Patents by Inventor Hiroshi Hozoji

Hiroshi Hozoji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190221489
    Abstract: In order to address the problem in that, by increasing the gate resistance of a power semiconductor element, while variation of switching time can be controlled, loss due to the gate resistance becomes larger and power efficiency for the entire system is lowered, the present invention provides an insulating substrate capable of uniformizing switching speeds of circuit elements while suppressing influence on power efficiency of the circuit elements. In the insulating substrate according to the present invention, part of a wiring layer is formed as a control signal circuit layer, and part of the control signal circuit layer is formed as a resistance layer that increases input resistance when the circuit element receives a control signal.
    Type: Application
    Filed: August 9, 2017
    Publication date: July 18, 2019
    Applicant: HITACHI METALS, LTD.
    Inventors: Hiroshi HOZOJI, Kenji HAYASHI, Hiroyuki ITOH, Hisayuki IMAMURA, Hiroyuki NAGATOMO
  • Patent number: 10348214
    Abstract: A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: July 9, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
  • Publication number: 20180005748
    Abstract: An object is to improve a core and heat radiation properties from the coil, and to reduce the size of a transformer. In order to attain the object described above, a transformer includes a bobbin wound around with a coil, a columnar core center portion in which the bobbin is mounted, and a plurality of core leg portions joining both ends of the core center portion on the outside of the coil. The size of the core leg portion is larger than the size of the other core leg portions, and the core leg portion includes a flat outer circumferential surface approximately parallel to a surface which is tangent to an outer circumferential side surface of the coil. The transformer is disposed in a housing such that the outer circumferential surface of the core leg portion is tangent to a floor surface of the housing.
    Type: Application
    Filed: February 5, 2016
    Publication date: January 4, 2018
    Applicant: HITACHI, LTD.
    Inventor: Hiroshi HOZOJI
  • Publication number: 20170302191
    Abstract: A power converter device includes a double-sided electrode module in which an electrical wiring board and a power semiconductor element are molded with a resin material. The power converter device also includes a heat dissipating base disposed on both sides of the double-sided electrode module and directly contacting cooling medium. The power converter device also includes a module fixture which presses the heat dissipating base in a state of contact with the heat dissipating base. The module fixture is configured to support a circuit board.
    Type: Application
    Filed: June 28, 2017
    Publication date: October 19, 2017
    Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
  • Patent number: 9729076
    Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: August 8, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
  • Publication number: 20160308456
    Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base, and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.
    Type: Application
    Filed: June 28, 2016
    Publication date: October 20, 2016
    Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
  • Patent number: 9407163
    Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: August 2, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
  • Patent number: 9373558
    Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: June 21, 2016
    Assignee: HITACHI, LTD.
    Inventors: Nobutake Tsuyuno, Hiroshi Hozoji, Takashi Naito, Motomune Kodama, Masanori Miyagi, Takuya Aoyagi
  • Publication number: 20160149512
    Abstract: A power converter device includes a double-sided electrode module that converts direct current power to alternating current power, a heat dissipating base, a capacitor module, a positive electrode conductor plate, and a negative electrode conductor plate. In the heat dissipating base, heat dissipation surfaces, facing one another, of the double-sided electrode module facing to one another are held with insulation layers being present between the heat dissipating base and the heat dissipation surfaces. The capacitor module constitutes a smoothing circuit for inhibiting fluctuation in DC voltage. The positive electrode conductor plate and the negative electrode conductor plate transmit electric power between the capacitor module and the double-sided electrode module.
    Type: Application
    Filed: December 17, 2014
    Publication date: May 26, 2016
    Inventors: Kinya NAKATSU, Hiroshi HOZOJI, Takeshi TOKUYAMA, Yusuke TAKAGI, Toshiya SATOH, Taku OYAMA, Takanori NINOMIYA
  • Publication number: 20160005671
    Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.
    Type: Application
    Filed: February 22, 2013
    Publication date: January 7, 2016
    Applicant: HITACHI, LTD.
