a medication administration form that can provide the effect of 7-[4-(4-benzo[b]thiophen-4-yl-piperazin-1-yl)butoxy]-1H-quinolin-2-one for a prolonged period of time, the preparation releasing a therapeutically effective amount of 7-[4-(4-benzo[b]thiophen-4-yl-piperazin-1-yl)butoxy]-1H-quinolin-2-one for at least one week. The present invention provides an injectable preparation containing 7-[4-(4-benzo[b]thiophen-4-yl-piperazin-1-yl)butoxy]-1H-quinolin-2-one or a salt thereof as an active ingredient, which releases the active ingredient in such a manner that its blood concentration is maintained for at least one week.
    Type: Application
    Filed: February 11, 2022
    Publication date: September 29, 2022
    Applicant: OTSUKA PHARMACEUTICAL CO., LTD.
    Inventors: Tetsuya SATO, Takuya MINOWA, Yusuke HOSHIKA, Hidekazu TOYOFUKU
  • Patent number: 11454756
    Abstract: A plastic optical fiber for a medical device lighting decreases the cost of a lens and simplify the design of a lighting apparatus, wherein the plastic optical fiber for a medical device includes a core composed of a (co)polymer containing methyl methacrylate as a main component and is characterized by including a cladding material composed of a copolymer having a fluorine weight composition ratio of 60 to 74%, and by having a theoretical numerical aperture, NA, of 0.48 to 0.65 and, thus, the plastic optical fiber has a high numerical aperture and also has excellent translucency and flexibility.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: September 27, 2022
    Assignee: Toray Industries, Inc.
    Inventors: Hideki Kojima, Hironobu Maeda, Shinji Sato, Hidekazu Kunieda, Satoshi Matsuba
  • Patent number: 11450378
    Abstract: Apparatuses including threshold voltage compensated sense amplifiers and methods for compensating same are disclosed. An example threshold voltage compensated sense amplifier according to the disclosure includes circuits, such as a first transistor having a first conductivity type coupled to a first node and a second node; a second transistor having a second conductivity type coupled to the first node and at third node; a plurality of transistors coupled to the second node and further configured to receive a power supply voltage; and a control circuit configured to provide a plurality of control signals to the plurality of transistors. The control circuit provides the plurality of control signals indicative of a first drive strength in a first memory operation and further provides the plurality of signals indicative of a second drive strength in a second memory operation.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: September 20, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Toshiyuki Sato, Hidekazu Noguchi
  • Publication number: 20220293555
    Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 15, 2022
    Inventors: Isao ICHIKAWA, Hidekazu NAKAYAMA, Yosuke SATO
  • Publication number: 20220293554
    Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.
    Type: Application
    Filed: August 20, 2020
    Publication date: September 15, 2022
    Inventors: Isao ICHIKAWA, Hidekazu NAKAYAMA, Yosuke SATO
  • Publication number: 20220277879
    Abstract: In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.
    Type: Application
    Filed: February 7, 2022
    Publication date: September 1, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Hidekazu SATO, Kazuhiro EBINA, Kunihiko KAWASAKI, Takahiro SATO, Kouichi KAKUDA, Yuya ISHIMA, Shinichi KONDO, Shinichi SATO, Masaki TAKAHASHI
  • Publication number: 20220273053
    Abstract: A garment has excellent contact cold sensation and gives persistent contact cold sensation but also can reduce heatful feeling and is suitably wearable in wearing scenes such as offices and homes. The garment includes one or plural fans for taking external air into a space between the garment and the body. A fabric of the garment has a contact cold/warm sensation value Q-max of 0.30 W/cm2 or larger and a basis weight of 250 g/m2 or less.
    Type: Application
    Filed: July 3, 2020
    Publication date: September 1, 2022
    Inventors: Kirita Sato, Hiroo Katsuta, Hidekazu Kano
  • Publication number: 20220262558
    Abstract: A laminated coil component capable of improving winding efficiency and characteristics and realizing a simple configuration and an improved withstand voltage is provided. A laminated coil component includes a coil portion formed inside an insulating element body forming a laminated structure and in a first conductor pattern layer and a second conductor pattern layer constituting the coil portion, positions of a pair of end portions of an outer conductor line and a pair of end portions of an inner conductor line facing each other with a division region interposed therebetween are displaced in a line direction of the coil portion passing through the division region.
