Patents by Inventor Hidetoshi Numata

Hidetoshi Numata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180196199
    Abstract: An optoelectronic coupling system and methods of forming the same include an optoelectronic chip mounted on a substrate. The optoelectronic chip includes one or more optoelectronic components. A lower lens array is positioned over the optoelectronic chip and has a lower surface, with a first cut-away portion to accommodate the optoelectronic chip, and an upper surface that has one or more lower lenses positioned over respective optoelectronic components. An upper lens array is positioned over the lower lens array and has comprising one or more upper lenses positioned over respective lower lenses.
    Type: Application
    Filed: January 10, 2017
    Publication date: July 12, 2018
    Inventors: Hidetoshi Numata, Masao Tokunari
  • Patent number: 9977191
    Abstract: An optical device includes a substrate including a waveguide array formed therein, each waveguide having a reflective surface; a lens array unit including a waveguide-side lens array arranged facing the waveguide array so each lens of the lens array is aligned with the corresponding reflective surface; and a connector unit including an optical transmission path-side lens array arranged and fixed so each lens of the lens array is aligned with the corresponding lens in the waveguide-side lens array, the plurality of inserted optical transmission paths aligned with the corresponding lens in the optical transmission path-side lens array.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: May 22, 2018
    Assignee: International Business Machines Corporation
    Inventors: Shigeru Nakagawa, Hidetoshi Numata, Yoichi Taira
  • Publication number: 20180045898
    Abstract: Waveguide connector assembly device and methods of forming waveguide connectors include a cap having an inner portion to protect a connection end face of a polymer waveguide, wherein the cap includes one or more insertion structures to position the polymer waveguide in relation to one or more components of an assembled connector, and an inner wall to seal around the assembled connector to prevent contaminants from entering the inner portion.
    Type: Application
    Filed: August 10, 2016
    Publication date: February 15, 2018
    Inventors: Tymon Barwicz, Hidetoshi Numata
  • Patent number: 9885835
    Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule without a waveguide backfilm. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: February 6, 2018
    Assignee: International Business Machines Corporation
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Publication number: 20170351032
    Abstract: Waveguide connectors include a ferrule having first alignment features. A waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions.
    Type: Application
    Filed: August 22, 2017
    Publication date: December 7, 2017
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9746613
    Abstract: Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: August 29, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9658411
    Abstract: A structure includes a combination of a stub fabricated on a polymer and a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with a silicon waveguide (SiWG) array fabricated on the silicon chip. The stub fabricated on the polymer is patterned according to a nano-imprint process along with the PWG array in a direction in which the PWG array is fabricated. The groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: May 23, 2017
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Yoichi Taira, Masao Tokunari
  • Publication number: 20160377817
    Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule without a waveguide backfilm. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.
    Type: Application
    Filed: April 19, 2016
    Publication date: December 29, 2016
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Publication number: 20160377816
    Abstract: Waveguide connectors include a ferrule having first alignment features. A polymer waveguide has one or more a topclad portions, each with a waveguide core, second alignment features fastened to the first alignment features, and underclad portion that is thicker than the one or more topclad portions. The polymer waveguide has a higher coefficient of thermal expansion than the ferrule and is fastened to the ferrule under tension.
    Type: Application
    Filed: April 19, 2016
    Publication date: December 29, 2016
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Publication number: 20160252686
    Abstract: A structure includes a combination of a stub fabricated on a polymer and a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with a silicon waveguide (SiWG) array fabricated on the silicon chip. The stub fabricated on the polymer is patterned according to a nano-imprint process along with the PWG array in a direction in which the PWG array is fabricated. The groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.
    Type: Application
    Filed: May 12, 2016
    Publication date: September 1, 2016
    Inventors: Hidetoshi Numata, Yoichi Taira, Masao Tokunari
  • Patent number: 9429711
    Abstract: An optical device includes a substrate including a waveguide array formed therein, each waveguide having a reflective surface; a lens array unit including a waveguide-side lens array arranged facing the waveguide array so each lens of the lens array is aligned with the corresponding reflective surface; and a connector unit including an optical transmission path-side lens array arranged and fixed so each lens of the lens array is aligned with the corresponding lens in the waveguide-side lens array, the plurality of inserted optical transmission paths aligned with the corresponding lens in the optical transmission path-side lens array.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: August 30, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shigeru Nakagawa, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9429718
    Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: August 30, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9417404
    Abstract: Waveguide connectors and methods of forming the same include heating a polymer waveguide having one or more waveguide cores and alignment features to a first temperature. A ferrule having alignment features is heated to the first temperature, the ferrule having a different coefficient of thermal expansion from the polymer waveguide. The alignment features of the polymer waveguide align with the alignment features of the ferrule when the polymer waveguide and the ferrule are heated to the first temperature. The polymer waveguide is positioned on the ferrule without a waveguide backfilm. The alignment features of the polymer waveguide are bonded to the corresponding alignment features of the ferrule.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: August 16, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Tymon Barwicz, Hidetoshi Numata, Yoichi Taira
  • Patent number: 9393718
    Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.
