Patents by Inventor Hiroyuki Fujita

Hiroyuki Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8005504
    Abstract: A wireless communication apparatus is provided. The wireless communication apparatus includes wireless communication functions conforming to incompatible first and second communication standards. The wireless communication apparatus includes a first transceiver that performs a wireless communication operation conforming to the first communication standard and includes a first transmission/reception port, a second transceiver that performs a wireless communication operation conforming to the second communication standard and includes a second transmission/reception port, a shared antenna shared by the first and the second transceivers, an antenna connecting unit that connects the shared antenna and the first and the second transmission/reception ports, and a control unit that controls the communication operations in the first and the second transceivers.
    Type: Grant
    Filed: November 15, 2006
    Date of Patent: August 23, 2011
    Assignee: Sony Corporation
    Inventors: Eiichi Sano, Hiroyuki Fujita
  • Publication number: 20110187027
    Abstract: A manufacturing method of a power transmission system molded product by infusing resin constituents prepared by adding an additive composed of a magnetic material to a molten resin into a cavity of a metallic mold and solidifying the resin constituents, wherein the additive composed of the magnetic material is oriented in a fixed direction by applying a magnetic field to a resin molded product infused into the metallic mold before solidification by a magnetic field orientation structure provided in the metallic mold.
    Type: Application
    Filed: September 23, 2010
    Publication date: August 4, 2011
    Applicant: SHOWA CORPORATION
    Inventors: Masanobu MIYAZAKI, Hiroyuki FUJITA, Shinichi SAKAIDA
  • Patent number: 7990165
    Abstract: To provide a contact probe which can easily be connected with a measurement apparatus electrically, can measure a high speed and high frequency signal with a fine pitch easily and correctly, and can easily cope with signal measurement for a plurality of channels, and a method of making the contact probe. It includes a first printed wiring board 3 having a signal electrode 10a and a ground electrode 10b used as a contact part with respect to a measuring object, in which the signal electrode 10a and ground electrode 10b are formed of a metal wiring pattern on a substrate, and a second printed wiring board 2 with a coaxial line structure having shield electrodes 12, 17, 18 which enclose a signal line 15a and the surroundings of the signal line 15a through an insulating layer.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: August 2, 2011
    Assignees: National Institute of Advanced Industrial Science and Technology, Kiyoto Manufacturing Co., TSS Corporation
    Inventors: Masahiro Aoyagi, Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shoichi Imai, Shigeo Kiyota
  • Patent number: 7985929
    Abstract: A circuit board and a method of manufacturing the same are provided. The circuit board includes: a multilayer board in which a plurality of conductive layers with desired patterns formed therein, and a plurality of insulating layers are stacked; a plurality of through holes penetrating the multilayer board; cylindrical recesses each formed around a through hole corresponding thereto, having a diameter larger than that of the through hole, having a depth from an outermost surface of the insulating layer to a surface of the conductive layer for electrical connection, and partially exposing the surface of the predetermined conductive layer; and a plurality of conductive terminals fitted into the through holes.
    Type: Grant
    Filed: August 30, 2007
    Date of Patent: July 26, 2011
    Assignees: Honda Motor Co., Ltd., Shinwa Frontech Corp.
    Inventors: Yasuto Watanabe, Hiroyuki Fujita, Kunio Watanabe
  • Patent number: 7924123
    Abstract: An electromagnetic relay has a solenoid formed from a wound coil, a movable contact-point block having a movable iron core, an insulation holder integrated with the upper end portion of the movable iron core and a movable contact piece which is biased toward and supported by the insulation holder through a contact pressing spring, and a fixed iron core fitted in a through hole in a yoke. A restoring spring is inserted into an axial hole of the solenoid. The movable iron core of the movable contact-point block is slidably inserted into the axial hole of the solenoid from thereabove. The fixed iron core is inserted into the axial hole from therebelow. The movable iron core is adapted to be slid into the axial hole based on the magnetization force and the demagnetization of the coil to move the movable contact-point block back and forth.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: April 12, 2011
    Assignee: OMRON Corporation
    Inventors: Keisuke Yano, Masayuki Noda, Hiroshi Ono, Hiroyuki Fujita
  • Patent number: 7911304
    Abstract: An electromagnetic relay has a movable iron core, an insulation holder integrated with an upper end portion of the movable iron core, a movable contact piece supported by the insulation holder, and a solenoid formed from a wound coil. The movable iron core is housed in an axial hole in the solenoid movably in the upward and downward directions. The movable iron core is adapted to be moved upwardly and downwardly based on magnetization and demagnetization of the solenoid for contacting and separating a movable contact point provided on the movable contact piece with and from a fixed contact point for opening and closing a contact point. A permanent magnet is embedded in a base portion of the insulation holder.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: March 22, 2011
    Assignee: OMRON Corporation
    Inventors: Keisuke Yano, Masayuki Noda, Hiroshi Ono, Hiroyuki Fujita
  • Patent number: 7911301
    Abstract: An electromagnetic relay has a solenoid formed from a wound coil, a movable iron core that is reciprocated upwardly and downwardly in an axial hole of the solenoid, and a movable contact point that reciprocates together with the movable iron core. The movable contact point is contacted and separated with and from a fixed contact point for opening and closing a contact point. An arc generated at a time of opening and closing of the contact point is flowed, in a predetermined direction, by the magnetic field of at least a single permanent magnet placed at a side of the fixed contact point and the movable contact point that are contacted and separated with and from each other. Coil terminals are connected to leader lines of the coil, at least at a single side of the flow of the arc.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: March 22, 2011
    Assignee: OMRON Corporation
    Inventors: Keisuke Yano, Masayuki Noda, Hiroshi Ono, Hiroyuki Fujita
  • Publication number: 20110021695
    Abstract: A urethane (meth)acrylate composition includes a product of a reaction of a polyester polyol made from a polycarboxylic acid and a polyhydric alcohol, a polyisocyanate, and an active hydrogen-containing (meth)acrylate. Part of the polyhydric alcohol is a diol having a straight chain of 3 to 7 carbon atoms and a side chain on the straight chain. The polyisocyanate includes at least one of hexamethylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, and tetramethylene diisocyanate.