    Type: Application
    Filed: January 6, 2022
    Publication date: August 18, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Hidekazu SATO, Kunihiko KAWASAKI
  • Patent number: 11411372
    Abstract: A method of manufacturing a light emitting element includes, at least: (A) forming a stacked structure 20 which includes a GaN-based compound semiconductor and in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are stacked, and forming a concave mirror section 43 on a first surface side of the first compound semiconductor layer 21; then (B) forming a photosensitive material layer 35 over the second compound semiconductor layer 22; and thereafter (C) exposing the photosensitive material layer 35 to light from the concave mirror section side through the stacked structure 20, to obtain a treatment mask layer including the photosensitive material layer 35, and then processing the second compound semiconductor layer 22 by use of the treatment mask layer.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: August 9, 2022
    Assignee: Sony Corporation
    Inventors: Tatsushi Hamaguchi, Jugo Mitomo, Susumu Sato, Hiroshi Nakajima, Masamichi Ito, Hidekazu Kawanishi
  • Publication number: 20220225694
    Abstract: A fan unit for an air-conditioned garment, wherein the fan unit takes external air into an interspace between the garment and a wearer's body, the fan unit including: a fan that blows external air into the interior of the garment; a motor that rotates the fan; a battery that supplies power to the motor; a charging terminal for charging the battery; and a power switch to start and stop the fan unit, wherein the fan, the motor and the battery are housed in a casing, the casing has an air intake port that takes in external air, and an air blowing port that blows the taken-in external air into the interior of the garment, the charging terminal and the power switch are provided on the exterior of the casing, and the casing has a thickness of 5 to 30 mm in an axial direction of the fan.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 21, 2022
    Inventors: Hiroo Katsuta, Kirita Sato, Hidekazu Kano, Hidetoshi Suzuki, Kazuya Fujita
  • Patent number: 11374384
    Abstract: A light-emitting device according to an embodiment of the present disclosure includes a laminate. The laminate includes an active layer, and a first semiconductor layer and a second semiconductor layer sandwiching the active layer. This light-emitting device further includes a current constriction layer having an opening and a vertical resonator including a first reflecting mirror having a concave-curved shape on the first semiconductor layer side and a second reflecting mirror on the second semiconductor side. The first reflecting mirror and the second reflecting mirror sandwich the laminate and the opening. This light-emitting device further includes an optically transparent substrate between the first reflecting mirror and the laminate. The optically transparent substrate has a first convex portion having a convex-curved shape and one or more second convex portions on a surface on the side opposite to the laminate. The first convex portion is in contact with the first reflecting mirror.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: June 28, 2022
    Assignee: Sony Corporation
    Inventors: Susumu Sato, Tatsushi Hamaguchi, Jugo Mitomo, Hiroshi Nakajima, Masamichi Ito, Hidekazu Kawanishi
  • Patent number: 11302466
    Abstract: A multilayer coil electronic component having improved inductance L, Q, and strength, and which has an element in which a coil conductor and a magnetic element body are stacked. The magnetic element body includes soft magnetic metal particles and a resin. The resin fills a space between the soft magnetic metal particles. Each of soft magnetic metal particles has a soft magnetic metal particle core and an oxide film covering the soft magnetic metal particle core. A layer of the oxide film contacting the soft magnetic metal particle core is made of an oxide including Si.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 12, 2022
    Assignee: TDK CORPORATION
    Inventors: Takashi Suzuki, Hidekazu Sato, Yusuke Nagai, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi, Takashi Endo
  • Publication number: 20220068565
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Application
    Filed: November 8, 2021
    Publication date: March 3, 2022
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Masashi SHIMOYASU, Makoto YOSHINO, Takuo ABE, Akihiko OIDE, Tsutomu ONO, Shinichi SATO, Makoto MORITA, Shinichi SATO, Hidekazu SATO
  • Patent number: 11227721
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: January 18, 2022
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato, Masashi Kitazaki, Naoki Uchida, Masahiro Kato
  • Patent number: 11211188
    Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: December 28, 2021
    Assignee: TDK CORPORATION
    Inventors: Yusuke Nagai, Takashi Suzuki, Hidekazu Sato, Takashi Endo, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi
  • Patent number: 11168022
    Abstract: A glass ceramics sintered body includes a glass phase and a ceramics phase dispersed in the glass phase. The ceramics phase includes alumina grains and zirconia grains. The glass phase includes an MO—Al2O3—SiO2—B2O3 based glass, where M is an alkaline earth metal. An area ratio of the alumina grains is 13 to 30%, and an area ratio of the zirconia grains is 0.05 to 6%, on a cross section of the sintered body.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Shusaku Umemoto, Takashi Suzuki, Hidekazu Sato, Masaki Takahashi, Shinichi Kondo
  • Patent number: 11011294
    Abstract: A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: May 18, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato
  • Patent number: 10984939
    Abstract: A multilayer coil component includes an element body, a coil including a plurality of internal conductors, and a plurality of stress-relaxation spaces. The plurality of internal conductors are separated from each other in a first direction in the element body. Each stress-relaxation space is in contact with a surface of the corresponding internal conductor and powders exist in each stress-relaxation space. The element body includes element body regions located between the internal conductors adjacent to each other in the first direction. Each stress-relaxation space includes a first boundary surface with each internal conductor and a second boundary surface with each element body region. The first boundary surface and the second boundary surface oppose each other in the first direction. A distance between the first boundary surface and the second boundary surface is smaller than a thickness of each element body region in the first direction.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: April 20, 2021
    Assignee: TDK CORPORATION
    Inventors: Takashi Endo, Kenji Komorita, Kunihiko Kawasaki, Hidekazu Sato, Takashi Suzuki
  • Patent number: 10808959
    Abstract: An air conditioning system includes: an air conditioner configured to supply air-conditioning air; and an air conditioner control device configured to control the air conditioner. The air conditioner includes: an outside air passage, through which outside air flows; a return air passage, through which return air flows; an outside air heat exchanger; a return air heat exchanger; an outside air vaporizing humidifier configured to humidity the outside air by utilizing evaporation of water; and a return air vaporizing humidifier configured to humidify the return air by utilizing evaporation of water. The air conditioner control device includes a first vaporizing cooler configured to operate at least one of the humidifiers to perform vaporization cooling of the air-conditioning air while preventing the air-conditioning air from exchanging heat with a heat exchange medium.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 20, 2020
    Assignee: KIMURA KOHKI CO., LTD.
    Inventors: Keiichi Kimura, Mitsuo Morita, Takayuki Ishida, Kazuya Goto, Hidekazu Sato