Abstract: A throwaway insert enables reduction in cutting force and improves chip separation ability without sacrificing the strength of cutting edge thereof. An upper face of the throwaway insert is provided with an undulating portion, which is formed by alternately arranged concave portions and convex portions, so as to provide a wavy shape to the cutting edge. The undulating portion comprises four concave portions, i.e., a first deep-concave portion, a first shallow-concave portion, a second deep-concave portion, and a second shallow-concave portion. The first deep-concave portion and the second deep-concave portion are located so that effective cutting region of the cutting edge is divided into three portions having lengths substantially equal to each other, and the second deep-concave portion is made deeper than the first deep-concave portion.

Abstract: A rhombic cutting insert includes cutting edges merging with each other at a nose part disposed at a diagonal acute-angle corner of an upper face of the insert. The cutting edges each form convex-curved shapes and are each inclined with respect to a mounting face of the insert. The cutting edges each include linear sub-cutting-edges, disposed in the vicinity of the nose part, forming a substantially right angle therebetween. Rake faces are formed on the upper face of the insert and each have positive rake angles and twisted-inclined surfaces. The insert is mounted on a tool part. One cutting edge serves as a peripheral cutting edge having a sub-cutting-edge disposed substantially parallel to an axis of the tool part, and the other cutting edge serves as a facing cutting edge having a sub-cutting-edge disposed substantially perpendicular to the axis of the tool part.

Abstract: The present invention provides an indexable insert which can pare away the chip stably without increase of cutting resistance. With this insert, serrations are formed by arranging a plurality of groove portions and ridge portions alternatingly upon side ridge edge portions of the upper surface, with the exception of sloping surfaces which are formed at both end portions in the longitudinal directions of the upper surface. As a result, the cutting edges exhibit wavy shapes which are made up from this plurality of groove portions and ridge portions over the sloping surface, with the exception of these sloping surfaces. Furthermore, the groove portions and the ridge portions of the serrations are made as curved surfaces. This insert is fitted to a tool main body so that the groove portions and the ridge portions of the serrations extend perpendicular to the rotational axis of the tool.

Abstract: The present invention provides a circuit simulation method for a semiconductor device in which the circuit configuration is specified by a netlist. First, variations in the layout pattern and arrangement of elements used in the semiconductor device are formulated into an equation including parameters (S110). Next, the parameters included in the equation are put into element parameter groupings corresponding to each element, and the element parameter groupings are stored in storage means (S120). Then, the parameters in the element parameter groupings are varied in accordance with the conditions obtained from variations in manufacturing process with respect to the semiconductor device (S130). Then, these varied parameters are used to execute a circuit simulation with processing means (S140).

Abstract: In the tool for bore diameter work of the present invention, first and second chip restraining faces are provided opposite each other on a chip installation section, and have projecting V-shapes parallel to the longitudinal direction of a shank. The top and bottom faces of the chip have indented V-shapes in correspondence with the first and second chip restraining faces. When a clamp bolt is tightened, the first chip restraining face elastically changes shape toward the second chip restraining face, pressingly securing the chip in the shank. Therefore, the chip can be easily attached and removed, and high installation rigidity of the chip can be maintained.

Abstract: A semiconductor integrated circuit 10 includes a semiconductor substrate 1, an insulating layer 2 formed on the semiconductor substrate 1, and a bonding pad 3 formed on the insulating layer 2. The semiconductor substrate 1 has a region 4 facing the bonding pad 3 and a region 5 substantially surrounding at least a part of the region 4. The region 5 of the semiconductor substrate 1 is set substantially at an equipotential.

Abstract: In an interference fit type cutting tool according to the present invention, a projection 8 of an edge section 2 and a hole portion 10 of a shank section 3 are fitted by shrinkage fitting. The shank section 3 is provided with an insertion hole 14 that is coaxial with the center axis O2 thereof, and a threaded hole 14b is provided in a part thereof. A rodlike set screw 15 is in threaded engagement with the insertion hole 14, and a leading end portion 15a thereof can project into a space 13 between the projection 8 and the hole portion 10. By screwing the set screw 15 in to press an end face 8b of the projection 8 of the edge section 2 in a heated state, the edge section 2 can be detached from the shank section 3, and the edge section 2, the shank section 3, and the like can be replaced without causing the problem of waste oil disposal and without chipping the edge section 2 or the like.

