Patents by Inventor Hirokazu Yoshida

Hirokazu Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040238834
    Abstract: A highly reliable LED display apparatus is provided in which dust and other similar particles are prevented from entering spaces formed between light-emitting diodes and openings in a mask member provided on a circuit board. The LED display apparatus has the circuit board, the light-emitting diodes provided at predetermined positions thereon, and the mask member which is disposed approximately parallel to the circuit board. The mask member has openings at positions corresponding to the light-emitting diodes which are placed inside the respective openings. In the LED display apparatus described above, the openings of the mask member have fine projections on side surfaces thereof. The fine projections can be formed on the mask member by a flock processing technique.
    Type: Application
    Filed: June 1, 2004
    Publication date: December 2, 2004
    Inventors: Tsuyoshi Yasuoka, Hirokazu Yoshida
  • Publication number: 20030067072
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
    Type: Application
    Filed: October 30, 2002
    Publication date: April 10, 2003
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Atsushi Ono, Yasunori Chikawa, Makoto Kanda, Norimitsu Nie, Satoru Tone, Motoji Shiota, Akio Inohara, Hirokazu Yoshida
  • Publication number: 20030062623
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
    Type: Application
    Filed: October 29, 2002
    Publication date: April 3, 2003
    Applicant: Sharp Kabushiki Kaisha
    Inventors: Atsushi Ono, Yasunori Chikawa, Makoto Kanda, Norimitsu Nie, Satoru Tone, Motoji Shiota, Akio Inohara, Hirokazu Yoshida
  • Patent number: 6525422
    Abstract: A semiconductor device includes a semiconductor substrate, a plurality of electrode pads aligned on the semiconductor substrate, and a plurality of bump electrodes placed on each electrode pad, wherein the plurality of bump electrodes on the electrode pad are aligned in a direction orthogonal to a direction where the electrode pads are aligned. A manufacturing method of the semiconductor device includes the steps of patterning a photoresist which serves as a bump electrode forming use mask on the semiconductor substrate having formed thereon the electrode pads and forming a bump electrode in a perpendicular straight wall shape to be thinner than the photoresist by plating the bump electrode forming use metal to the electrode pad.
    Type: Grant
    Filed: December 11, 1997
    Date of Patent: February 25, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Atsushi Ono, Yasunori Chikawa, Makoto Kanda, Norimitsu Nie, Satoru Tone, Motoji Shiota, Akio Inohara, Hirokazu Yoshida
  • Publication number: 20020131450
    Abstract: A pseudo-random pattern transmission apparatus which has software processing means 1, storage means 2 for storing a pseudo-random pattern, transmission memory 3 for storing a plurality of packets comprising the pseudo-random pattern inserted in sequence into payload parts of a continuous frame of digital signal, an idle sending processing section 4 for calculating the number of inserted idle bytes calculated in response to the specified transmission rate of the digital signal, and transmission control means 6 for alternately executing transmission of a plurality of packets from the transmission memory and transmission of idle bytes from the idle sending processing section to a digital line 7.
    Type: Application
    Filed: February 21, 2002
    Publication date: September 19, 2002
    Inventor: Hirokazu Yoshida
  • Patent number: 6448792
    Abstract: The edge portion of an electro-conductive material inserted between a pair of the transmitting electrodes of triangular plate disposed flatly in opposite directions each other and the receiving electrode. The exciting signal source applies respectively the alternating voltage signal S1 with frequency f1 on one of the transmitting electrodes and the alternating voltage signal S2 with frequency f2 on the other transmitting electrode. The insertion extent of the strip edge of the electro-conductive material is evaluated with the ratio between the current I1 with frequency f1 and the current I2 with frequency f2 generated on the receiving electrode.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: September 10, 2002
    Assignee: Nireco Corporation
    Inventors: Hirokazu Yoshida, Akira Shimotori
  • Patent number: 6206147
    Abstract: In a disc brake of the type in which the outer pad is directly supported by the pawls 1a and 1b of the caliper 1 in a manner that the protrusions 5b and 5c of the back plate 5a of the outer pad 5 are put in engagement with the engaging parts 1c and 1d of the pawls of the caliper 1, the protrusions 5b and 5c of the back plate 5a of the outer pad 5 and the engaging parts 1c and 1d of the pawls of the caliper are located on the radially inner side of the surface pressure center C of the outer pad 5.
    Type: Grant
    Filed: October 6, 1997
    Date of Patent: March 27, 2001
    Assignee: Akebono Brake Industry Co., Ltd.
