Abstract: Optoelectronic coupling systems include an optoelectronic chip mounted on a substrate. The optoelectronic chip has one or more optoelectronic components. An integrated circuit chip is mounted on the substrate in communication with the optoelectronic chip via one or more wires. A lower lens array is positioned over the optoelectronic chip. A lower surface of the lower lens array has a first cut-away portion to accommodate the optoelectronic chip and a second cut-away portion to accommodate the one or more wires. An upper surface of the lower lens array has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has one or more upper lenses positioned over respective lower lenses.

Abstract: An optoelectronic coupling system includes an optoelectronic chip mounted on a substrate, having one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface with a first portion at a first height to mount on the substrate and a second portion at a second height, higher than the first height, to accommodate a height of the optoelectronic chip. The lower lens array has an upper surface that comprises one or more lower lenses positioned over respective optoelectronic components of the one or more optoelectronic components. An upper lens array is positioned over the lower lens array and has one or more upper lenses positioned over respective lower lenses.

Abstract: A method for assembling a waveguide connector includes positioning a polymer waveguide in one or more insertion structures within an inner portion of a cap where the polymer waveguide has alignment features. The method also includes inserting a ferrule into the inner portion of the cap such that an inner wall of the cap seals around the assembled connector and heating the polymer waveguide and the ferrule to a first temperature with the ferrule comprising alignment features and having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature.

Abstract: A method for assembling a waveguide connector includes positioning a polymer waveguide in one or more insertion structures within an inner portion of a cap where the polymer waveguide has alignment features. The method also includes inserting a ferrule into the inner portion of the cap such that an inner wall of the cap seals around the assembled connector and heating the polymer waveguide and the ferrule to a first temperature with the ferrule comprising alignment features and having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature.

Abstract: Methods of forming waveguide connectors include positioning a polymer waveguide in one or more insertion structures within an inner portion of a cap where the polymer waveguide has alignment features on a connection end face corresponding to one or more components of an assembled connector. The method can include inserting a ferrule into the inner portion of the cap such that an inner wall of the cap seals around the assembled connector to prevent contaminants from entering the inner portion and heating the polymer waveguide and the ferrule to a first temperature with the ferrule comprising alignment features and having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature.

Abstract: Optoelectronic coupling systems include an optoelectronic chip mounted on a substrate. The optoelectronic chip has one or more optoelectronic components. An integrated circuit chip is mounted on the substrate in communication with the optoelectronic chip via one or more wires. A lower lens array is positioned over the optoelectronic chip. A lower surface of the lower lens array has a first cut-away portion to accommodate the optoelectronic chip and a second cut-away portion to accommodate the one or more wires. An upper surface of the lower lens array has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has one or more upper lenses positioned over respective lower lenses.

Abstract: Methods of forming waveguide connectors include positioning a polymer waveguide in one or more insertion structures within an inner portion of a cap where the polymer waveguide has alignment features on a connection end face corresponding to one or more components of an assembled connector. The method can include inserting a ferrule into the inner portion of the cap such that an inner wall of the cap seals around the assembled connector to prevent contaminants from entering the inner portion and heating the polymer waveguide and the ferrule to a first temperature with the ferrule comprising alignment features and having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature.

Abstract: A method of fabricating a polymer waveguide (PWG) is presented. The method includes preparing a polymer waveguide (PWG) sheet having a surface with partially exposed cores and partially exposed cladding, the cladding covering the cores and preparing a first dicing tape, the first dicing tape being an ultraviolet (UV) cut type dicing tape defining separation lines on a back side thereof. The method further includes placing the partially exposed cores of the PWG sheet on the first dicing tape to prevent the surface of the PWG sheet from atmospheric contaminations and placing a tape side of the first dicing tape attached to the PWG sheet on a second dicing tape.

Abstract: An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.

Abstract: An optoelectronic coupling system includes an optoelectronic chip mounted on a substrate, having one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface with a first portion at a first height to mount on the substrate and a second portion at a second height, higher than the first height, to accommodate a height of the optoelectronic chip. The lower lens array has an upper surface that comprises one or more lower lenses positioned over respective optoelectronic components of the one or more optoelectronic components. An upper lens array is positioned over the lower lens array and has one or more upper lenses positioned over respective lower lenses.

