Patents by Inventor Hidekazu Sato

Hidekazu Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894195
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: February 6, 2024
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato
  • Publication number: 20230420172
    Abstract: A multilayer coil component includes an element body having a multilayer structure including a first element body portion formed of a ferrite element body material, and a second element body portion laminated on the first element body portion and formed of a ferrite element body material having a composition different from the ferrite element body material forming the first element body portion, a multilayer coil having an axis parallel to a lamination direction of the element body, and a stress alleviation portion provided in an inner region of the multilayer coil when viewed from the lamination direction. In the multilayer coil component, the stress alleviation portion is provided in the inner region of the multilayer coil in which a stress tends to be concentrated to alleviate the stress in the inner region of the multilayer coil, and thereby occurrence of cracking in the element body can be suppressed.
    Type: Application
    Filed: September 13, 2023
    Publication date: December 28, 2023
    Applicant: TDK CORPORATION
    Inventors: Hidekazu SATO, Takahiro SATO, Hitoshi KUDO, Takashi ENDO, Yusuke NAGAI, Tatsuro SUZUKI, Hiroko KORIKAWA, Kenji KOMORITA
  • Patent number: 11830664
    Abstract: A multilayer coil component 1 includes an element body 2, a coil 8, and a terminal electrode 4 and a terminal electrode 5. Each of the terminal electrode 4 and the terminal electrode 5 is disposed over at least the end surfaces 2a and 2b and a main surface 2d. Each of the terminal electrode 4 and the terminal electrode 5 and at least a part of the coil 8 overlap when viewed from the facing direction of the pair of side surfaces 2e and 2f. Each of the terminal electrode 4 and the terminal electrode 5 and the coil 8 do not overlap when viewed from the facing direction of the pair of end surfaces 2a and 2b.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: November 28, 2023
    Assignee: TDK CORPORATION
    Inventors: Hajime Kato, Hidekazu Sato, Makoto Yoshino, Kazuya Tobita, Yuto Shiga, Youichi Kazuta, Noriaki Hamachi
  • Patent number: 11810704
    Abstract: A multilayer coil component includes an element body having a multilayer structure including a first element body portion formed of a ferrite element body material, and a second element body portion laminated on the first element body portion and formed of a ferrite element body material having a composition different from the ferrite element body material forming the first element body portion, a multilayer coil having an axis parallel to a lamination direction of the element body, and a stress alleviation portion provided in an inner region of the multilayer coil when viewed from the lamination direction. In the multilayer coil component, the stress alleviation portion is provided in the inner region of the multilayer coil in which a stress tends to be concentrated to alleviate the stress in the inner region of the multilayer coil, and thereby occurrence of cracking in the element body can be suppressed.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: November 7, 2023
    Assignee: TDK CORPORATION
    Inventors: Hidekazu Sato, Takahiro Sato, Hitoshi Kudo, Takashi Endo, Yusuke Nagai, Tatsuro Suzuki, Hiroko Korikawa, Kenji Komorita
  • Patent number: 11631521
    Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: April 18, 2023
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Takuo Abe, Yuma Ishikawa, Hidekazu Sato, Takashi Endo, Masashi Shimoyasu, Kazuma Takahashi
  • Publication number: 20230005656
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 5, 2023
    Applicant: TDK CORPORATION
    Inventors: Shinichi SATO, Yohei TADAKI, Akihiko OIDE, Yuma ISHIKAWA, Hidekazu SATO, Kazuhiro EBINA, Hiroyuki TANOUE
  • Patent number: 11482371
    Abstract: An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 25, 2022
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato, Kazuhiro Ebina, Hiroyuki Tanoue
  • Publication number: 20220277879
    Abstract: In a multilayer coil component, first and second conductor patterns respectively have parallel parts that overlap in a lamination direction and non-parallel parts that do not overlap. The parallel parts of the first and second conductor patterns of one set are interconnected by a first through hole. The non-parallel parts of the first and second conductor patterns of sets adjacent to each other in the lamination direction are interconnected by a second through hole.
    Type: Application
    Filed: February 7, 2022
    Publication date: September 1, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Hidekazu SATO, Kazuhiro EBINA, Kunihiko KAWASAKI, Takahiro SATO, Kouichi KAKUDA, Yuya ISHIMA, Shinichi KONDO, Shinichi SATO, Masaki TAKAHASHI
  • Publication number: 20220262558
    Abstract: A laminated coil component capable of improving winding efficiency and characteristics and realizing a simple configuration and an improved withstand voltage is provided. A laminated coil component includes a coil portion formed inside an insulating element body forming a laminated structure and in a first conductor pattern layer and a second conductor pattern layer constituting the coil portion, positions of a pair of end portions of an outer conductor line and a pair of end portions of an inner conductor line facing each other with a division region interposed therebetween are displaced in a line direction of the coil portion passing through the division region.
    Type: Application
    Filed: January 6, 2022
    Publication date: August 18, 2022
    Applicant: TDK CORPORATION
    Inventors: Yusuke NAGAI, Hidekazu SATO, Kunihiko KAWASAKI
  • Patent number: 11302466
    Abstract: A multilayer coil electronic component having improved inductance L, Q, and strength, and which has an element in which a coil conductor and a magnetic element body are stacked. The magnetic element body includes soft magnetic metal particles and a resin. The resin fills a space between the soft magnetic metal particles. Each of soft magnetic metal particles has a soft magnetic metal particle core and an oxide film covering the soft magnetic metal particle core. A layer of the oxide film contacting the soft magnetic metal particle core is made of an oxide including Si.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: April 12, 2022
    Assignee: TDK CORPORATION
    Inventors: Takashi Suzuki, Hidekazu Sato, Yusuke Nagai, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi, Takashi Endo
  • Publication number: 20220068565
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Application
    Filed: November 8, 2021
    Publication date: March 3, 2022
    Applicant: TDK CORPORATION
    Inventors: Yoji TOZAWA, Masashi SHIMOYASU, Makoto YOSHINO, Takuo ABE, Akihiko OIDE, Tsutomu ONO, Shinichi SATO, Makoto MORITA, Shinichi SATO, Hidekazu SATO
  • Patent number: 11227721
    Abstract: An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: January 18, 2022
    Assignee: TDK CORPORATION
    Inventors: Yoji Tozawa, Masashi Shimoyasu, Makoto Yoshino, Takuo Abe, Akihiko Oide, Tsutomu Ono, Shinichi Sato, Makoto Morita, Shinichi Sato, Hidekazu Sato, Masashi Kitazaki, Naoki Uchida, Masahiro Kato
  • Patent number: 11211188
    Abstract: In a stepwise structure formed in a multilayer coil component, a difference occurs in a shrinkage amount between a maximum film thickness portion in which the number of layers is large and a minimum film thickness portion in which the number of layers is small due to portions different in the number of layers of coil parts (that is, upper coil part, lower coil part, and connecting part) adjacent to each other like the maximum film thickness portion and the minimum film thickness portion, readily causing a crack by an inner stress due to the difference in the shrinkage amount. In a multilayer coil component according to the present disclosure, a stress relaxation part overlapping with a maximum film thickness portion whose shrinkage amount is large is provided to relax inner stress in a stepwise structure, resulting in prevention of a crack.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: December 28, 2021
    Assignee: TDK CORPORATION
    Inventors: Yusuke Nagai, Takashi Suzuki, Hidekazu Sato, Takashi Endo, Kouichi Kakuda, Kunihiko Kawasaki, Shinichi Kondo, Yuya Ishima, Shinichi Sato, Masaki Takahashi
  • Patent number: 11168022
    Abstract: A glass ceramics sintered body includes a glass phase and a ceramics phase dispersed in the glass phase. The ceramics phase includes alumina grains and zirconia grains. The glass phase includes an MO—Al2O3—SiO2—B2O3 based glass, where M is an alkaline earth metal. An area ratio of the alumina grains is 13 to 30%, and an area ratio of the zirconia grains is 0.05 to 6%, on a cross section of the sintered body.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: November 9, 2021
    Assignee: TDK CORPORATION
    Inventors: Shusaku Umemoto, Takashi Suzuki, Hidekazu Sato, Masaki Takahashi, Shinichi Kondo
  • Patent number: 11011294
    Abstract: A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: May 18, 2021
    Assignee: TDK CORPORATION
    Inventors: Shinichi Sato, Yohei Tadaki, Akihiko Oide, Yuma Ishikawa, Hidekazu Sato
  • Patent number: 10984939
    Abstract: A multilayer coil component includes an element body, a coil including a plurality of internal conductors, and a plurality of stress-relaxation spaces. The plurality of internal conductors are separated from each other in a first direction in the element body. Each stress-relaxation space is in contact with a surface of the corresponding internal conductor and powders exist in each stress-relaxation space. The element body includes element body regions located between the internal conductors adjacent to each other in the first direction. Each stress-relaxation space includes a first boundary surface with each internal conductor and a second boundary surface with each element body region. The first boundary surface and the second boundary surface oppose each other in the first direction. A distance between the first boundary surface and the second boundary surface is smaller than a thickness of each element body region in the first direction.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: April 20, 2021
    Assignee: TDK CORPORATION
    Inventors: Takashi Endo, Kenji Komorita, Kunihiko Kawasaki, Hidekazu Sato, Takashi Suzuki
  • Patent number: 10808959
    Abstract: An air conditioning system includes: an air conditioner configured to supply air-conditioning air; and an air conditioner control device configured to control the air conditioner. The air conditioner includes: an outside air passage, through which outside air flows; a return air passage, through which return air flows; an outside air heat exchanger; a return air heat exchanger; an outside air vaporizing humidifier configured to humidity the outside air by utilizing evaporation of water; and a return air vaporizing humidifier configured to humidify the return air by utilizing evaporation of water. The air conditioner control device includes a first vaporizing cooler configured to operate at least one of the humidifiers to perform vaporization cooling of the air-conditioning air while preventing the air-conditioning air from exchanging heat with a heat exchange medium.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 20, 2020
    Assignee: KIMURA KOHKI CO., LTD.
    Inventors: Keiichi Kimura, Mitsuo Morita, Takayuki Ishida, Kazuya Goto, Hidekazu Sato
  • Patent number: 10781132
    Abstract: Provided is a glass ceramics sintered body including a glass phase and a ceramics phase dispersed in the glass phase, in which the ceramics phase includes alumina grains and zirconia grains, the glass phase includes an MO—Al2O3—SiO2—B2O3 based glass, in which “M” is an alkaline earth metal, and an area ratio of the alumina grains is 0.05 to 12% and the area ratio of the zirconia grains is 0.05 to 6% on the cross section of the sintered body. According to the invention, a glass ceramics sintered body, capable of a low temperature sintering having a low dielectric constant and a sufficient strength, and a coil electronic component using thereof can be provided.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: September 22, 2020
    Assignee: TDK CORPORATION
    Inventors: Shusaku Umemoto, Takashi Suzuki, Hidekazu Sato, Masaki Takahashi, Shinichi Kondo
  • Publication number: 20200234873
    Abstract: A multilayer coil component 1 includes an element body 2, a coil 8, and a terminal electrode 4 and a terminal electrode 5. Each of the terminal electrode 4 and the terminal electrode 5 is disposed over at least the end surfaces 2a and 2b and a main surface 2d. Each of the terminal electrode 4 and the terminal electrode 5 and at least a part of the coil 8 overlap when viewed from the facing direction of the pair of side surfaces 2e and 2f. Each of the terminal electrode 4 and the terminal electrode 5 and the coil 8 do not overlap when viewed from the facing direction of the pair of end surfaces 2a and 2b.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 23, 2020
    Applicant: TDK Corporation
    Inventors: Hajime KATO, Hidekazu SATO, Makoto YOSHINO, Kazuya TOBITA, Yuto SHIGA, Youichi KAZUTA, Noriaki HAMACHI
  • Publication number: 20200234874
    Abstract: A multilayer coil component 1 includes four terminal electrodes 3, 4, 5, and 6. A part of the coil 8 as viewed from the facing direction of a pair of main surfaces 2c and 2d is disposed in at least one of first and second regions A1 and A2 formed between the pair of terminal electrodes 3 and 4 and the pair of terminal electrodes 5 and 6 disposed so as to face each other in the facing direction of the pair of side surfaces 2e and 2f and third and fourth regions formed between the pair of terminal electrodes 3 and 5 and the pair of terminal electrodes 4 and 6 disposed so as to face each other in the facing direction of the pair of end surfaces 2a and 2b.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 23, 2020
    Applicant: TDK CORPORATION
    Inventors: Hajime KATO, Hidekazu SATO, Makoto YOSHINO, Kazuya TOBITA, Yuto SHIGA, Youichi KAZUTA, Noriaki HAMACHI