Patents by Inventor Hirokazu Yoshida

Hirokazu Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120008025
    Abstract: A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.
    Type: Application
    Filed: June 16, 2011
    Publication date: January 12, 2012
    Applicant: SONY CORPORATION
    Inventors: Keiji Sasano, Hiroaki Tanaka, Hiroki Hagiwara, Yuki Tsuji, Tsuyoshi Watanabe, Koji Tsuchiya, Kenzo Tanaka, Takaya Wada, Hirokazu Yoshida, Noboru Kawabata, Hironori Yokoyama
  • Publication number: 20100307711
    Abstract: A method of controlling composition of a molten copper or a molten copper alloy during continuous cast, comprising the steps of determining continuously specific resistance of the molten copper or the molten copper alloy; calculating the composition of the molten copper or the molten copper alloy based on relationships between specific resistance of the molten copper or the molten copper alloy and each constituent which are preliminarily comprehended; and controlling the composition of the molten copper or the molten copper alloy based on the calculated composition. It is possible to consider temperature or content of dissolved oxygen to calculate the composition.
    Type: Application
    Filed: November 28, 2008
    Publication date: December 9, 2010
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa, Shuji Tomimatsu
  • Publication number: 20100307712
    Abstract: A process for producing a copper alloy material from a copper alloy of a precipitation reinforced type, which contains a process to perform individually a dissolution of a pure copper and a dissolution of an additional element or a mother alloy containing the same, comprises the steps of: melting an element and/or a mother alloy at a same time, that is selected from a Ni, a Co, an Si, a Ni—Cu mother alloy, a Co—Cu mother alloy, an Si—Cu mother alloy, a Ni—Si—Cu mother alloy, and a Co—Si—Cu mother alloy with combining therebetween, and melting thereof with an assistance of a generation of a heat of mixing, in a case of forming a high density melt containing at least either one of the Ni or the Co, and the Si, as high density thereof; forming the high density melt as a content of the Ni to be 80 mass % at maximum; and forming an alloy molten metal having a predetermined component and concentration, by adding the melt into a pure copper molten metal to be supplied from another melting furnace.
    Type: Application
    Filed: November 28, 2008
    Publication date: December 9, 2010
    Inventors: Hirokazu Yoshida, Tsukasa Takazawa, Toshio Abe, Shuji Tomimatsu
  • Publication number: 20100186615
    Abstract: A gas generator including a cup filled with gas generant molded articles that generate gas by combustion, and an ignitor on which an ignition agent is disposed. Each gas generant molded article is formed of smokeless powders containing nitrocellulose as its major ingredient. Each gas generant molded article includes an explosive containing a fuel agent containing a guanidine derivative and/or a tetrazole derivative and an oxidizing agent containing a metal nitrate and/or perchlorate. Thus, it is possible to provide a gas generator by which the amount of CO gas generated in operation can be reduced and the combustion speed can easily be controlled, and to provide a pretensioner system provided with the gas generator.
    Type: Application
    Filed: January 17, 2007
    Publication date: July 29, 2010
    Applicant: NIPPON KAYAKU KABUSHIKI KAISHA
    Inventors: Ryoi Kodama, Eishi Sato, Hirokazu Yoshida
  • Publication number: 20090165902
    Abstract: A method of producing a copper alloy wire rod, containing: a casting step for obtaining an ingot by pouring molten copper of a precipitation strengthening copper alloy into a belt-&-wheel-type or twin-belt-type movable mold; and a rolling step for rolling the ingot obtained by the casting step, which steps are continuously performed, wherein an intermediate material of the copper alloy wire rod in the mid course of the rolling step or immediately after the rolling step is quenched.
    Type: Application
    Filed: December 1, 2008
    Publication date: July 2, 2009
    Applicant: THE FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hirokazu YOSHIDA, Tsukasa TAKAZAWA
  • Patent number: 7516551
    Abstract: In a portable electric circular saw (portable cutting tool) including a cutting tool body having a motor serving as a driving source and a saw blade (cutting tool) driven to rotate by the motor and a base guiding the cutting tool body along a surface of a material to be cut, and allowing a parallel ruler to be mounted on the base, guide bars respectively inserted through insertion holes formed in the base are provided with a dust guard that can slide parallel to an end face of the saw blade and can abut against the end face of the saw blade.
    Type: Grant
    Filed: March 14, 2006
    Date of Patent: April 14, 2009
    Assignee: Hitachi Koki Co., Ltd.
    Inventor: Hirokazu Yoshida
  • Patent number: 7516552
    Abstract: A portable cutting tool includes: a cutting tool main body having a motor, a rotating blade and a saw cover for covering a part of the rotating blade, a base including a slide surface and a supporting part, and a guide including a pole supported by the supporting part, and a guiding part having a guide surface substantially orthogonal to the slide surface. An interposition member can be disposed so as to interpose between the guide and a side end of the base. The distance between the rotating blade and the guide surface is adjustable by changing a position of the guide. The portable cutting tool includes a contact preventing unit is provided for regulating an adjustment range of the guide to prevent contact of the guide surface and the rotating blade when the guide is attached to the base with the interposition member removed.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: April 14, 2009
    Assignee: Hitachi Koki Co., Ltd.
