Patents by Inventor Hidetoshi Numata
Hidetoshi Numata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9274288Abstract: Methods for fabricating connectors for multilayered optical waveguides, as well as apparatuses for multilayered optical waveguides that embody ferrules and connectors. The method of fabricating a connector includes the steps of: stacking in a containing unit of a ferrule, a plurality of optical waveguides that are each preliminarily formed in the shape of layers; and injecting resin or adhesive through a space lying between the plurality of optical waveguides and the containing unit of the ferrule, with the plurality of optical waveguides contained in a stacked manner so that resin or adhesive reaches each of the plurality of optical waveguides.Type: GrantFiled: October 10, 2013Date of Patent: March 1, 2016Assignee: International Business Machines CorporationInventors: Shigeru Nakagawa, Hidetoshi Numata
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Publication number: 20150293305Abstract: An optical device includes a substrate including a waveguide array formed therein, each waveguide having a reflective surface; a lens array unit including a waveguide-side lens array arranged facing the waveguide array so each lens of the lens array is aligned with the corresponding reflective surface; and a connector unit including an optical transmission path-side lens array arranged and fixed so each lens of the lens array is aligned with the corresponding lens in the waveguide-side lens array, the plurality of inserted optical transmission paths aligned with the corresponding lens in the optical transmission path-side lens array.Type: ApplicationFiled: June 24, 2015Publication date: October 15, 2015Inventors: Shigeru Nakagawa, Hidetoshi Numata, Yoichi Taira
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Publication number: 20150273732Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.Type: ApplicationFiled: June 11, 2015Publication date: October 1, 2015Inventors: Hidetoshi Numata, Yoichi Taira
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Publication number: 20150277066Abstract: An optical device includes a substrate including a waveguide array formed therein, each waveguide having a reflective surface; a lens array unit including a waveguide-side lens array arranged facing the waveguide array so each lens of the lens array is aligned with the corresponding reflective surface; and a connector unit including an optical transmission path-side lens array arranged and fixed so each lens of the lens array is aligned with the corresponding lens in the waveguide-side lens array, the plurality of inserted optical transmission paths aligned with the corresponding lens in the optical transmission path-side lens array.Type: ApplicationFiled: March 13, 2015Publication date: October 1, 2015Inventors: Shigeru Nakagawa, Hidetoshi Numata, Yoichi Taira
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Publication number: 20150266248Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.Type: ApplicationFiled: May 18, 2015Publication date: September 24, 2015Inventors: Hidetoshi Numata, Yoichi Taira
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Publication number: 20150202802Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.Type: ApplicationFiled: March 31, 2015Publication date: July 23, 2015Inventors: Hidetoshi NUMATA, Masao TOKUNARI
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Patent number: 9085112Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.Type: GrantFiled: August 30, 2013Date of Patent: July 21, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hidetoshi Numata, Yoichi Taira
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Patent number: 9061473Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.Type: GrantFiled: July 29, 2013Date of Patent: June 23, 2015Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hidetoshi Numata, Yoichi Taira
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Patent number: 9023256Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.Type: GrantFiled: August 30, 2013Date of Patent: May 5, 2015Assignee: International Business Machines CorporationInventors: Hidetoshi Numata, Masao Tokunari
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Patent number: 9008477Abstract: Alignment of a single-mode polymer waveguide (PWG) array fabricated on a polymer with a silicon waveguide (SiWG) array fabricated on a silicon (Si) chip and thereby realizing an adiabatic coupling. A stub and a groove are fabricated with high precision and made to function as the absolute positioning reference to provide a self-alignment according to the groove and the stub. In a PWG patterning by photolithography, plural masks are used, but the fabrication is made along the alignment base line for mask and thus a high precision is achieved with respect to error ?x. In a PWG patterning by nano imprint, a high precision in the fabrication is also achieved with respect to error ?x and ?y.Type: GrantFiled: October 7, 2013Date of Patent: April 14, 2015Assignee: International Business Machines CorporationInventor: Hidetoshi Numata