    Inventors: Nobutake TSUYUNO, Hiroshi HOZOJI, Takashi NAITO, Motomune KODAMA, Masanori MIYAGI, Takuya AOYAGI
  • Publication number: 20150221626
    Abstract: A power semiconductor module includes a heat sink; a circuit board connected to the heat sink via a bonding material and formed with a wiring on a front surface of an insulating substrate; a transistor device including a main electrode and a control electrode formed on one surface and a back surface electrode formed on the other surface, the back surface electrode being connected to the circuit board via a bonding material; a first conductive member bonded to the main electrode via a bonding material; and wire or ribbon-shaped connection terminals that electrically connect the first conductive member and the control electrode with another device or the circuit board, wherein the control electrode is disposed at a corner portion of the main electrode, and the first conductive member has a shape in which the first conductive member is cut out at a portion above the control electrode.
    Type: Application
    Filed: January 29, 2015
    Publication date: August 6, 2015
    Inventors: Shigehisa MOTOWAKI, Hiroshi HOZOJI, Toshiaki MORITA, Akitoyo KONNO
  • Patent number: 8975747
    Abstract: There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: March 10, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Takashi Ando, Ryoichi Kajiwara, Hiroshi Hozoji
  • Patent number: 8946567
    Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: February 3, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kinya Nakatsu, Hiroshi Hozoji, Takeshi Tokuyama, Yusuke Takagi, Toshiya Satoh, Taku Oyama, Takanori Ninomiya
  • Patent number: 8847374
    Abstract: A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes.
    Type: Grant
    Filed: September 5, 2011
    Date of Patent: September 30, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama, Akira Matsushita, Yusuke Takagi
  • Publication number: 20140264383
    Abstract: A semiconductor device includes a die pad, an SiC chip mounted on the die pad, a porous first sintered Ag layer bonding the die pad and the SiC chip, and a reinforcing resin portion covering a surface of the first sintered Ag layer and formed in a fillet shape. The semiconductor device further includes a source lead electrically connected to a source electrode of the SiC chip, a gate lead electrically connected to a gate electrode, a drain lead electrically connected to a drain electrode, and a sealing body which covers the SiC chip, the first sintered Ag layer, and a part of the die pad, and the reinforcing resin portion covers a part of a side surface of the SiC chip.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventors: Ryoichi KAJIWARA, Takuya NAKAJO, Katsuo ARAI, Yuichi YATO, Hiroi OKA, Hiroshi HOZOJI
  • Patent number: 8821676
    Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 ?m, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.
    Type: Grant
    Filed: May 3, 2011
    Date of Patent: September 2, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
  • Patent number: 8821768
    Abstract: It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 ?m and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: September 2, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Yusuke Yasuda, Toshiaki Morita, Eiichi Ide, Hiroshi Hozoji, Toshiaki Ishii
  • Publication number: 20140191399
    Abstract: There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.
    Type: Application
    Filed: August 13, 2012
    Publication date: July 10, 2014
    Inventors: Takashi Ando, Ryoichi Kajiwara, Hiroshi Hozoji
  • Patent number: 8723306
    Abstract: Heat radiation surfaces 7b and 8b of electrode lead frames 7 and 8 make thermal contact with heat radiation members 301 via insulation sheets 10 to dissipate heat from a power semiconductor element 5 to the heat radiation members (thick portions 301). Each of exposed areas of the heat radiation surfaces 7b and 8b and a surface 13b of a mold material (sealing material 13) adjacent to the exposed area produce an uneven step from which either one of the exposed area and the surface 13b adjacent to the exposed area projects. The step side surface formed between the convex surface and the concave surface of the uneven step has an inclined surface 7a or 13a so configured that an obtuse angle can be formed by the inclined surface and the convex surface and by the inclined surface and the concave surface for each.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: May 13, 2014
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Nobutake Tsuyuno, Hiroshi Hozoji, Toshiaki Ishii, Tokihito Suwa, Kinya Nakatsu, Takeshi Tokuyama, Junpei Kusukawa
  • Publication number: 20130175678
    Abstract: A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes.
    Type: Application
    Filed: September 5, 2011
    Publication date: July 11, 2013
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Shinji Hiramitsu, Hiroshi Hozoji, Nobutake Tsuyuno, Kinya Nakatsu, Takeshi Tokuyama, Akira Matsushita, Yusuke Takagi