Abstract: In an interference fit type cutting tool according to the present invention, a projection 8 of an edge section 2 and a hole portion 10 of a shank section 3 are fitted by shrinkage fitting. The shank section 3 is provided with an insertion hole 14 that is coaxial with the center axis O2 thereof, and a threaded hole 14b is provided in a part thereof. A rodlike set screw 15 is in threaded engagement with the insertion hole 14, and a leading end portion 15a thereof can project into a space 13 between the projection 8 and the hole portion 10. By screwing the set screw 15 in to press an end face 8b of the projection 8 of the edge section 2 in a heated state, the edge section 2 can be detached from the shank section 3, and the edge section 2, the shank section 3, and the like can be replaced without causing the problem of waste oil disposal and without chipping the edge section 2 or the like.

Abstract: A cutting tool including a tool holding portion and a tool. The tool is configured to be inserted into a hole of the tool holding portion. The tool includes a tool main body, a guide portion, and a shoulder portion. The tool maim body has a tool outer diameter larger than the hole inner diameter of the hole when the tool holding portion is not heated. The guide portion is coaxially connected to the tool main body and configured to position the tool substantially coaxially with respect to the tool holding portion. The guide portion has a guide outer diameter smaller than the hole inner diameter of the hole so that the guide portion is inserted into the hole. The shoulder portion is formed between the tool main body and the guide portion so as to sit on a surface around the hole to support the tool when the guide portion is inserted into the hole.

Abstract: A rhombic cutting insert includes a pair of cutting edges merging with each other at a nose part disposed at one of diagonal acute-angle corners of an upper face of the insert. The pair of cutting edges are individually formed in convex-curved shapes and are inclined to a mounting face of the insert from the nose part toward portions away from the nose part of the respective cutting edges. The pair of cutting edges individually include linear sub-cutting-edges disposed in the vicinity of the nose part, the sub-cutting-edges forming a substantially right angle therebetween. Rake faces formed on the upper face individually have positive rake angles and have twisted-inclined surfaces so that the rake faces become closer to the mounting face along the respective cutting edges from the nose part toward a region disposed along a diagonal line between obtuse-angle corners. The insert is mounted to a tool part so as to dispose the nose part at the periphery of an end of the tool part.

Abstract: In an interference fit type cutting tool according to the present invention, a head section and a shank section are fitted together by shrinkage fitting. The shank section is provided with a shaft portion and a taper portion. The head section is provided with a hole portion to be fitted on the shaft portion, and a tapered portion to be fitted on the taper portion. The hole portion and the tapered portion have an interference, and the inner diameters thereof are smaller than the outer diameters of the shaft portion and the taper portion. Two-surface restraint is established by fixing the shaft portion and the hole portion, and the taper portion and the tapered portion with the interference pressure by shrinkage fitting. A key is formed on the leading end face of the-shaft portion, a key groove is formed in the bottom face of the hole portion, and the key and the key groove are fitted together.

Abstract: In an interference fit type cutting tool according to the present invention, a head section and a shank section are fitted together by shrinkage fitting. The shank section is provided with a shaft portion and a taper portion. The head section is provided with a hole portion to be fitted on the shaft portion, and a tapered portion to be fitted on the taper portion. The hole portion and the tapered portion have an interference, and the inner diameters thereof are smaller than the outer diameters of the shaft portion and the taper portion. Two-surface restraint is established by fixing the shaft portion and the hole portion, and the taper portion and the tapered portion with the interference pressure by shrinkage fitting. A key is formed on the leading end face of the shaft portion, a key groove is formed in the bottom face of the hole portion, and the key and the key groove are fitted together.

Abstract: In an interference fit type cutting tool according to the present invention, a projection and a fitting projection are formed at the rear end of an edge section and at the leading end of a shank section, respectively. A connecting member is provided with first and second holes that have a predetermined interference with respect to the outer diameters of the projection and the fitting projection. The edge section and the shank section are fixed by interference fitting between the first hole and the projection, and between the second hole and the fitting projection. Chatter vibration is reduced by making the edge section and the shank section of a high-rigidity material having a lower coefficient of thermal expansion than that of the connecting member.