    Inventors: Hirokazu Yoshida, Seiya Odaka, Shinji Aoyagi
  • Patent number: 6182801
    Abstract: In the pushing anchor type disc brake device, reduction of noise and prevention of uneven wear can be accomplished especially in the brake device in which brake torque of the outer pad is transmitted via the caliper. In the disc brake device, the caliper is guided by a pair of guide pins composed of a main pin and a sub-pin. In order to transmit the brake torque of the outer pad via the caliper and the main pin, the back plate of the outer pad and the caliper are engaged with each other by engaging a protrusion with a recess, wherein the engagement is conducted at a plurality of portions in the circumferential direction of the rotor, so that the brake torque can be transmitted from the outer pad to the caliper. The main pin is arranged on the rotor run-out side, so that a pushing anchor structure can be formed. A pair of guide pins and guide holes of the support member which engage with the pair of guide pins stride the rotor and extend exceeding a facing section where the rotor faces the outer pad.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: February 6, 2001
    Assignee: Akebono Brake Industry Co., Ltd.
    Inventors: Hirokazu Yoshida, Kazuyuki Shibayama, Seiya Odaka
  • Patent number: 6111628
    Abstract: A liquid crystal display device according to the present invention includes a substrate provided with a line pattern, and a circuit element electrically connected to the line pattern via a conductive layer. The line pattern has at least one bonding pad. The circuit element has at least one electrode pad. The at least one electrode pad has a plurality of bump electrodes provided thereon. The at least one electrode pad is electrically connected to the at least one bonding pad via the conductive layer which is provided between the plurality of bump electrodes and the bonding pad facing the plurality of bump electrodes, where the conductive layer is an insulative material having conductive particles dispersed throughout.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: August 29, 2000
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Motoji Shiota, Kiyoshi Inada, Hirokazu Yoshida
  • Patent number: 5890566
    Abstract: A lining is attached on a front surface of a back plate and a protrusion for the engagement with a caliper is formed on a back surface of the back plate, and a recess is formed at a tip end of the protrusion and the cross-sectional view of the protrusion is H-shaped.
    Type: Grant
    Filed: March 19, 1997
    Date of Patent: April 6, 1999
    Assignee: Akebono Brake Industry Co., Ltd.
    Inventors: Hirokazu Yoshida, Seiya Odaka
  • Patent number: 5609479
    Abstract: A forced compression type pump including a cylindrically shaped pump case, an eccentric rotating body shaft-supported on said pump case at an eccentric position relative to said pump case and a compressing and forcibly sending member movable in a radial direction or said eccentric rotating body and adapted to be brought into press contact with the interior wall of said pump case, characterized in that the interior space is formed at the central part of said eccentric rotating body, a plurality of guide grooves are formed in a radial direction from said interior space to the circumferential surface of said eccentric rotating body, a plurality of circumferentially contacting cylindrical body inserted in said guide grooves and movable freely in a radial direction are formed, said plurality of circumferential contacting cylindrical body are in a planetary relationship relative to said central cylindrical body and the outer circumferential surfaces of said circumferentially contacting bodies are brought into press
    Type: Grant
    Filed: August 30, 1995
    Date of Patent: March 11, 1997
    Assignee: Japan I.D. Tech. Inc.
    Inventor: Hirokazu Yoshida
  • Patent number: 5608559
    Abstract: A display board has wirings on a surface thereof for transmitting a signal received from outside at a peripheral portion of the display board to a display area of the display board. Each wiring has a first conductive film formed of a first material and disposed on the surface of the display board, a second conductive film which is formed of a second material satisfying a condition that a surface of the second conductive film is less prone to oxidation than a surface of the first conductive film and which is disposed on a part of the first conductive film, and a transparent conductive film which is an oxide film and which is disposed on at least the second conductive film. Those first conductive film, second conductive film and transparent film constitute a three-layered structure portion of the wiring.
    Type: Grant
    Filed: December 6, 1994
    Date of Patent: March 4, 1997
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Kiyoshi Inada, Motoji Shiota, Hirokazu Yoshida, Yasunobu Tagusa
  • Patent number: 5576869
    Abstract: An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring including portions of Mo or Mo alloy to which bumps of an integrated circuit such as LSI is bonded with conductive paste.
    Type: Grant
    Filed: May 3, 1995
    Date of Patent: November 19, 1996
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Hirokazu Yoshida
  • Patent number: 5500787
    Abstract: An electrode wiring on a mounting substrate adapted for use in liquid crystal display apparatus, the electrode wiring including portions of Mo or Mo alloy to which bumps of an integrated circuit such as LSI is bonded with conductive paste.
    Type: Grant
    Filed: July 29, 1993
    Date of Patent: March 19, 1996
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Hirokazu Yoshida
  • Patent number: 5499090
    Abstract: An image forming apparatus has a toner recycling mechanism for effecting toner recycling. The image forming apparatus includes a developing unit accommodating developer for developing an electrostatic latent image formed on the surface of a photosensitive member, a cleaning unit for recovering developer remaining on the surface of the photosensitive member after development, and a toner recycling assembly. The toner recycling assembly includes a developer conveyor pipe through which the developer recovered by the cleaning unit is conveyed to the developing unit for recycling of toner contained in the developer, and also includes a developer supply or transport pipe for supplying the developer accommodated in the developing unit to either the developer conveyor pipe or the cleaning unit.