    Type: Application
    Filed: September 29, 2010
    Publication date: January 27, 2011
    Applicants: HITACHI KASEI POLYMER CO., LTD., NHK SPRING CO., LTD.
    Inventors: Kouichi Akiyama, Norihiro Fukuta, Masanori Sukenobu, Souichirou Komiya, Hiroyuki Fujita, Kenji Horie, Takako Oyama, Noriyuki Sera, Hisayoshi Makabe
  • Publication number: 20110000621
    Abstract: The present invention is to provide a tack labeler capable of automatically adhering this type of tack labels without using release papers to articles to be adhered.
    Type: Application
    Filed: February 26, 2009
    Publication date: January 6, 2011
    Applicant: FUJI SEAL INTERNATIONAL, INC.
    Inventors: Masahide Ikeda, Toshiya Yamada, Hiroshi Sugimoto, Hiroyuki Fujita, Akihiko Fujihira
  • Patent number: 7825755
    Abstract: A semiconductor substrate; a cantilever which is formed on the semiconductor substrate so as to face the semiconductor substrate with an air layer therebetween, the cantilever being made from an electrically conductive material or a semiconductor material, and the cantilever being mechanically movable; a photodiode which is formed so as to be connected in parallel to a capacitance that is constituted from the cantilever and the semiconductor substrate, and the photodiode being formed between an anchor portion which is a portion of the cantilever and the semiconductor substrate; and a power source which supplies voltage via a resistance on a side of the cantilever which is a connection point of a parallel circuit including both the capacitance and the photodiode so as to be backward bias to the photodiode, are included.
    Type: Grant
    Filed: April 7, 2005
    Date of Patent: November 2, 2010
    Assignee: The Foundation for the Promotion of Industrial Science
    Inventors: Hiroshi Toshiyoshi, Hiroyuki Fujita, Yuko Yamauchi, Akio Higo, Kuniyuki Kakushima
  • Patent number: 7821402
    Abstract: An RFID tag for use with an MRI machine has an integrated circuit and structure for protecting it from damage when exposed to an intense MRI RF transmitter field. The structure for protecting the integrated circuit may include a controllable low impedance device coupled across the integrated circuit, a controllable high impedance device coupled in series with the integrated circuit, and/or frequency selective RF filter.
    Type: Grant
    Filed: May 5, 2006
    Date of Patent: October 26, 2010
    Assignee: Quality ElectroDynamics
    Inventors: Xiaoyu Yang, Hiroyuki Fujita, Tsinghua Zheng
  • Patent number: 7767987
    Abstract: There are provided an electron beam application method and an electron beam application device capable of uniformly applying electron beams to an object even if the electron beams have a low energy. For this, electron beams (EB) are applied to a beverage container (30) (object) within a magnetic barrier (MF) formed by combining a plurality of magnetic fields generated in an electron beam application region.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: August 3, 2010
    Assignee: Japan AE Power Systems Corporation
    Inventors: Shiro Eguchi, Isao Hashimoto, Shigekatsu Sato, Hidenobu Koide, Nobuyuki Hashimoto, Takayuki Suzuki, Satoru Gozaki, Tomoyuki Hikosaka, Yukio Okamoto, Hiroyuki Fujita
  • Publication number: 20100163919
    Abstract: Provided is a lighting device which includes a lead frame embedded in a glass material and has high reliability. The lighting device has a structure in which a light emitting element is mounted in a recess portion formed on a surface of a glass substrate and a sealing material is provided to cover the light emitting element. The lead frame is embedded in the glass substrate so as to be exposed on a side surface of the glass substrate and a bottom surface of the recess portion. A portion of the lead frame which is exposed in the recess portion is electrically connected with the light emitting element. With the structure as described above, the durability of the lighting device is improved.
    Type: Application
    Filed: December 15, 2009
    Publication date: July 1, 2010
    Inventors: Hitoshi Kamamori, Sadao Oku, Hiroyuki Fujita, Keiichiro Hayashi
  • Patent number: D616434
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: May 25, 2010
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Fujita, Sho Sakai
  • Patent number: D622269
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: August 24, 2010
    Assignee: Fujitsu Limited
    Inventors: Hisao Morooka, Hiroyuki Fujita
  • Patent number: D628995
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: December 14, 2010
    Assignee: Fujitsu Limited
    Inventors: Nobuharu Masuyama, Hiroyuki Fujita, Yukihiro Noda
  • Patent number: D628996
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: December 14, 2010
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Fujita, Kohei Okamoto
  • Patent number: D630626
    Type: Grant
    Filed: February 2, 2010
    Date of Patent: January 11, 2011
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Fujita, Eiji Nagao, Sho Sakai
  • Patent number: D630627
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: January 11, 2011
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Fujita, Kohei Okamoto, Daisuke Yamagishi
  • Patent number: D631039
    Type: Grant
    Filed: March 1, 2010
    Date of Patent: January 18, 2011
    Assignee: Fujitsu Limited
    Inventors: Sho Sakai, Hiroyuki Fujita