    Type: Grant
    Filed: May 18, 2015
    Date of Patent: July 19, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hidetoshi Numata, Yoichi Taira
  • Patent number: 9387603
    Abstract: High accuracy positioning relative to an absolute reference position (guide pin holes in ferrules, etc.) is provided for a plurality of cores constituting a polymer waveguide array for connection to ferrules at ends of a plurality of these assemblies to form a single-mode polymer waveguide array assembly. A method for forming a single-mode polymer waveguide array assembly enables a plurality of cores constituting a polymer waveguide array to be positioned with high accuracy. Also provided is a combination of process molds (an initial process mold and intermediate process mold) used in the processes unique to the present methods.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: July 12, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Hidetoshi Numata, Yoichi Taira
  • Patent number: 9372305
    Abstract: A method for fabricating, and a structure embodying, a single-mode polymer wave guide array aligned with a polymer waveguide array through adiabatic coupling. The present invention provides a structure having a combination of (i) a stub fabricated on a polymer and (ii) a groove fabricated on a silicon (Si) chip, with which an adiabatic coupling can be realized by aligning (a) a (single-mode) polymer waveguide (PWG) array fabricated on the polymer with (b) a silicon waveguide (SiWG) array fabricated on the silicon chip; wherein, the stub fabricated on the polymer is patterned according to a nano-imprint process, along with the PWG array, in a direction in which the PWG array is fabricated, and the groove fabricated on the silicon chip is fabricated along a direction in which the SiWG array is fabricated.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: June 21, 2016
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Yoichi Taira, Masao Tokunari
  • Publication number: 20160154188
    Abstract: Methods for fabricating connectors for multilayered optical waveguides, as well as apparatuses for multilayered optical waveguides that embody ferrules and connectors. The method of fabricating a connector includes the steps of: stacking in a containing unit of a ferrule, a plurality of optical waveguides that are each preliminarily formed in the shape of layers; and injecting resin or adhesive through a space lying between the plurality of optical waveguides and the containing unit of the ferrule, with the plurality of optical waveguides contained in a stacked manner so that resin or adhesive reaches each of the plurality of optical waveguides.
    Type: Application
    Filed: January 22, 2016
    Publication date: June 2, 2016
    Inventors: Shigeru Nakagawa, Hidetoshi Numata
  • Patent number: 9354381
    Abstract: An information processing apparatus, a calculation method, a program, and a storage medium for generating a uniformly distributed discrete pattern. To calculate a spatial arrangement of a plurality of elements of a discrete pattern, the plurality of elements being arranged in a spatially discrete manner, an information processing apparatus according to the present invention determines, for each of the elements, a density in an initial position given to the element from a density distribution of the elements in a region where the elements are arranged in the discrete pattern and places, for the initial position of each of the elements, a figure having a size corresponding to the density and representing a region where the element repels other elements and a movement range of the figure. The information processing apparatus minimizes an objective function, computes an optimal solution, and outputs the optimal solutions.
    Type: Grant
    Filed: August 22, 2012
    Date of Patent: May 31, 2016
    Assignee: International Business Machines Corporation
    Inventors: Tsuyoshi Ide, Takashi Imamichi, Hidetoshi Numata
  • Patent number: 9329329
    Abstract: An information processing apparatus, a calculation method, a program, and a storage medium for generating a uniformly distributed discrete pattern. To calculate a spatial arrangement of a plurality of elements of a discrete pattern, the plurality of elements being arranged in a spatially discrete manner, an information processing apparatus according to the present invention determines, for each of the elements, a density in an initial position given to the element from a density distribution of the elements in a region where the elements are arranged in the discrete pattern and places, for the initial position of each of the elements, a figure having a size corresponding to the density and representing a region where the element repels other elements and a movement range of the figure. The information processing apparatus minimizes an objective function, computes an optimal solution, and outputs the optimal solutions.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: May 3, 2016
    Assignee: International Business Machines Corporation
    Inventors: Tsuyoshi Ide, Takashi Imamichi, Hidetoshi Numata
  • Patent number: 9289921
    Abstract: A method of forming a single-mode polymer waveguide array connector that provides precise alignment of a plurality of cores of polymer waveguide arrays with respect to an absolute reference position, such as a guide pin hole in a ferrule, when the polymer waveguide array connector is connected to another polymer waveguide array connector or provides precise alignment of a plurality of cores of a polymer waveguide array and a fiber array with respect to the absolute reference position when the polymer waveguide array connector is connected to a single-mode fiber array connector. A plurality of cores of single-mode polymer waveguide arrays or single-mode fiber arrays is precisely aligned with each other. In addition, there is provided a combination of a plurality of molds, e.g., a first mold (A) and a second mold (B), used in a plurality of processes in a specific method.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: March 22, 2016
    Assignee: International Business Machines Corporation
    Inventors: Hidetoshi Numata, Masao Tokunari