    Type: Grant
    Filed: June 10, 1993
    Date of Patent: March 12, 1996
    Assignee: Minolta Camera Kabushiki Kaisha
    Inventors: Noboru Ito, Hiroshi Murasaki, Hirokazu Yoshida, Fumio Masuda
  • Patent number: 5481101
    Abstract: To simplify a data reading apparatus for two-dimensional code data, a line sensor detection unit (30) for reading two-dimensional data includes an optical fiber band cable (3) bundling multiple optical fibers (31) of specified diameter in a band, and an upper end of the fibers is connected to a line sensor element (2) unit incorporated in the reading apparatus (S), and a lower end of the fibers is disposed opposite to an opening (11) of a specified size in the region of one or more two-dimensional code data in the bottom of the reading apparatus (S). The line sensor detection unit (3) including the optical fiber band cable (3) is disposed reciprocally parallel along the surface to be detected in an orthogonal direction, and the line sensor detection unit (30) is set movable within the range of the opening (11). A detection unit moving device (4) is disposed so as to read the two-dimensional code data.
    Type: Grant
    Filed: December 10, 1993
    Date of Patent: January 2, 1996
    Assignee: Teiryo Sangyo Co., Ltd.
    Inventor: Hirokazu Yoshida
  • Patent number: 5476558
    Abstract: An apparatus for forming paper blocks installable in offices to form paper blocks out of office-use paper such as computer printer paper, etc. including a treatment chamber, paper feeder and an adhesive apply device. Used and waste paper is fed into the treatment chamber by the paper feeder while being coated with adhesives by the adhesive apply device, and inside the treatment chamber, the paper with the adhesives coated thereon are pressed by a pusher or by air against the bottom of the chamber, thus forming firm paper blocks solidified by the adhesives.
    Type: Grant
    Filed: October 11, 1994
    Date of Patent: December 19, 1995
    Inventor: Hirokazu Yoshida
  • Patent number: 5410620
    Abstract: A system and method for locating and reading digital data in data regions within a data field disposed on a surface of an object to be identified include the capability of compensating for optical or physical distortions of the data field as viewed by an optical reader. The data field is defined by X-axis and Y-axis intersecting basic lines disposed at a predetermined angle with respect to each other and a corner mark disposed on the opposite side of the data field from those basic lines. A plurality of positions marks for marking predetermined distances between a plurality of imaginary X and Y axis internal lines are also provided. The positions of the imaginary X-axis internal lines within the data field are determinable from their spacings and angles with respect to the Y-axis basic line. The positions of the imaginary Y-axis internal lines are determinable from their spacings and their angles with respect to the X-axis basic line.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: April 25, 1995
    Assignee: Teiryo Sangyo Co., Ltd.
    Inventor: Hirokazu Yoshida
  • Patent number: 5408543
    Abstract: A system and method for locating and reading digital data in data regions within a data field disposed on a surface of an object to be identified include the capability of compensating for optical or physical distortions of the data field as viewed by an optical reader. The data field is defined by X-axis and Y-axis intersecting basic lines disposed at a predetermined angle with respect to each other and a corner mark disposed on the opposite side of the data field from those basic lines. A plurality of positions marks for marking predetermined distances between a plurality of imaginary X and Y axis internal lines are also provided. The positions of the imaginary X-axis internal lines within the data field are determinable from their spacings and angles with respect to the Y-axis basic line. The positions of the imaginary Y-axis internal lines are determinable from their spacings and their angles with respect to the X-axis basic line.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: April 18, 1995
    Assignee: Teiryo Sangyo Co., Ltd.
    Inventor: Hirokazu Yoshida
  • Patent number: 5343031
    Abstract: A method for decoding and processing at high speed by reading two-dimensional code symbol marks by a code reader in a small memory capacity. The X-axis side indication line 4 or Y-axis side indication line 5 in an information area 8 recording the code symbol mark 2 is read by the code reader 3, and division marks 7 recorded on the X-axis side indication line 4 or Y-axis side indication line 5 are detected. At every interval of dividing the division marks 7 in the Y-axis direction or X-axis direction by a specific integer value, the code mark 9 of the binary signal recorded in the information are 8 is sequentially read by the code reader 3 up to an end part of the Y-axis side indication line 5 or the X-axis side indication line 4 and the region formed in each square, of which one side is the interval of the division mark 7 is read by the code reader 3, or the length between the division codes divided by an integer value is processed, thereby decoding the code symbol mark 2.
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: August 30, 1994
    Assignee: Teiryo Sangyo Co., Ltd.
    Inventor: Hirokazu Yoshida