    Inventor: Hirokazu Yoshida
  • Patent number: 7434321
    Abstract: A portable cutting tool includes a saw blade for cutting a workpiece, a cutting tool main body having a motor for driving to rotate the saw blade, a base for guiding the cutting tool main body along a surface of the workpiece, and an inclining mechanism for inclining the base by pivoting the base centering on a support shaft of the cutting tool main body. The inclining mechanism includes a first circular arc member provided to be contiguous to at least one of a front end portion and a rear end portion of the base, pivoted along with the base centering on the support shaft and having a first guide hole in a circular arc shape penetrated in a radius direction thereof, and includes a fixing unit for fixing a position of pivoting the base relative to the cutting tool at an arbitrary position the first guide hole.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: October 14, 2008
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Kenji Niwa, Hirokazu Yoshida
  • Patent number: 7355316
    Abstract: In the portable electrical circular saw (electrical tool) in which a commutator motor (permanent magnet motor) is mounted in a motor case (housing) which is integrally formed in a tube shape, the commutator motor includes a stator fixed to an inner circumferential surface of the motor case and a rotor which is rotatably disposed in the stator, and a plate having a plurality of protrusions is disposed on at least one of the both axial ends of a rotor core of the rotor, an outer diameter of at least two protrusions of the plate is larger than an outer diameter of the rotor core and smaller than an inner diameter of the stator.
    Type: Grant
    Filed: April 11, 2006
    Date of Patent: April 8, 2008
    Assignee: Hitachi Koki Co. Ltd.
    Inventors: Tomoyoshi Yokota, Hirokazu Yoshida, Satoru Gunji
  • Patent number: 7351476
    Abstract: The present invention aims to give a two package curing type polyurethane coating composition which can form a film having soft, wet and dry feelings simultaneously and which maintains general properties such as designing property, film strength, pot life, resistance to scratching and discoloration, resistance to stains with fats and oils and the like, and to provide a coated article with the coating composition. The two package curing type polyurethane coating composition comprises a resin solution containing an acrylic polyol and a curing agent solution containing a polyisocyanate. The resin solution contains urethane resin beads (A) in the amount of 25 to 50 parts by weight and an organic matting agent (B) in the amount of 3 to 10 parts by weight, and the total of (A) and (B) is at least 30 parts by weight in 100 parts by weight of solid contents of the resin solution. And the equivalent ratio of OH groups/NCO groups of the acrylic polyol and the polyisocyanate is in the range of 4.5:1 to 1.5:1.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: April 1, 2008
    Assignees: Toyota Jidosha Kabushiki Kaisha, Nippon Bee Chemical Co., Ltd.
    Inventors: Kenji Kawazu, Mika Kai, Hirokazu Yoshida, Yasuhiro Nakano
  • Patent number: 7348492
    Abstract: A flexible wiring board is obtained as follows. A copper foil pattern is formed on the both surfaces of a base polymer film made of polyimide, etc. The copper foil pattern of the both sides, except for an end portion of the copper foil pattern of one surface, is covered entirely with an insulative protecting film made of polyimide, etc., for protecting the copper foil pattern, and the insulative protecting film and the copper foil pattern are bonded with each other by an insulative protecting film adhesive layer. On the exposed end portion of the copper foil pattern on one surface is formed a plated layer to be connected to an electrical component. The thickness of the insulative protecting film which is bonded with the surface on which the plated layer is formed is set to be thinner than the base polymer film. As a result, it is ensured that insulation failure of the insulative protecting film is prevented, and wire breakage of wiring when bent can easily be prevented.
    Type: Grant
    Filed: November 15, 2000
    Date of Patent: March 25, 2008
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Noriko Kawai, Takashi Nakashima, Hirokazu Yoshida
  • Publication number: 20070095186
    Abstract: A portable cutting tool includes: a cutting tool main body having a motor, a rotating blade and a saw cover for covering a part of the rotating blade, a base including a slide surface and a supporting part, and a guide including a pole supported by the supporting part, and a guiding part having a guide surface substantially orthogonal to the slide surface. An interposition member can be disposed so as to interpose between the guide and a side end of the base. The distance between the rotating blade and the guide surface is adjustable by changing a position of the guide. The portable cutting tool includes a contact preventing unit is provided for regulating an adjustment range of the guide to prevent contact of the guide surface and the rotating blade when the guide is attached to the base with the interposition member removed.
