Abstract: An imaging element according to an embodiment of the present disclosure includes: a sensor substrate having a light-receiving region in which a plurality of light-receiving elements are arranged and a peripheral region provided around the light-receiving region; a sealing member disposed to be opposed to one surface of the sensor substrate; a resin layer that attaches the sensor substrate and the sealing member to each other; and an excavated part provided in the peripheral region of the one surface of the sensor substrate, and in which the resin layer is embedded, with the resin layer having one or a plurality of gaps inside the excavated part in a plan view.

Abstract: It is an object of the present disclosure to provide copper alloy particles or the like, wherein, by sufficiently melting an irradiation region with heat generated through the irradiation of a laser beam during manufacturing in particular, a layer-manufactured product can be obtained, which has low porosity (void fraction), and excellent corrosion resistance and fatigue characteristics. Copper alloy particles 1 of the present disclosure are used as an Additive Manufacturing material by irradiation with a laser beam having a wavelength of 1.2 ?m or less, and have an average particle diameter of 50 ?m or less, wherein a light absorption rate of the material is 6% or more.

Abstract: A switch apparatus includes: a plurality of ports; a VLAN setting management unit storing entries, in each of which VLAN information and at least one of the plurality of ports are associated with each other, and adding or updating, if an entry corresponding to a combination of VLAN information included in a packet received from a port and the reception port of the packet is not stored, a corresponding entry for the received packet; and a functional unit notifying a predetermined control apparatus of an added or updated content of the entry.

Abstract: In the present situation, a switch cannot identify inner tag data (VLAN ID data before QinQed in the input of OF-NW) given to each of packets which flow in an open flow network (OF-NW). Therefore, OF-NW composed only one VLAN cannot handle a plurality of VLANs. Specifically, a controller handles a plurality of VLANs in the OF-NW in which there is only one VLAN, by mapping the inner tag data given to the packets which flow through the OF-NW, and flow cookie data showing the flow entry corresponding to the packets which flow through the OF-NW. Specifically, the flow flowing into the OF-NW is transferred from the switch to the controller, and the controller learns VLAN ID data in the input of the OF-NW, and handles the plurality of VLANs by mapping this VLAN ID and the flow cookie data showing the flow entry corresponding to the packet in the OF-NW.

Abstract: A communication system includes a communication apparatus that processes a packet according to control information set by a control apparatus; a first control apparatus that controls the communication apparatus by setting the control information in the communication apparatus; and a second control apparatus that operates in concert with the first control apparatus. The first control apparatus transmits information necessary for interoperation between the first and second control apparatuses to the second control apparatus via the communication apparatus.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.

Abstract: A switch apparatus includes: a plurality of ports; a VLAN setting management unit storing entries, in each of which VLAN information and at least one of the plurality of ports are associated with each other, and adding or updating, if an entry corresponding to a combination of VLAN information included in a packet received from a port and the reception port of the packet is not stored, a corresponding entry for the received packet; and a functional unit notifying a predetermined control apparatus of an added or updated content of the entry.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: Porous silicon particles and complex porous silicon particles suitable for negative electrode materials etc. for lithium-ion batteries, which achieve high capacity and good cycling characteristics, are provided. Porous silicon particles formed by the joining of a plurality of silicon microparticles, and having an average particle diameter of 0.1 ?m to 1000 ?m, a three-dimensional network structure having continuous gaps, an average porosity of 15 to 93%, and a structure in which the particles of a whole particle are uniform. Complex porous silicon particles formed by the joining of a plurality of silicon microparticles and a plurality of silicon compound particles, and characterized by containing a compound of silicon and composite elements, having an average particle diameter of 0.1 ?m to 1000 ?m, and having a three-dimensional network structure having continuous gaps.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A communication system includes a communication apparatus that processes a packet according to control information set by a control apparatus; a first control apparatus that controls the communication apparatus by setting the control information in the communication apparatus; and a second control apparatus that operates in concert with the first control apparatus. The first control apparatus transmits information necessary for interoperation between the first and second control apparatuses to the second control apparatus via the communication apparatus.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: In the present situation, a switch cannot identify inner tag data (VLAN ID data before QinQed in the input of OF-NW) given to each of packets which flow in an open flow network (OF-NW). Therefore, OF-NW composed only one VLAN cannot handle a plurality of VLANs. Specifically, a controller handles a plurality of VLANs in the OF-NW in which there is only one VLAN, by mapping the inner tag data given to the packets which flow through the OF-NW, and flow cookie data showing the flow entry corresponding to the packets which flow through the OF-NW. Specifically, the flow flowing into the OF-NW is transferred from the switch to the controller, and the controller learns VLAN ID data in the input of the OF-NW, and handles the plurality of VLANs by mapping this VLAN ID and the flow cookie data showing the flow entry corresponding to the packet in the OF-NW.

Abstract: A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched.

Abstract: A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

Abstract: A method of controlling composition of a molten copper or a molten copper alloy during continuous cast, comprising the steps of determining continuously specific resistance of the molten copper or the molten copper alloy; calculating the composition of the molten copper or the molten copper alloy based on relationships between specific resistance of the molten copper or the molten copper alloy and each constituent which are preliminarily comprehended; and controlling the composition of the molten copper or the molten copper alloy based on the calculated composition. It is possible to consider temperature or content of dissolved oxygen to calculate the composition.

Abstract: A gas generator including a cup filled with gas generant molded articles that generate gas by combustion, and an ignitor on which an ignition agent is disposed. Each gas generant molded article is formed of smokeless powders containing nitrocellulose as its major ingredient. Each gas generant molded article includes an explosive containing a fuel agent containing a guanidine derivative and/or a tetrazole derivative and an oxidizing agent containing a metal nitrate and/or perchlorate. Thus, it is possible to provide a gas generator by which the amount of CO gas generated in operation can be reduced and the combustion speed can easily be controlled, and to provide a pretensioner system provided with the gas generator.

Abstract: A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.