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Publication number: 20140147083Abstract: Methods for fabricating connectors for multilayered optical waveguides, as well as apparatuses for multilayered optical waveguides that embody ferrules and connectors. The method of fabricating a connector includes the steps of: stacking in a containing unit of a ferrule, a plurality of optical waveguides that are each preliminarily formed in the shape of layers; and injecting resin or adhesive through a space lying between the plurality of optical waveguides and the containing unit of the ferrule, with the plurality of optical waveguides contained in a stacked manner so that resin or adhesive reaches each of the plurality of optical waveguides.Type: ApplicationFiled: October 10, 2013Publication date: May 29, 2014Inventors: Shigeru Nakagawa, Hidetoshi Numata
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Publication number: 20140112629Abstract: A method for fabricating, and a structure embodying, a single-mode polymer wave guide array aligned with a polymer waveguide array through adiabatic coupling. The present invention provides a structure having a combination of (i) a stub fabricated on a polymer and (ii) a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning (a) a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with (b) a silicon waveguide (SiWG) array fabricated on the silicon chip; wherein, the stub fabricated on the polymer is patterned according to a nano-imprint process, along with the PWG array, in a direction in which the PWG array is fabricated, and the groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.Type: ApplicationFiled: October 10, 2013Publication date: April 24, 2014Applicant: International Business Machines CorporationInventors: Hidetoshi Numata, Yoichi Taira, Masao Tokunari
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Publication number: 20140112616Abstract: Alignment of a single-mode polymer waveguide (PWG) array fabricated on a polymer with a silicon waveguide (SiWG) array fabricated on a silicon (Si) chip and thereby realizing an adiabatic coupling. A stub and a groove are fabricated with high precision and made to function as the absolute positioning reference to provide a self-alignment according to the groove and the stub. In a PWG patterning by photolithography, plural masks are used, but the fabrication is made along the alignment base line for mask and thus a high precision is achieved with respect to error ?x. In a PWG patterning by nano imprint, a high precision in the fabrication is also achieved with respect to error ?x and ?y.Type: ApplicationFiled: October 7, 2013Publication date: April 24, 2014Applicant: International Business Machines CorporationInventor: Hidetoshi Numata
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Publication number: 20140061979Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.Type: ApplicationFiled: August 30, 2013Publication date: March 6, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hidetoshi NUMATA, Masao TOKUNARI
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Publication number: 20140035175Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.Type: ApplicationFiled: July 29, 2013Publication date: February 6, 2014Applicant: International Business Machines CorporationInventors: Hidetoshi Numata, Yoichi Taira
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Publication number: 20140037777Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.Type: ApplicationFiled: August 30, 2013Publication date: February 6, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hidetoshi Numata, Yoichi Taira
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Patent number: 8545108Abstract: A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.Type: GrantFiled: April 23, 2012Date of Patent: October 1, 2013Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
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Publication number: 20130251305Abstract: A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.Type: ApplicationFiled: April 23, 2012Publication date: September 26, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
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Publication number: 20130251304Abstract: An interface device includes a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a first engagement feature operative to engage a portion of a wafer, and a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule.Type: ApplicationFiled: March 23, 2012Publication date: September 26, 2013Applicant: International Business Machines CorporationInventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
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Patent number: 8542963Abstract: An optical coupling structure that interfaces between optical devices mounted on a substrate and optical waveguides formed in the substrate. A manufacturing method includes preparing a wafer formed on an inorganic solid material on a dicing tape and cutting the back surface of the wafer to form substantially angled portions using a dicing blade having a point angle. The dicing tape is stripped from the wafer and the wafer is separated at the valleys between the substantially angled portions to obtain an optical coupling element. The obtained optical coupling element is a three-dimensional polyhedral light-reflecting member having a mirror surface corresponding to a surface of the wafer. The obtained optical coupling element is inserted into a trench that opens, substantially perpendicular to an optical waveguide of an optical transmission substrate, in the main surface of the optical transmission substrate to provide a structure for optical coupling with the outside.Type: GrantFiled: April 29, 2010Date of Patent: September 24, 2013Assignee: International Business Machines CorporationInventors: Shigeru Nakagawa, Hidetoshi Numata, Kuniaki Sueoka, Yoichi Taira