Abstract: A temporary bonding arrangement for wafer processing is provided comprising a first temporary bond layer (A) of thermoplastic resin, a second temporary bond layer (B) of thermosetting siloxane polymer, and a third temporary bond layer (C) of thermosetting polymer. Layer (B) is cured with a curing catalyst contained in layer (A) which is laid contiguous to layer (B). An adhesive layer of uniform thickness is formed without insufficient step coverage and other failures.

Abstract: A manufacturing method for a stator winding coil includes: a bulging portion forming step that forms a bulging portion on a conductor wire; a crank portion forming step that forms a crank portion on the central portion of the bulging portion; an oblique portion forming step that forms oblique portions on the conductor wire at two ends of the bulging portion; a rectilinear portion forming step that forms rectilinear portions on the conductor wire at opposite ends of the oblique portions from the bulging portion; and a circular arc forming step that forms the oblique portions into a circular arc shape after forming the rectilinear portions.

Abstract: A wafer processing laminate, a wafer processing member, a temporary adhering material for processing wafer, and a method for manufacturing a thin wafer using the same. The wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed. The temporary adhesive material layer includes a first temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A) releasably adhered on a surface of the wafer, a second temporary adhesive layer of a radiation curable polymer layer (B) laminated on the first temporary adhesive layer, and a third temporary adhesive layer of a thermoplastic organopolysiloxane polymer layer (A?) laminated on the second temporary adhesive layer and releasably adhered to the support.

Abstract: The purpose of the present invention is to provide an adhesive composition using a silicone polymer compound, which does not require exposure, baking and development processes for the production, thereby making the production cost low and making the productivity high, which has good characteristics such as good adhesiveness, good hermetic sealing properties after thermal curing and low moisture absorption that are required for adhesives, which provides a cured film having high reliabilities such as high heat resistance and high light resistance, and which is capable of suppressing warping of a bonded substrate after back grinding that is necessary in the three-dimensional mounting production.

Abstract: A temporary bonding adhesive composition includes a first compound including a thermosetting polyorganosiloxane and a second compound including a thermoplastic polyorganosiloxane.

Abstract: A mass spectrometry is equipped with a liquid specimen supply part which supplies a liquid specimen sandwiched between bubbles, an ion source part ionizes the specimen, and a mass spectrometry part which detects ions separated in accordance with mass. In particular the ion source part is configured so as to include a liquid supply tube for transporting a specimen from the liquid specimen supply part, a degassing/liquid retention part in which bubbles are removed, a spraying part which ionizes the specimen, and a high-voltage power supply part which applies a high voltage to the spraying part. The device is further characterized in that after removing the bubbles, a Taylor cone is formed from the resultant pre-solution, and the specimen is ionized thereafter. Thus, the ionization of an intended specimen is stabilized, and the measurement reproducibility is improved.

Abstract: A supporting unit structure of a vehicle seat includes: a rubber elastic body; a seat-connected member; and a floor-connected member. An inner peripheral portion of the rubber elastic body is fastened to either one of the seat-connected member or the floor-connected member by a fastening member that penetrates the inner peripheral portion, and an outer peripheral portion of the rubber elastic body is fastened to the other one of the seat-connected member or the floor-connected member. The other one of the seat-connected member or the floor-connected member is provided with a stopper portion that abuts the fastening member in a radial direction of the fastening member when the seat-connected member and the floor-connected member are relatively displaced by more than a predetermined distance.

Abstract: A method for temporarily bonding a wafer to a support via a temporary bonding arrangement is provided. The arrangement is a composite temporary adhesive layer consisting of a non-silicone thermoplastic resin layer (A) which is releasably bonded to the wafer, a thermosetting siloxane polymer layer (B) laid thereon, and a thermosetting siloxane-modified polymer layer (C) releasably bonded to the support. The method comprises the steps of providing a wafer laminate having a thermosetting silicone composition layer (B?) formed on the resin layer (A) which has been formed on the wafer, providing a support laminate having a siloxane-containing composition layer (C?) formed on the support, joining and heating layer (B?) and layer (C?) in vacuum for bonding and curing the layers together.

Abstract: Temporary adhesive material for wafer processing, the temporary adhesive material being used for temporarily bonding support to wafer having circuit-forming front surface and back surface to be processed, including complex temporary adhesive material layer that has first temporary adhesive layer composed of thermosetting siloxane polymer layer (A), second temporary adhesive layer composed of thermosetting polymer layer (B), and third temporary adhesive layer composed of thermoplastic resin layer (C), wherein the polymer layer (A) is cured layer of composition containing (A-1) an organopolysiloxane having alkenyl group within its molecule, (A-2) an organopolysiloxane having R103SiO0.5 unit and SiO2 unit, (A-3) organohydrogenpolysiloxane having two or more Si—H groups per molecule, and (A-4) platinum-based catalyst.

Abstract: Provided is a method for continuously producing a cyclic carbonate, by which generation of a glycol in a reaction for synthesizing a cyclic carbonate is suppressed, and a cyclic carbonate having a high purity can be efficiently obtained even by simple purification. A method for continuously producing a cyclic carbonate, including filling a catalyst in a fixed-bed tube reactor, and continuously feeding carbon dioxide and an epoxide to the fixed-bed tube reactor to thereby bringing the carbon dioxide and the epoxide into contact with the catalyst, while continuously withdrawing the reaction liquid in the fixed-bed tube reactor, wherein the method includes a pre-treatment step in which a pre-treatment liquid containing a cyclic carbonate is brought into contact with the catalyst before feeding the carbon dioxide and the epoxide to the fixed-bed tube reactor, and the generated glycol is removed out of the system.

