Patents by Inventor Hiroaki Asano
Hiroaki Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190021036Abstract: To allow for selection of a connection-destination suitable for an application when switching from one connection-destination to another, or adding or deleting a connection-destination, a base station apparatus is configured to generate connection-destination candidate information on base station apparatuses as connection-destination candidates connectable to a terminal apparatus, and transmit to the terminal apparatus a connection-destination candidate notification control message including the connection-destination candidate information, and the terminal apparatus selects a new base station apparatus to be used as a new connection-destination based on the connection-destination candidate information and a communication condition required by a user application section, the user application section being configured to perform information processing required by a user concurrently with performing wireless communication.Type: ApplicationFiled: February 17, 2016Publication date: January 17, 2019Applicant: PANASONIC CORPORATIONInventors: Noriyuki SHIMIZU, Hiroaki ASANO, Yasufumi ICHIKAWA
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Publication number: 20180310243Abstract: For selection of a wireless access point, a terminal apparatus is configured to include a transmitter transmitting terminal information to a communication control apparatus, a receiver receiving access point candidate information from the communication control apparatus, a bandwidth estimator estimating current bandwidth associated with each of the candidate wireless access points included in the access point candidate information, and an access point selector selecting at least one wireless access point for communication from the candidate wireless access points included in the access point candidate information. Terminal information includes information on a communication location where the terminal apparatus communicates with the communication control apparatus and the access point candidate information includes information on candidate wireless access points for the communication location and past bandwidth information acquired associated with each of the candidate wireless access points.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Applicant: PANASONIC CORPORATIONInventors: Masaaki YOSHINO, Hiroaki ASANO, Yasuharu HASHIMOTO
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Publication number: 20180249477Abstract: There is provided a wireless base station device capable of reducing a communication delay time related to communication of a priority call. A wireless base station device includes a processor a memory, and an antenna. The memory stores a wireless resource allocated to a priority call of radio channels for transmission of data with a wireless communication terminal before a priority call is generated under the control of the processor. The processor allocates the wireless resource stored in the memory to a generated priority call. The antenna performs communication of data of the priority call by using the allocated wireless resource.Type: ApplicationFiled: February 25, 2016Publication date: August 30, 2018Inventors: Sojiro NORITA, Osamu KATO, Hiroaki ASANO, Yasufumi ICHIKAWA, Noriyuki SHIMIZU
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Patent number: 9693456Abstract: This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.Type: GrantFiled: October 23, 2013Date of Patent: June 27, 2017Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Hitoshi Shimadu, Shigeki Kawaguchi, Tomoaki Asai
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Patent number: 9655240Abstract: A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.Type: GrantFiled: October 23, 2013Date of Patent: May 16, 2017Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Hitoshi Shimadu, Shigeki Kawaguchi, Tomoaki Asai
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Patent number: 9332638Abstract: An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.Type: GrantFiled: May 23, 2012Date of Patent: May 3, 2016Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Harumitsu Sato, Hiroki Watanabe, Tadayoshi Kachi, Takahiro Suzuki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
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Publication number: 20150351239Abstract: This substrate includes an insulating substrate having a first surface and a second surface, and a metal layer of a metal plate bonded to the first surface. The insulating substrate has a through hole. The metal layer includes: a bent section that is inserted through the through hole and bulges from the first surface toward the second surface; and outer periphery sections that are positioned around the bent section and are bonded to the first surface. The bent section has a first end and a second end positioned on opposite sides, and is bent with respect to the outer periphery sections at the first end and the second ends. The outer periphery sections are divided into a first outer periphery section and a second outer periphery section, which are respectively continuous with the first end and the second end of the bent section.Type: ApplicationFiled: October 23, 2013Publication date: December 3, 2015Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori OZAKI, Yasuhiro KOIKE, Hiroaki ASANO, Hitoshi SHIMADU, Shigeki KAWAGUCHI, Tomoaki ASAI
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Publication number: 20150289371Abstract: A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area.Type: ApplicationFiled: October 23, 2013Publication date: October 8, 2015Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Hitoshi Shimadu, Shigeki Kawaguchi, Tomoaki Asai
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Publication number: 20150289375Abstract: This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located.Type: ApplicationFiled: October 1, 2013Publication date: October 8, 2015Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Hitoshi Shimadu, Shigeki Kawaguchi, Tomoaki Asai