    Type: Application
    Filed: June 28, 2006
    Publication date: May 3, 2007
    Inventor: Hirokazu Yoshida
  • Publication number: 20060250044
    Abstract: To provide an electrical tool in which a permanent magnet motor can be smoothly mounted without requiring excess working power and man-hour. In the portable electrical circular saw (electrical tool) in which a commutator motor (permanent magnet motor) is mounted in a motor case (housing) which is integrally formed in a tube shape, the commutator motor includes a stator fixed to an inner circumferential surface of the motor case and a rotor which is rotatably disposed in the stator, and a plate having a plurality of protrusions is disposed on at least one of the both axial ends of a rotor core of the rotor, an outer diameter of at least two protrusions of the plate is larger than an outer diameter of the rotor core and smaller than an inner diameter of the stator.
    Type: Application
    Filed: April 11, 2006
    Publication date: November 9, 2006
    Inventors: Tomoyoshi Yokota, Hirokazu Yoshida, Satoru Gungi
  • Publication number: 20060213067
    Abstract: In a portable electric circular saw (portable cutting tool) including a cutting tool body having a motor serving as a driving source and a saw blade (cutting tool) driven to rotate by the motor and a base guiding the cutting tool body along a surface of a material to be cut, and allowing a parallel ruler to be mounted on the base, guide bars respectively inserted through insertion holes formed in the base are provided with a dust guard that can slide parallel to an end face of the saw blade and can abut against the end face of the saw blade.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 28, 2006
    Inventor: Hirokazu Yoshida
  • Patent number: 7053416
    Abstract: A highly reliable LED display apparatus is provided in which dust and other similar particles are prevented from entering spaces formed between light-emitting diodes and openings in a mask member provided on a circuit board. The LED display apparatus has the circuit board, the light-emitting diodes provided at predetermined positions thereon, and the mask member which is disposed approximately parallel to the circuit board. The mask member has openings at positions corresponding to the light-emitting diodes which are placed inside the respective openings. In the LED display apparatus described above, the openings of the mask member have fine projections on side surfaces thereof. The fine projections can be formed on the mask member by a flock processing technique.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: May 30, 2006
    Assignee: Nichia Corporation
    Inventors: Tsuyoshi Yasuoka, Hirokazu Yoshida
  • Patent number: 7005741
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: February 28, 2006
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Atsushi Ono, Yasunori Chikawa, Makoto Kanda, Norimitsu Nie, Satoru Tone, Motoji Shiota, Akio Inohara, Hirokazu Yoshida
  • Publication number: 20050278961
    Abstract: A portable cutting tool includes a saw blade for cutting a workpiece, a cutting tool main body having a motor for driving to rotate the saw blade, a base for guiding the cutting tool main body along a surface of the workpiece, and an inclining mechanism for inclining the base by pivoting the base centering on a support shaft of the cutting tool main body. The inclining mechanism includes a first circular arc member provided to be contiguous to at least one of a front end portion and a rear end portion of the base, pivoted along with the base centering on the support shaft and having a first guide hole in a circular arc shape penetrated in a radius direction thereof, and includes a fixing unit for fixing a position of pivoting the base relative to the cutting tool at an arbitrary position the first guide hole.
    Type: Application
    Filed: June 17, 2005
    Publication date: December 22, 2005
    Applicant: Hitachi Koki Co., Ltd.
    Inventors: Kenji Niwa, Hirokazu Yoshida
  • Patent number: 6933607
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: August 23, 2005
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Atsushi Ono, Yasunori Chikawa, Makoto Kanda, Norimitsu Nie, Satoru Tone, Motoji Shiota, Akio Inohara, Hirokazu Yoshida
  • Publication number: 20050123770
    Abstract: The present invention aims to give a two package curing type polyurethane coating composition which can form a film having soft, wet and dry feelings simultaneously and which maintain general properties of a coating composition such as the designing property, film strength, resistance to scratching, discoloration resistance, pot life, resistance to stains with fats and oils, and the like and to provide a coated article with such a two package curing type polyurethane coating composition.
    Type: Application
    Filed: November 4, 2004
    Publication date: June 9, 2005
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, NIPPON BEE CHEMICAL CO., LTD.
    Inventors: Kenji Kawazu, Mika Kai, Hirokazu Yoshida, Yasuhiro Nakano
  • Patent number: 6885984
    Abstract: An apparatus for aiding a machinist in preparing a machining program. A machining simulator simulates a basic machining program. Values of machining variables are obtained during the simulation and stored in a simulation result data memory. A spindle load determiner, a cutting speed determiner, and a rotating speed determiner analyze the machining variable values of a certain machining process to determine the machining efficiency of that process. A navigation information memory stores a plurality of messages for giving advice on how to change the cutting conditions. A message, which depends on the analysis of the machining variable values, is selected from the memory and is shown on a display. Accordingly, an operator can easily modify the basic machining program by following the message on the display, even if the operator does not have much knowledge or experience.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: April 26, 2005
    Assignee: Yamazaki Mazak Kabushiki Kaisha
    Inventors: Kenji Suzuki, Toshiyuki Muraki, Makoto Tanahashi, Hirokazu Yoshida