Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.

Abstract: Disclosed is a candy wherein loss of a soft component contained therein is minimized, allowing the benefits of the soft component to be enjoyed, and a feeling of roughness in the mouth is reduced. Also disclosed is a method for manufacturing said candy. The disclosed candy (10) is provided with: a first region (20) containing a dispersion comprising a liquid dispersoid and an oil-based dispersion medium; and a second region (30) that at least partially encloses the first region (20) and comprises a hard candy composition that has been hardened. The disclosed method for manufacturing the candy comprises a procedure wherein the dispersion, which comprises the liquid dispersoid and the oil-based dispersion medium, is positioned in a melted hard candy composition and then said melted composition is hardened.

Abstract: An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.

Abstract: An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having a second wiring, a second pad for loading a second electronic component over the second insulating layer and a first via conductor electrically connecting the second land and the second wire. The first wiring and the second wiring electrically connect the first land and the second pad. The first land and second land are positioned such that a first electronic component is mounted over a second surface of the first insulating layer on the opposite side of the first surface. The second wiring has a longer wiring length and a greater thickness than the first wiring.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.

Abstract: A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring.

Abstract: A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate.

Abstract: There is provided a hybrid and/or complex material or the like which can realize a high-efficient photoelectric conversion material or the like. One aspect of the present invention lies in a dye-sensitized solar cell device 10, characterized by including: a first substrate 11; a first conductive layer 12 formed on the first substrate; a Pt catalyst layer formed on the first conductive layer; an electrolyte layer 13 formed on the Pt catalyst layer; a dye-adsorbed metal oxide layer 14 formed on the electrolyte layer in which 7,7,8,8-tetracyanoquinodimethane is adsorbed to an anatase type titanium oxide; a second conductive layer 15 formed on the dye-adsorbed metal oxide layer; and a second substrate 16 formed on the second conductive layer. According to this composition above, there is obtained a high-efficient dye-sensitized solar cell device in which light can be converted efficiently over wide wavelengths.

Abstract: A time zone start time point calculating unit calculates a time zone to be set in a VOBU in accordance with audio bit rate. A time zone comparing unit compares a time point at which an audio pack is to be multiplexed with the time zone calculated by the time zone start time point calculating unit. A flag setting unit sets whether the audio pack is to be completed or not in accordance with the result of comparison by the time zone comparing unit. Therefore, a completing process takes place before a VOBU boundary, and a completed PCK will not be generated immediately after the VOBU boundary. Thus, generation of a buffer overflow can be prevented.

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 ?m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract: A dough-like confectionery material contains a solid particulate, a liquid, and a diffusion controller. The dough-like confectionery material is an effective replacement for panned coatings, and it can be applied to an edible substrate, such as candy or chewing gum to form a layered confection. Methods and apparatus for forming layered confections are also described.

Abstract: An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion is formed inside the insulating layer or on the insulating layer. A first pad is configured to receive an electronic part, and is formed on an outermost insulating layer of the at least one insulating layer. A connection conductor is formed in the at least one insulating layer so as to electrically connect the conductor portion to the first pad.

Abstract: An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having a second wiring, a second pad for loading a second electronic component over the second insulating layer and a first via conductor electrically connecting the second land and the second wire. The first wiring and the second wiring electrically connect the first land and the second pad. The first land and second land are positioned such that a first electronic component is mounted over a second surface of the first insulating layer on the opposite side of the first surface. The second wiring has a longer wiring length and a greater thickness than the first wiring.

Abstract: An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.

Abstract: An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.

Abstract: It is an object of the invention is to provide a candy composition in which a sugar alcohol is used as a main raw material and which is comparable in intensity of sweetness and quality of sweetness to sugar as well as a candy manufactured using the same. The above object can be accomplished by providing a deliciously sweet candy composition which comprises sugar alcohol as a main raw material and comprises high sweetness intensity sweetener (E), flavoring components (A) maltol and (B) furaneol as essential components, each in an effective amount, and an effective amount of at least one component selected from among flavoring components (C) cyclotene and (D) menthyl acetate.

Abstract: A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.