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Publication number: 20150282313Abstract: A wiring board includes a first substrate including a first surface and a second substrate including a first surface. A solder hole is arranged at least in the first surface of the first substrate. A solder hole is arranged at least in the first surface of the second substrate. The second substrate is coupled to the first substrate. The first substrate and the second substrate are electrically connected with each other. The first surface of the first substrate and the first surface of the second substrate are flush with each other and configured such that a part of one surface of a mask is placed on the first surface of the first substrate and another part of the surface of the mask is placed on the first surface of the second substrate.Type: ApplicationFiled: September 17, 2013Publication date: October 1, 2015Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Hitoshi Shimazu, Tomoaki Asai
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Publication number: 20150235755Abstract: A planar coil includes an effective line segment, which extends over at least one turn and is configured such that a current flows therein, and a dummy line segment, which extends over at least one turn and is configured such that a current does not flow therein.Type: ApplicationFiled: September 12, 2013Publication date: August 20, 2015Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Hitoshi Shimazu, Tomoaki Asai
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Patent number: 8963672Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.Type: GrantFiled: June 21, 2012Date of Patent: February 24, 2015Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Hiroaki Asano, Yasuhiro Koike, Kiminori Ozaki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
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Patent number: 8922313Abstract: An induction device includes a casing, a coil retainer, a coil that is disposed in the casing and retained to the coil retainer and a core that is disposed in the casing. The coil extends spirally around the core. The core and the coil retainer are fixed to the casing separately.Type: GrantFiled: December 16, 2011Date of Patent: December 30, 2014Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Sergey Moiseev, Yasuhiro Koike, Hiroaki Asano, Kiminori Ozaki, Masanori Tsuzaka, Shimpei Sakoda
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Publication number: 20140251659Abstract: A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole.Type: ApplicationFiled: July 2, 2012Publication date: September 11, 2014Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Hiroaki Asano, Yasuhiro Koike, Kiminori Ozaki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
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Publication number: 20140226296Abstract: This multi-layer wiring board is provided with an insulating substrate, an inner layer copper sheet, and an outer layer copper foil. The inner layer copper sheet is disposed within the insulating substrate and has been patterned. The outer layer copper foil is disposed in a state of having been patterned at the surface of the insulating substrate, is thinner than the inner layer copper sheet, and has a cross-sectional area of the current path that is smaller than the cross-sectional area of the current path of the inner layer copper sheet. As a result, provided are: a multi-layer wiring board that can flow a large current and a smaller current while suppressing an increase in the projected area of the substrate; and a method for producing the multi-layer wiring board.Type: ApplicationFiled: February 10, 2012Publication date: August 14, 2014Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Hiroaki Asano, Yasuhiro Koike, Kiminori Ozaki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
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Patent number: 8787037Abstract: An electronic device includes a shielding member, an electric circuit, and a filter capacitor. The electric circuit has an output line and is arranged inside the shielding member. The filter capacitor is arranged outside the shielding member to be connected to the output line.Type: GrantFiled: December 21, 2011Date of Patent: July 22, 2014Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Shimpei Sakoda, Yasuhiro Koike, Hiroaki Asano, Kiminori Ozaki, Sergey Moiseev
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Publication number: 20140151106Abstract: An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.Type: ApplicationFiled: May 23, 2012Publication date: June 5, 2014Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Kiminori Ozaki, Yasuhiro Koike, Hiroaki Asano, Harumitsu Sato, Hiroki Watanabe, Tadayoshi Kachi, Takahiro Suzuki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
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Publication number: 20140139310Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.Type: ApplicationFiled: June 21, 2012Publication date: May 22, 2014Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKIInventors: Hiroaki Asano, Yasuhiro Koike, Kiminori Ozaki, Hitoshi Shimadu, Tetsuya Furuta, Masao Miyake, Takahiro Hayakawa, Tomoaki Asai, Ryou Yamauchi
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Patent number: 8686823Abstract: An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate.Type: GrantFiled: January 23, 2012Date of Patent: April 1, 2014Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Hiroaki Asano, Sadanori Suzuki, Kiminori Ozaki, Yasuhiro Koike, Hitoshi Shimadu, Tetsuya Furata, Tomoaki Asai, Takahiro Hayakawa, Ryou Yamauchi, Masao Miyake
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Patent number: 8506308Abstract: A substrate connection structure includes a first substrate, a second substrate, a first connection terminal plate, a second connection terminal plate, and a fastening member. The first connection terminal plate extends away from the first substrate and includes a flat portion. The second connection terminal plate extends away from the second substrate and includes a flat portion. At least one of the flat portions includes a screw insertion portion. The fastening member fastens the first connection terminal plate and the second connection terminal plate through the screw insertion portion in a state in which the flat portions are in contact with each other.Type: GrantFiled: January 6, 2012Date of Patent: August 13, 2013Assignee: Kabushiki Kaisha Toyota JidoshokkiInventors: Hiroaki Asano, Sadanori Suzuki, Kiminori Ozaki