Abstract: A method of fabricating a polymer waveguide (PWG) is presented. The method includes preparing a polymer waveguide (PWG) sheet having a surface with partially exposed cores and partially exposed cladding, the cladding covering the cores and preparing a first dicing tape, the first dicing tape being an ultraviolet (UV) cut type dicing tape defining separation lines on a back side thereof. The method further includes placing the partially exposed cores of the PWG sheet on the first dicing tape to prevent the surface of the PWG sheet from atmospheric contaminations and placing a tape side of the first dicing tape attached to the PWG sheet on a second dicing tape.

Abstract: Waveguide connector assembly device and methods of forming waveguide connectors include a cap having an inner portion to protect a connection end face of a polymer waveguide, wherein the cap includes one or more insertion structures to position the polymer waveguide in relation to one or more components of an assembled connector, and an inner wall to seal around the assembled connector to prevent contaminants from entering the inner portion.

Abstract: A method of fabricating a polymer waveguide (PWG) is presented. The method includes preparing a polymer waveguide (PWG) sheet having a surface with partially exposed cores and partially exposed cladding, the cladding covering the cores and preparing a first dicing tape, the first dicing tape being an ultraviolet (UV) cut type dicing tape defining separation lines on a back side thereof. The method further includes placing the partially exposed cores of the PWG sheet on the first dicing tape to prevent the surface of the PWG sheet from atmospheric contaminations and placing a tape side of the first dicing tape attached to the PWG sheet on a second dicing tape.

Abstract: A method of fabricating a polymer waveguide (PWG) is presented. The method includes preparing a polymer waveguide (PWG) sheet having a surface with partially exposed cores and partially exposed cladding, the cladding covering the cores and preparing a first dicing tape, the first dicing tape being an ultraviolet (UV) cut type dicing tape defining separation lines on a back side thereof. The method further includes placing the partially exposed cores of the PWG sheet on the first dicing tape to prevent the surface of the PWG sheet from atmospheric contaminations and placing a tape side of the first dicing tape attached to the PWG sheet on a second dicing tape.

Abstract: An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.

Abstract: A method of fabricating a polymer waveguide (PWG) is presented. The method includes preparing a polymer waveguide (PWG) sheet having a surface with partially exposed cores and partially exposed cladding, the cladding covering the cores and preparing a first dicing tape, the first dicing tape being an ultraviolet (UV) cut type dicing tape defining separation lines on a back side thereof. The method further includes placing the partially exposed cores of the PWG sheet on the first dicing tape to prevent the surface of the PWG sheet from atmospheric contaminations and placing a tape side of the first dicing tape attached to the PWG sheet on a second dicing tape.

Abstract: A method of fabricating a polymer waveguide (PWG) is presented. The method includes preparing a polymer waveguide (PWG) sheet having a surface with partially exposed cores and partially exposed cladding, the cladding covering the cores and preparing a first dicing tape, the first dicing tape being an ultraviolet (UV) cut type dicing tape defining separation lines on a back side thereof. The method further includes placing the partially exposed cores of the PWG sheet on the first dicing tape to prevent the surface of the PWG sheet from atmospheric contaminations and placing a tape side of the first dicing tape attached to the PWG sheet on a second dicing tape.

Abstract: Waveguide connectors include a ferrule having first alignment features. A waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions.

Abstract: Methods for fabricating connectors for multilayered optical waveguides, as well as apparatuses for multilayered optical waveguides that embody ferrules and connectors. The method of fabricating a connector includes the steps of: stacking in a containing unit of a ferrule, a plurality of optical waveguides that are each preliminarily formed in the shape of layers; and injecting resin or adhesive through a space lying between the plurality of optical waveguides and the containing unit of the ferrule, with the plurality of optical waveguides contained in a stacked manner so that resin or adhesive reaches each of the plurality of optical waveguides.

Abstract: An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.