Abstract: A flux for a resin flux cored solder or a flux coated solder, in which scattering of flux and solder in using the solder is suppressed, and a resin flux cored solder or a flux coated solder including such a flux are provided. The flux for a resin flux cored solder can include a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.

Abstract: Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The solder coated layer includes Sn as a main ingredient and 0 to 2 mass % of Ag, and coats the core. The solder coated layer has an average grain diameter of crystal grains of 3 ?m or less, and the solder material has a spherical diameter of 1 to 230 ?m and a sphericity of 0.95 or more.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: A solder ball includes 0.1% by mass or more and 10% by mass or less of In and a remainder of Sn. The ball has a yellowness (b*) in an L*a*b* color system of 2.8 or more and 15.0 or less and a lightness (L*) of 60 or more and 100 or less. The ball further includes at least one element selected from a group of 0% by mass or more and 4% by mass or less of Ag, 0% by mass or more and 1.0% by mass or less of Cu, 0% to 3% by mass in total of Bi and/or Sb, and 0% to 0.1% by mass in total of an element selected from a group of Ni, Co, Fe, Ge, and P, excluding a solder ball including 3% by mass of Ag, 0.5% by mass of Cu, 0.2% by mass of In and a remainder of Sn.

Abstract: The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 ?m or more to 1000 ?m or lower.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: Provided is a flux that is able to suppress any solder bridges even when it is applied to the narrow pitched electrodes such that the bridge occurs when using the past flux. The flux is characterized by containing 15% by mass or more and 35% by mass or less of polyoxyalkylene ethylenediamine, 2% by mass or more and 15% by mass or less of an organic acid, 10% by mass or more and 30% by mass or less of a base material, 3% by mass or more and 30% by mass or less of an amine and 20% by mass or more and 40% by mass or less of a solvent.

Abstract: A solder material capable of suppressing the occurrence of electromigration is provided. The solder material is core ball 1A which comprises spherical core 2A composed of Cu or a Cu alloy, and solder layer 3A coating core 2A, and wherein solder layer 3A has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % or less, a Ag content of 0 mass % or more and 4.5 mass % or less, and a Ni content of 0 mass % or more and 0.1 mass % or less, with Sn being the balance.

Abstract: A flux including: a) a phenolic activator except a hindered phenol, b) a resin, c) an organic acid, and d) a solvent. The phenolic activator, which is contained in the flux, has a molecular weight of 150 or more and 550 or less. Further, the flux may include: a) a phenolic activator except a hindered phenol and b) an acrylic resin.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: The Cu core ball contains a Cu ball and one or more metal layer for covering a surface of the Cu ball, each layer including one or more element selected from Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher and 99.9995% or lower, sphericity which is 0.95 or higher and a diameter of 1 ?m or more to 1000 ?m or lower.

Abstract: A Cu core ball contains a Cu ball and at least one metal layer for covering a surface of the Cu ball. The metal layer is made of at least one element selected from the group of Ni, Co, Fe and Pd. The Cu ball contains at least one element selected from a group of Fe, Ag and Ni in a total amount of 5.0 ppm by mass or more to 50.0 ppm by mass or lower, S in an amount of 0 ppm by mass or more to 1.0 ppm by mass or lower, P in an amount of 0 ppm by mass or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% by mass or higher to 99.9995% by mass or lower, and sphericity which is 0.95 or higher.

Abstract: The Cu core ball contains a Cu ball and a solder layer for covering a surface of the Cu ball. The Cu ball contains at least one element selected from Fe, Ag, and Ni in a total amount of 5.0 or more to 50.0 ppm by mass or lower, S in an amount of 0 or more to 1.0 ppm by mass or lower, P in an amount of 0 or more to less than 3.0 ppm by mass, and remainder of Cu and inevitable impurities. The Cu ball contains purity which is 99.995% or higher and 99.9995% by mass or lower, and sphericity which is 0.95 or higher. The solder layer includes Ag in an amount of more than 0 to 4.0% by mass or less, Cu in an amount of more than 0 to 3.0% by mass or less, and remainder of Sn.

Abstract: An object of the present invention is to provide a flux which does not precipitate a crystal and can improve solder wettability. A flux comprising 0.4 to 10.0 mass % of ditolylguanidine and 1.0 to 10.0 mass % of an organic acid, and not comprising diphenylguanidine as an amine compound.

Abstract: An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

Abstract: An object of the present invention is to provide a resin flux cored solder, or a flux coated solder, for which scattering of flux and solder in using the solder is suppressed, and a flux to be contained therein. A flux for a resin flux cored solder comprising a rosin resin, an activator, and at least one selected from an acrylic polymer and a vinyl ether polymer, which has a weight average molecular weight of 8000 to 100000, in an amount of 0.1 to 3 mass-% based on the total mass of the flux.

Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

Abstract: A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 ?m.

Abstract: Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.