Abstract: Provided is a method for producing a cyclic carbonate obtained by reacting epoxide and carbon dioxide, the method being capable of efficiently producing a cyclic carbonate at a high conversion rate and a high yield, in which degradation of the catalyst over time is suppressed and catalytic activity hardly decreases. A method for producing a cyclic carbonate by reacting epoxide and carbon dioxide in the presence of a quaternary onium salt selected from the group consisting of a quaternary ammonium salt having a halogenated anion as a counter ion and a quaternary phosphonium salt having a halogenated anion as a counter ion, or in the presence of a solid catalyst obtained by immobilizing the quaternary onium salt onto a carrier, wherein an organohalogen compound containing at least one halogen atom in one molecule is added to the reaction system.

Abstract: The invention is adhesive material for a wafer processing used for temporarily bonding a supporting substrate to wafer having a front surface includes circuit formed thereon and a back surface to be processed, including first temporary adhesive layer composed of a layer of a silicone-modified styrene base thermoplastic elastomer, and second temporary adhesive layer composed of a thermosetting polymer layer on first temporary adhesive layer, wherein layer is capable of releasably adhering to front surface of wafer, and layer is capable of releasably adhering to the supporting substrate. Thereby, it provides a temporary adhesive material for wafer processing, wafer processing lamination, and method for manufacturing thin wafer using same, which facilitates temporary adhesion between supporting substrate and wafer having a circuit, is highly compatible with steps of forming TSV and forming wiring on back surface of wafer, allows easy delamination, and is capable of increasing productivity of thin wafers.

Abstract: The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R21R22R23SiO1/2, and a SiO4/2 unit in a molar ratio of R21R22R23SiO1/2 unit/SiO4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support.

Abstract: A glass sheet to be tempered of the present invention is a glass sheet to be tempered having a sheet area of 0.01 m2 or more and a sheet thickness of 1.5 mm or less, in which the glass sheet to be tempered has a maximum value of a retardation in an effective surface measured at an interval of 50 mm of 5.0 nm or less.

Abstract: The present invention provides a method for easily and inexpensively producing a heterogeneous catalyst used to synthesize a cyclic carbonate by reacting an epoxide with carbon dioxide and having excellent catalyst activity; a catalyst obtained using said manufacturing method; and a method for synthesizing a cyclic carbonate using said catalyst. A method for producing a catalyst that is used for the purpose of synthesizing a cyclic carbonate by subjecting to a reaction an epoxide with carbon dioxide, said method comprising the following steps (a) and (b): (a) a step of obtaining a catalyst precursor having a haloalkyl group or a haloaryl group by reacting a silane compound with a silica gel in the presence of xylene, the silane compound having a haloalkyl group or a haloaryl group and (b) a step of obtaining a catalyst for synthesizing a cyclic carbonate by reacting the catalyst precursor obtained in step (a) with a tertiary phosphine.

Abstract: A method of manufacturing a tempered glass sheet of the present invention includes: subjecting a glass sheet to be tempered having a sheet thickness of 2.0 mm or less to ion exchange treatment; and performing heat treatment at a temperature of 50° C. or more and less than a strain point of the glass sheet to be tempered.

Abstract: A mass spectrometry data processing apparatus having a function of displaying a plurality of MSn spectra in an arranged manner is allowed to display these MSn spectra in a state where a user can easily grasp presence or absence of a common neutral loss. A mass spectrometry data processing apparatus 20 that displays, on a display screen, an MSn spectrum resulting from mass spectrometric analysis of n?1 stage dissociation, where n is integer of two or more, of an ion, includes: a precursor ion identifying section 32 configured to identify, for each of a plurality of MSn spectra, a mass-to-charge ratios m/z of a precursor ion from which the MSn spectra are obtained; and a spectrum aligning section 33 configure to display the MSn spectra on the display screen in a vertically arranged manner such that positions of the mass-to-charge ratios m/z of the respective precursor ions are located at a same horizontal position of the display screen.

Abstract: A method for easily producing a heterogeneous catalyst having excellent catalytic activity at a low cost is provided. The heterogeneous catalyst is used for the purpose of synthesizing a cyclic carbonate by reacting an epoxide and carbon dioxide. A catalyst obtained by this production method and a method for synthesizing a cyclic carbonate with use of this catalyst are also provided.

Abstract: Provided are: a method for easily producing a heterogeneous catalyst having excellent catalytic activity at a low cost, said heterogeneous catalyst being used for the purpose of synthesizing a cyclic carbonate by subjecting to a reaction an epoxide and carbon dioxide; a catalyst which is obtained by this production method; and a method for synthesizing a cyclic carbonate with use of this catalyst. A method for producing a catalyst that is used for the purpose of synthesizing a cyclic carbonate by subjecting to a reaction an epoxide with carbon dioxide, said method comprising the following steps (a) and (b): (a) a step of obtaining a catalyst precursor having a haloalkyl group or a haloaryl group, by subjecting to a reaction a silane compound having a haloalkyl group or a haloaryl group and a silica gel having an average pore diameter of from 3.

Abstract: A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer.