Abstract: A wafer processing system includes: a grinding section configured to perform grinding of an edge portion of a wafer; a measurement section configured to measure a shape of the edge portion of the wafer subjected to the grinding, the measurement section being configured to measure a shape of a tip portion of a truer used for the grinding; and a feedback calculation section configured to perform feedback control for the grinding based on a measurement result the shape of the tip portion of the truer.

Abstract: A shape measuring apparatus includes: an optical unit having an imaging section configured to capture an image of a surface to be measured; a drive mechanism configured to move the optical unit relative to the surface to be measured in a direction along an optical axis of the imaging section; an illumination section configured to laterally illuminate the surface to be measured and can switch between a point light source function and a surface light source function; a shape data generating section configured to generate shape data indicating a shape of the surface to be measured based on captured images obtained by repeatedly capturing images with the imaging section while the optical unit is relatively moved; and an illumination controlling section configured to switch the illumination section that laterally illuminates the surface to be measured between the point light source function and the surface light source function.

Abstract: A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.

Abstract: A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.

Abstract: An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.

Abstract: The spectroscope includes: a spectroscopic element configured to disperse incident light (reflected light) in accordance with wavelengths; a detector (line sensor) having a plurality of pixels and configured to receive wavelength-specific light components obtained through light dispersion by the spectroscopic element at ones different from each other of the pixels; and a low-emissivity member provided on at least one of a first-direction side and a second-direction side of the spectroscopic element and the detector in a case where a one-direction side of a light dispersion direction of the spectroscopic element is the first-direction side, and an other-direction side of the light dispersion direction is the second-direction side.

Abstract: An inspection device includes: a camera configured to capture an image of an inspection object on a wafer; a first determining unit configured to detect the inspection object from the image captured by the camera and make a tentative determination of quality of the inspection object; a three-dimensional shape measuring machine configured to measure a three-dimensional shape of the inspection object determined to be abnormal by the tentative determination; and a second determining unit configured to make a formal determination of the quality of the inspection object based on the three-dimensional shape of the inspection object measured by the three-dimensional shape measuring machine and the image captured by the camera or based on the three-dimensional shape of the inspection object measured by the three-dimensional shape measuring machine.

Abstract: A shape measurement device includes: a displacement detector configured to detect displacement of a contact; a relative movement mechanism configured to relatively move the displacement detector with respect to the measurement object, and allow the contact to trace a surface to be measured of the measurement object; a position detecting sensor configured to detect a relative position of the displacement detector with respect to the measurement object; a camera configured to image the contact, and output a captured image of the contact; and a synchronization controller configured to repetitively execute three actions in synchronization together while the relative movement is being performed by the relative movement mechanism, the actions including detection of the relative position by the position detecting sensor, detection of the displacement by the displacement detector, and imaging by the camera.

Abstract: An adjustment method for a shape measuring device that radiates light from a light source to a master for adjustment and a reference surface respectively as measurement light and reference light and measures a shape of a surface to be measured of a measurement target using multiplexed light of the measurement light and the reference light respectively reflected by the master for adjustment and the reference surface, the adjustment method including; measuring the master for adjustment in an adjusted state in which a focus position matches an interference position and calculating and storing a matching degree parameter indicating a matching degree between the focus position and the interference position as an adjustment matching degree parameter; when the measurement target is measured, measuring the master for adjustment, calculating the matching degree parameter and comparing the matching degree parameter with the adjustment matching degree parameter, to confirm the matching degree.

Abstract: A three-dimensional shape measuring device includes a holder that changes the reference light path length in response to temperature change, and a temperature adjusting unit that adjusts a temperature of the holder to a target temperature, so as to make a measurement light path length equal to a reference light path length with high accuracy at low cost regardless of a temperature of an installation environment. A three-dimensional shape measuring device includes a temperature adjusting unit that adjusts the temperature of the holder and a temperature control unit that controls the temperature adjusting unit so as to selectively switch a measurement mode between a first measurement mode in which the reference light path length is made equal to a measurement light path length and a second measurement mode in which the reference light path length is made different from the measurement light path length.

Abstract: A surface shape measuring device includes a camera that captures the observation image acquired by the optical head, a drive unit that causes the optical head to scan relatively in a scanning direction perpendicular to the measurement target, an encoder for detecting a position of the optical head in the scanning direction with respect to the measurement target, an imaging instructing unit that instructs the camera to capture the observation image based on a position signal output from the encoder for each predetermined interval, a frame dropping occurrence rate calculating unit that calculates a frame dropping occurrence rate indicating an occurrence rate of frame dropping of the camera, and a measurement condition setting unit that sets a measurement condition for measuring a surface shape of the measurement target based on the frame dropping occurrence rate.

Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

Abstract: A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are ?, ? and ? respectively, the measurement device satisfies a condition of (?+?)?1/2????(?+?)+1/2?.

Abstract: The particle measurement device includes: an acquiring unit configured to acquire pad surface shape data indicating a surface shape of an electrode pad including a probe needle mark where a probe needle has contacted; a roughness calculating unit configured to calculate volume of a recessed portion recessed from a pad reference surface and volume of a protruding portion protruding from the pad reference surface based on the pad surface shape data; and a particle quantity calculating unit configured to calculate a particle quantity from a volume difference between the volume of the recessed portion and the volume of the protruding portion.

Abstract: The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.

Abstract: The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.

Abstract: A shape measurement device includes: a displacement detector configured to detect displacement of a contact; a relative movement mechanism configured to relatively move the displacement detector with respect to the measurement object, and allow the contact to trace a surface to be measured of the measurement object; a position detecting sensor configured to detect a relative position of the displacement detector with respect to the measurement object; a camera configured to image the contact, and output a captured image of the contact; and a synchronization controller configured to repetitively execute three actions in synchronization together while the relative movement is being performed by the relative movement mechanism, the actions including detection of the relative position by the position detecting sensor, detection of the displacement by the displacement detector, and imaging by the camera.

Abstract: A measurement device includes: a probe part including a probe configured to measure a surface of an object to be measured and is attached so as to swing around a swing center according to a shape of the surface of the object to be measured; a scale configured to measure displacement by swinging of the probe part; a scale head configured to read a scale mark of the scale; and an arm part to which the probe part is attached, the arm part is attached so as to swing around the swing center integrally with the probe part, and the scale is attached to the arm part. When thermal expansion coefficients of the probe part, the arm part and the scale are ?, ? and ? respectively, the measurement device satisfies a condition of ? + ? ? 1 ? / ? 2 ? ? ? ? ? ? ? ? ? + ? + 1 ? / ? 2 ? .

Abstract: The following are observed using a camera: a first position of a small hole of a workpiece, which is fixed to a linear-and-tilting-motion stage and rotating with a rotating body, and a second position thereof different from the first position, at a first rotation angle of the rotating body; and the first position and the second position of the small hole of the workpiece at a second rotation angle different from the first rotation angle of the rotating body. A position and a tilt of the small hole are calculated from coordinates of the respective observed positions, and small hole information, which includes the position and the tilt of the small hole, is outputted.

Abstract: The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.