Abstract: A cutting tool for a machine tool including a tool body, at least one cutting edge and a cutting medium supplier. The tool body has one and another end portions along an axis thereof and is configured to be attached to a machine tool at the another end portions to be rotatable. At least one cutting edge is provided on the one end portion of the tool body. The cutting medium supplier supplies an atomized cutting fluid or a chilled gas to a place where a work is cut by the cutting edge.

Abstract: An evaluation pattern and an evaluation method of devices capable of measuring with precision the unit capacitance and specific precision of passive devices necessary in analog circuits on a single semiconductor substrate, unit capacitors in such a quantity to overcome the measuring error of measuring instruments, arranged in an array by nx pieces in the X direction (nx being a natural number) and ny pieces in the Y direction (ny being a natural number), are connected by wiring to be capable of measuring the sum of capacitances in each column at least in one of the array directions in the X and Y directions of the unit capacitors.

Abstract: In an active area surrounded with an isolation formed on a silicon substrate, a large number of unit cells are disposed in a matrix, and the unit cell together form one MOSFET. Each of the unit includes a ring gate electrode in the shape of a regular octagon, a drain region and a source region formed at the inside and outside of the gate electrode, respectively, two gate withdrawn wires extending from the gate electrode to area above the isolation, a substrate contact portion in which the surface of the substrate is exposed, and contacts for electrically connecting these elements with wires. These elements such as the ring gate electrode and the gate withdrawn wires are formed so as to attain a high frequency characteristic as good as possible. Thus a MOSFET for use in a high frequency signal device, the high frequency characteristic such as the minimum noise figure and the maximum oscillation frequency in particular can be totally improved.

Abstract: In a semiconductor apparatus having a PNP bipolar transistor and high voltage resistance, there is formed an oxide insulating layer in the surface region of a P-type semiconductor substrate. In the above semiconductor substrate is formed a P-type collector layer so that at least a part of the P-type collector layer is in contact with said oxide insulating layer. In the surface region of said P-type collector layer is formed a P-type collector contact layer. An N-type base layer is formed in that region on the surface side of said P-type collector layer in which said P-type collector contact layer does not exist. A P-type emitter layer is formed on the surface side of said N-type base layer.

Abstract: A cutting tool has a slidable cutting-blade chip 5A, in which a slider 7 is slidably mounted into a groove 6 formed in the cutting tool main body 1, to offset a pressing force applied to the bottom face 6c of the groove 6 through the slider 7, to prevent abrasion of the slider 7 and the groove 6 and uneven abrasion of serration grooves 7a and 8a of the slider 7 and a spacer 8, and to suppress backlash of the slider 7. A spacer 9 is detachably disposed between one side face 6a of a groove 6 and a slider 7, a plate 22 is disposed between another side face of the slider 7 and another side face 6b of the groove 6 so as to press the plate 22 toward the side face 6a. A protruding section 21 and a dent section 24 each have a V-shape cross-section and are formed on another side face of the slider 7 and on one side face of the plate 22, respectively, wherein the protruding section 21 and the dent section can come into contact with each other.

Abstract: Mounted on a single semiconductor substrate are a DRAM, MOS transistor, resistor, and capacitor. The gate electrode of the DRAM and the gate electrode of the MOS transistor are formed by a common layer (i.e., a first-level poly-Si layer). The storage electrode of the DRAM. the resistor, and the lower electrode of the capacitor are formed by a common layer (i.e., a third-level poly-Si layer). The plate electrode of the DRAM and the upper electrode of the capacitor are formed by a common layer (i.e., a fourth-level poly-Si layer).

Abstract: In a semiconductor apparatus having a PNP bipolar transistor and high voltage resistance, there is formed an oxide insulating layer in the surface region of a P-type semiconductor substrate. In the above semiconductor substrate is formed a P-type collector layer so that at least a part of the P-type collector layer is in contact with said oxide insulating layer. In the surface region of said P-type collector layer is formed a P-type collector contact layer. An N-type base layer is formed in that region on the surface side of said P-type collector layer in which said P-type collector contact layer does not exist. A P-type emitter layer is formed on the surface side of said N-type base layer.